Renesas UPD70F3380M2GJA2-GAE-AX

Overview

UPD70F3380M2GJA2-GAE-AX from Renesas Electronics is a 32-bit V850ES/Fx3 single-chip microcontroller featuring 512 KB on-chip Flash memory, 48 KB RAM, and a maximum operating frequency of 40 MHz. It integrates a 10-bit ADC with 24 channels, three 16-bit timer/counters, and supports CAN 2.0B communication. The device targets automotive body control modules and industrial motor control applications requiring deterministic real-time response.

For engineers reviewing the UPD70F3380M2GJA2-GAE-AX datasheet, UPD70F3380M2GJA2-GAE-AX pinout, UPD70F3380M2GJA2-GAE-AX application, or UPD70F3380M2GJA2-GAE-AX equivalent, this page delivers verified technical context, package-specific pin mapping, functional alternatives, and supply-chain readiness for production design-in.

Technical Context

The UPD70F3380M2GJA2-GAE-AX implements the V850ES CPU core with 32-bit RISC architecture, supporting 16/32-bit mixed instruction set and 16-level priority interrupt controller. It includes a PLL-based clock generator with selectable input sources (crystal, external clock, or internal RC), enabling stable operation across 1–40 MHz system clocks.

Peripheral integration includes CAN controller with dedicated message RAM, UART with LIN support, I²C-compatible serial interface, and flexible port configuration with noise-immune digital filtering. Power management features include four power-save modes-HALT, STOP, SNOOZE, and DEEP STANDBY-with wake-up via external interrupt, timer, or CAN activity.

Key Specifications

Pinout & Package

This device is housed in a 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch) package with exposed thermal pad. Pin assignment follows Renesas' V850ES/FJ3 pinout specification, supporting full peripheral multiplexing and noise-suppressed I/O configurations.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with UPD70F3380M2GJA2-GAE-AX, the R5F566TEADFP#30 offers higher compute throughput but requires additional firmware effort for CAN message handling, while the UPD70F3378M2GJA2-GAE-AX provides identical functionality at reduced memory capacity-ideal for legacy code porting or BOM cost reduction.

Availability

UPD70F3380M2GJA2-GAE-AX is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor drives, smart lighting systems, and sensor hub applications requiring stable component supply and long-term manufacturing continuity.

Supply support for UPD70F3380M2GJA2-GAE-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The V850ES/Fx3 product line was designed specifically for cost-sensitive, high-reliability automotive body electronics and industrial control applications demanding CAN connectivity, real-time performance, and extended temperature operation.

FAQ

What is the maximum operating frequency of the UPD70F3380M2GJA2-GAE-AX?

The UPD70F3380M2GJA2-GAE-AX operates at a maximum system clock frequency of 40 MHz, achieved via its integrated PLL clock generator with selectable input sources including external crystal, oscillator, or internal RC. This frequency enables deterministic execution of real-time tasks such as CAN message processing and motor control loops within strict timing budgets.

Does the UPD70F3380M2GJA2-GAE-AX support CAN FD?

No, the UPD70F3380M2GJA2-GAE-AX implements a classical CAN 2.0B controller compliant with ISO 11898-1, supporting data rates up to 1 Mbps and 11-bit standard identifiers. It does not support CAN FD frame format, bit-rate switching, or extended data length. For CAN FD requirements, Renesas' RX72M or RA6T2 families are recommended alternatives.

What package type is used for the UPD70F3380M2GJA2-GAE-AX?

The UPD70F3380M2GJA2-GAE-AX is supplied in a 144-pin LQFP package (20 mm × 20 mm, 0.5 mm pitch) with an exposed thermal pad. This package is pin-compatible with other V850ES/FJ3-series MCUs including UPD70F3378M2GJA2-GAE-AX and UPD70F3385M2GJA2-GAE-AX, enabling scalable design reuse across memory variants.

Is the UPD70F3380M2GJA2-GAE-AX qualified for automotive applications?

Yes, the UPD70F3380M2GJA2-GAE-AX is AEC-Q100 Grade 2 qualified (−40 °C to +105 °C ambient) and rated for operation up to +125 °C junction temperature. It meets automotive reliability standards for body electronics, including EMC immunity, ESD tolerance, and long-term data retention in on-chip Flash memory.

Does the UPD70F3380M2GJA2-GAE-AX include hardware debugging support?

Yes, the UPD70F3380M2GJA2-GAE-AX supports on-chip debug via the JTAG interface with full breakpoint, watchpoint, and trace capabilities. It is compatible with Renesas E2 emulator and CS+ IDE, enabling real-time debugging, flash programming, and memory inspection without requiring external debug probes beyond standard JTAG headers.