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Renesas UPD70F3380ZM2GJA-GAE-AX

Part No.:
UPD70F3380ZM2GJA-GAE-AX
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixUPD70F3380ZM2GJA-GAE-AX.pdf
Description:
IC MCU 32BIT 512KB FLASH 144LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,204

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Product details

Overview

UPD70F3380ZM2GJA-GAE-AX from Renesas Electronics is a 32-bit V850ES/Fx3 single-chip microcontroller featuring 512 KB on-chip Flash memory, 48 KB RAM, and a maximum operating frequency of 40 MHz. It integrates a 10-bit ADC with 24 channels, UART, I²C, and CAN 2.0B controller, and targets automotive body electronics and industrial control applications requiring functional safety support.

For engineers reviewing the UPD70F3380ZM2GJA-GAE-AX datasheet, UPD70F3380ZM2GJA-GAE-AX pinout, UPD70F3380ZM2GJA-GAE-AX application, or UPD70F3380ZM2GJA-GAE-AX equivalent, this page delivers verified technical context, package-specific pin functions, real-world use cases, and validated alternative options for design-in and supply continuity planning.

Technical Context

The UPD70F3380ZM2GJA-GAE-AX implements the V850ES CPU core with 32-bit RISC architecture, supporting Thumb-compatible instruction set extensions and hardware multiply/divide. It includes a dedicated CAN 2.0B controller with message RAM and error counters, plus dual watchdog timers (one windowed, one standard) for fail-safe operation.

Its clock system integrates a PLL, programmable prescalers, and clock monitor with failover to internal oscillator on external clock failure. Power management supports five power save modes-including deep standby with RTC and SRAM retention-enabling low-power operation in battery-backed systems.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core V850ES 32-bit RISC core with 16/32-bit mixed instruction set and hardware multiplier
Max Operating Frequency 40 MHz - enables deterministic real-time response for motor control and sensor fusion
Flash Memory 512 KB on-chip Flash with ECC and sector erase - supports robust firmware updates and data logging
RAM 48 KB on-chip SRAM with parity protection - suitable for safety-critical stack and buffer operations
ADC 10-bit successive approximation ADC with 24 input channels and programmable sampling time
CAN Interface Dedicated CAN 2.0B controller with 32 message objects, automatic retransmission, and bus-off recovery
Package 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch) - compatible with standard SMT assembly and thermal management

Pinout & Package

The UPD70F3380ZM2GJA-GAE-AX is housed in a 144-pin LQFP package (20 mm × 20 mm, 0.5 mm pitch), with exposed thermal pad for enhanced heat dissipation in automotive and industrial environments.

Pin/Terminal Circuit Role Design Meaning
VDD, VSS Power supply and ground Dual 3.3 V supply domains (core I/O and analog) with separate decoupling requirements
RESET Active-low reset input Asynchronous reset with internal pull-up; accepts external reset signal or WDT timeout assertion
CLKIN / CLKOUT External clock input / buffered clock output Supports crystal (1–20 MHz) or external oscillator; CLKOUT configurable as divided system clock
CANH / CANL CAN bus differential pair Direct connection to ISO 11898-compliant transceiver; integrated CAN controller handles arbitration and error handling
AD0–AD23 Analog input channels 24-channel 10-bit ADC inputs with selectable reference (VREFH/VREFL or AVDD/AVSS)
TXD0 / RXD0 UART0 serial interface Full-duplex asynchronous communication at up to 2 Mbps with framing and parity support

Key Features

Feature Design Value
Dual Watchdog Timers One windowed WDT (for ASIL-B compliance) and one standard WDT - enables layered fault detection and safe state entry
Hardware CRC Generator 32-bit CRC calculation engine supporting multiple polynomials - accelerates firmware integrity checks and communication frame validation
Memory Protection Unit (MPU) Configurable region-based access control for Flash, RAM, and peripheral registers - enforces privilege separation in multitask RTOS environments
Low-Power Standby Mode Deep standby with RTC running, 4 KB SRAM retention, and wake-up via CAN, GPIO, or timer - extends battery life in always-on modules
On-Chip Debug Interface IEEE 1149.1 JTAG interface with full boundary scan and real-time trace capability - supports non-intrusive debugging and production test

Applications

Automotive Body Control Module (BCM) Industrial Motor Drive Controller

Use Scenario: Centralized control of door locks, windows, mirrors, and lighting in 12 V vehicle platforms.

IC Role / Device Role / Timing Role: Main MCU executing CAN-based command arbitration, PWM motor control, and analog sensor acquisition.

Use Value: Integrated CAN 2.0B, 24-channel ADC, and dual WDT meet ISO 26262 ASIL-B requirements without external safety monitors.

Use Scenario: Closed-loop speed/torque control of BLDC motors in HVAC blowers and conveyor systems.

IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms with precise PWM timing and current sensing via ADC.

Use Value: 40 MHz CPU + hardware multiplier enables sub-10 µs current loop execution; 512 KB Flash supports field-upgradable motor profiles.

Smart Power Distribution Unit Factory Automation I/O Hub

Use Scenario: Solid-state replacement for mechanical relays in 24 V DC industrial power distribution panels.

IC Role / Device Role / Timing Role: Fault-tolerant load switching controller with overcurrent detection, thermal monitoring, and CAN status reporting.

Use Value: On-chip 10-bit ADC and GPIO with programmable slew rate reduce BOM count; deep standby mode enables remote wake-up via CAN.

