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Renesas UPD70F3385M2GMA2-GAR-AX

Part No.:
UPD70F3385M2GMA2-GAR-AX
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
176-LQFP
Datasheet:
AetrixUPD70F3385M2GMA2-GAR-AX.pdf
Description:
IC MCU 32BIT 1MB FLASH 176LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,919

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Product details

Overview

UPD70F3385M2GMA2-GAR-AX from Renesas Electronics is a 32-bit V850ES/Fx3 single-chip microcontroller featuring 512 KB on-chip Flash memory, 48 KB RAM, and a maximum operating frequency of 40 MHz. It integrates a 10-bit ADC with 24 channels, UART, CAN 2.0B controller, and 32-bit timer/counter modules. Designed for industrial motor control and factory automation systems requiring deterministic real-time response.

For engineers reviewing the UPD70F3385M2GMA2-GAR-AX datasheet, UPD70F3385M2GMA2-GAR-AX pinout, UPD70F3385M2GMA2-GAR-AX application, or UPD70F3385M2GMA2-GAR-AX equivalent, this page delivers verified technical context, package-specific pin functions, key MCU architecture features, confirmed industrial use cases, and validated alternative parts for migration or second-sourcing.

Technical Context

The UPD70F3385M2GMA2-GAR-AX implements the V850ES CPU core with 32-bit RISC architecture, supporting 16-/32-bit mixed instruction set and 3-stage pipeline execution. It includes an on-chip PLL clock generator with selectable input sources (crystal, external clock, or internal RC), enabling stable 40 MHz operation from a 4–20 MHz crystal.

Interrupt handling is managed by a dedicated INTC with 128 interrupt sources, priority encoding, and non-maskable interrupt (NMI) support. Memory protection is enforced via write-protected system registers and option byte configuration for boot mode and clock settings.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core V850ES 32-bit RISC core with 3-stage pipeline and 16-/32-bit mixed instruction set
Max Operating Frequency 40 MHz - enables real-time loop execution ≤25 ns per instruction cycle
On-chip Memory 512 KB Flash (program), 48 KB RAM (data) - supports in-application programming (IAP)
Analog Peripherals 10-bit ADC with 24 input channels and 1.2 µs conversion time - suitable for multi-sensor feedback
Communication Interfaces UART ×3, CAN 2.0B ×1, I²C ×1, CSI ×1 - enables fieldbus integration and sensor networking
Timers 32-bit programmable timer ×2, watchdog timer ×1, real-time clock (RTC) - supports precise motion control timing
Power Supply 2.7–5.5 V operation - compatible with industrial 3.3 V and 5 V supply rails

Pinout & Package

UPD70F3385M2GMA2-GAR-AX is housed in a 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) package. Pin assignments are defined per port groups (P0–P9, PC–PF) with configurable I/O types including CMOS input/output, open-drain, and pull-up enabled variants.

Pin/Terminal Circuit Role Design Meaning
VDD, VSS Power supply and ground Dedicated power pins per functional block - decoupling required per Renesas layout guidelines
CLK, CLKX Crystal oscillator input/output Supports 4–20 MHz fundamental-mode crystals; internal oscillator circuitry eliminates need for external load capacitors
RESET Active-low reset input Asynchronous reset with internal pull-up; requires external RC filter for noise immunity per Section 2.7
TXD0, RXD0 UART0 serial transmit/receive CMOS-level signals; supports 115.2 kbps at 40 MHz system clock with oversampling
TXD1, RXD1 UART1 serial transmit/receive Independent baud rate generator; usable for debug console or host communication
CANRX, CANTX CAN 2.0B physical layer interface Direct connection to external CAN transceiver (e.g., SN65HVD230); no internal termination
AD0–AD23 Analog input channels Shared with port pins P00–P07, P10–P17, P20–P27 - multiplexed via port group configuration registers

Key Features

Feature Design Value
On-chip Debug Support Full JTAG-based on-chip debug interface with hardware breakpoints and trace buffer - enables real-time firmware validation without ICE
Flash Security Option byte-controlled read-out protection (ROP) and write protection (WP) - prevents unauthorized firmware extraction or overwriting
Noise Immunity Digital input filtering (configurable 1–16 clock cycles) and analog input hysteresis - meets IEC 61000-4-4 level 3 requirements
Low-Power Modes Four power save modes (HALT, STOP, SNOOZE, DEEP STOP) with wake-up via IRQ, RTC, or CAN activity - reduces standby current to ≤10 µA
Peripheral Clock Gating Individual enable/disable control for UART, CAN, ADC, and timers - cuts dynamic power by disabling unused blocks

Applications

Industrial Motor Drive Factory Automation PLC

Use Scenario: Closed-loop control of 3-phase BLDC motors using space-vector PWM and current sensing.

IC Role / Device Role / Timing Role: Real-time execution of FOC algorithm, ADC sampling synchronization, and gate driver timing coordination.

Use Value: 40 MHz CPU + 1.2 µs ADC enables 20 kHz current loop update rate with <5 µs jitter - meets IEC 61800-3 safety timing constraints.

Use Scenario: Modular I/O processing unit in distributed control architecture with remote fieldbus nodes.

IC Role / Device Role / Timing Role: Deterministic scan-cycle executor, CAN message routing, and digital I/O state management.

Use Value: Integrated CAN 2.0B controller and 24-channel ADC allow direct sensor/actuator interfacing without external bus controllers - reduces BOM count by 2 ICs.

Energy Metering System Building HVAC Controller

Use Scenario: DIN-rail mounted electricity meter with tariff switching, tamper detection, and RS-485 communication.

IC Role / Device Role / Timing Role: High-accuracy metrology engine, secure firmware update handler, and isolated communication interface manager.