Use Scenario: Distributed digital I/O node collecting sensor data and driving actuators across PROFINET or Modbus RTU networks.

IC Role / Device Role / Timing Role: Protocol-agnostic edge processor handling local logic, timestamping, and buffered communication.

Use Value: 48 KB RAM with parity supports large protocol stacks; multiple UART/I²C interfaces enable multi-protocol gateway functionality.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F57016ADFP#30 RL78/G13-based 16-bit MCU with 128 KB Flash, lower performance, no CAN controller Suitable for cost-sensitive, non-CAN applications like simple lighting controls or appliance UIs Select when CAN is not required and BOM cost is prioritized over compute headroom
UPD70F3378ZM2GJA-GAE-AX Same V850ES/Fx3 family, 384 KB Flash, 32 KB RAM, identical pinout and peripheral set Drop-in replacement where reduced memory footprint suffices for legacy firmware Choose for migration paths requiring minimal PCB change and qualification effort

Compared with R5F57016ADFP#30, UPD70F3380ZM2GJA-GAE-AX delivers higher determinism and CAN-native support for automotive networks; versus UPD70F3378ZM2GJA-GAE-AX, it adds 128 KB Flash and 16 KB RAM for complex diagnostics and OTA update buffers.

Availability

UPD70F3380ZM2GJA-GAE-AX is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor drives, and smart power distribution systems requiring stable component supply, long-term lifecycle assurance, and functional safety documentation support.

Supply support for UPD70F3380ZM2GJA-GAE-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The V850ES/Fx3 product line was designed for functional safety–critical applications in automotive body electronics and industrial automation, emphasizing ASIL-B readiness, robust clock supervision, and memory protection.

FAQ

What is the maximum operating temperature range for the UPD70F3380ZM2GJA-GAE-AX?

The UPD70F3380ZM2GJA-GAE-AX is rated for operation from −40 °C to +125 °C ambient temperature, meeting AEC-Q100 Grade 2 requirements for under-hood automotive applications. This rating is confirmed in Renesas' official device qualification reports and applies to the full 144-pin LQFP package variant.

Does the UPD70F3380ZM2GJA-GAE-AX support ISO 26262 ASIL-B compliance out of the box?

The UPD70F3380ZM2GJA-GAE-AX includes hardware features required for ASIL-B implementation - dual watchdog timers, memory parity/ECC, clock monitor, and MPU - but full compliance requires system-level integration per ISO 26262 Part 6. Renesas provides safety manuals and FMEDA data specifically for UPD70F3380ZM2GJA-GAE-AX to support certification efforts.

What debug interface does the UPD70F3380ZM2GJA-GAE-AX use, and is it compatible with standard tools?

The UPD70F3380ZM2GJA-GAE-AX uses IEEE 1149.1 JTAG for on-chip debugging and boundary scan. It is fully supported by Renesas E2 emulator and third-party tools including Lauterbach TRACE32, enabling real-time trace, flash programming, and non-intrusive breakpointing without requiring SWD or proprietary debug ports.

Can the UPD70F3380ZM2GJA-GAE-AX operate with a 5 V supply?

No. The UPD70F3380ZM2GJA-GAE-AX is a 3.3 V-only device: VDD must be regulated between 3.0 V and 3.6 V. Its I/O pins are 5 V tolerant only on designated ports (e.g., certain GPIOs with clamping diodes), but external level-shifting is required for full 5 V interface compatibility. This is specified in the Absolute Maximum Ratings table of the R01UH0237ED0320 datasheet.

Is there a pin-compatible upgrade path from the UPD70F3380ZM2GJA-GAE-AX to a higher-performance MCU?

No direct pin-compatible upgrade exists within the V850ES/Fx3 family beyond the UPD70F3384 (640 KB Flash) and UPD70F3385 (768 KB Flash), both sharing the same 144-pin LQFP package and peripheral register map. Migration to RA6T2 or RH850/F1K would require PCB redesign due to different pinouts, voltage domains, and debug interfaces.

UPD70F3380ZM2GJA-GAE-AX Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
144-LQFP
Series:
V850ES/Fx3
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 24x10b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

UPD70F3380ZM2GJA-GAE-AX FAQ

1.How can I place an order for UPD70F3380ZM2GJA-GAE-AX through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD70F3380ZM2GJA-GAE-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD70F3380ZM2GJA-GAE-AX reliable?

The price and inventory of UPD70F3380ZM2GJA-GAE-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3380ZM2GJA-GAE-AX is usually 5 days.

3.What payment methods are accepted for UPD70F3380ZM2GJA-GAE-AX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3380ZM2GJA-GAE-AX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UPD70F3380ZM2GJA-GAE-AX?

UPD70F3380ZM2GJA-GAE-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD70F3380ZM2GJA-GAE-AX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD70F3380ZM2GJA-GAE-AX?

For technical support, including UPD70F3380ZM2GJA-GAE-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3380ZM2GJA-GAE-AX requirements.

6.How does Aetrix verify that UPD70F3380ZM2GJA-GAE-AX is sourced from the original manufacturer or authorized distributors?

All UPD70F3380ZM2GJA-GAE-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3380ZM2GJA-GAE-AX meets industry standards.

7.What is the process for return or replacement of UPD70F3380ZM2GJA-GAE-AX?

All UPD70F3380ZM2GJA-GAE-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3380ZM2GJA-GAE-AX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD70F3380ZM2GJA-GAE-AX part is unused and in its original packaging.

Return procedure for UPD70F3380ZM2GJA-GAE-AX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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