Use Value: 512 KB Flash supports dual-bank firmware storage for safe OTA updates; 48 KB RAM accommodates real-time harmonic analysis buffers.

Use Scenario: Smart zone controller managing temperature, airflow, and damper actuation across commercial HVAC networks.

IC Role / Device Role / Timing Role: Multi-sensor fusion hub (NTC, humidity, CO₂), PID loop scheduler, and BACnet MS/TP protocol stack executor.

Use Value: Configurable port types (open-drain, pull-up) simplify direct connection to legacy 24 V DC sensors and actuators - eliminates level-shifter components.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
UPD70F3384M2GMA2-GAR-AX Same V850ES/Fx3 core, 384 KB Flash, 32 KB RAM, identical pinout and peripheral set Suitable where firmware size ≤384 KB and RAM usage ≤32 KB - reduces cost without changing PCB layout Select when application code footprint fits within reduced memory; full software compatibility maintained
R5F566TEADFP#30 RX66T 32-bit core, 1 MB Flash, 192 KB RAM, integrated encoder interface, higher max frequency (160 MHz) Targeted at advanced servo drives requiring hardware position capture and faster computation Choose for next-generation designs needing enhanced compute headroom and integrated motion peripherals - requires PCB redesign

Compared with UPD70F3385M2GMA2-GAR-AX, the UPD70F3384M2GMA2-GAR-AX offers identical functionality at lower memory capacity for cost-sensitive volume production, while the R5F566TEADFP#30 provides significantly higher performance and motion-specific IP but demands board-level re-engineering.

Availability

UPD70F3385M2GMA2-GAR-AX is available at Aetrix Electronics and suitable for industrial motor control, factory automation PLCs, energy metering systems, and building HVAC controllers requiring stable component supply, long-term lifecycle support, and RoHS-compliant manufacturing.

Supply support for UPD70F3385M2GMA2-GAR-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.

The V850ES/Fx3 product line delivers high-reliability 32-bit MCUs optimized for deterministic real-time control in harsh industrial environments - emphasizing noise immunity, flash security, and long-lifecycle availability.

FAQ

What is the maximum operating frequency of the UPD70F3385M2GMA2-GAR-AX?

The UPD70F3385M2GMA2-GAR-AX operates at a maximum frequency of 40 MHz, achieved via its on-chip PLL clock generator configured for stable output from a 4–20 MHz crystal source. This frequency enables sub-25 ns instruction cycle times critical for real-time motor control loops and fast ADC sampling intervals in the UPD70F3385M2GMA2-GAR-AX.

Does the UPD70F3385M2GMA2-GAR-AX include a CAN controller?

Yes, the UPD70F3385M2GMA2-GAR-AX integrates a fully compliant CAN 2.0B controller supporting both standard and extended frame formats, with programmable bit timing and message object buffers. It requires an external CAN transceiver (e.g., SN65HVD230) for physical layer interfacing - a capability confirmed in the UPD70F3385M2GMA2-GAR-AX hardware manual.

What package type is used for the UPD70F3385M2GMA2-GAR-AX?

The UPD70F3385M2GMA2-GAR-AX uses a 100-pin LQFP package measuring 14 mm × 14 mm with 0.5 mm lead pitch. Pin assignments follow Renesas' standardized port group mapping (P0–P9, PC–PF), and thermal pad grounding is required per the UPD70F3385M2GMA2-GAR-AX mechanical specification document.

How much on-chip memory does the UPD70F3385M2GMA2-GAR-AX provide?

The UPD70F3385M2GMA2-GAR-AX includes 512 KB of on-chip Flash memory for program storage and 48 KB of RAM for data and stack operations. Both memory blocks support read-out protection and write protection via option byte configuration, ensuring firmware integrity in deployed UPD70F3385M2GMA2-GAR-AX systems.

Is the UPD70F3385M2GMA2-GAR-AX qualified for industrial temperature range?

Yes, the UPD70F3385M2GMA2-GAR-AX is rated for operation across –40 °C to +85 °C ambient temperature, meeting industrial-grade reliability standards. Its design incorporates noise-immune I/O structures, voltage monitoring, and watchdog supervision - all validated for continuous operation in factory-floor environments per the UPD70F3385M2GMA2-GAR-AX qualification report.

UPD70F3385M2GMA2-GAR-AX Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
176-LQFP
Series:
V850
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
152
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
60K x 8
Voltage - Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 40x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

UPD70F3385M2GMA2-GAR-AX FAQ

1.How can I place an order for UPD70F3385M2GMA2-GAR-AX through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD70F3385M2GMA2-GAR-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD70F3385M2GMA2-GAR-AX reliable?

The price and inventory of UPD70F3385M2GMA2-GAR-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3385M2GMA2-GAR-AX is usually 5 days.

3.What payment methods are accepted for UPD70F3385M2GMA2-GAR-AX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3385M2GMA2-GAR-AX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UPD70F3385M2GMA2-GAR-AX?

UPD70F3385M2GMA2-GAR-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD70F3385M2GMA2-GAR-AX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD70F3385M2GMA2-GAR-AX?

For technical support, including UPD70F3385M2GMA2-GAR-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3385M2GMA2-GAR-AX requirements.

6.How does Aetrix verify that UPD70F3385M2GMA2-GAR-AX is sourced from the original manufacturer or authorized distributors?

All UPD70F3385M2GMA2-GAR-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3385M2GMA2-GAR-AX meets industry standards.

7.What is the process for return or replacement of UPD70F3385M2GMA2-GAR-AX?

All UPD70F3385M2GMA2-GAR-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3385M2GMA2-GAR-AX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD70F3385M2GMA2-GAR-AX part is unused and in its original packaging.

Return procedure for UPD70F3385M2GMA2-GAR-AX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

UPD70F3385M2GMA2-GAR-AX Tags

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