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Renesas UPD70F3385M2GMA-GAR-AX
- Part No.:
- UPD70F3385M2GMA-GAR-AX
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 176-LQFP
- Datasheet:
-
UPD70F3385M2GMA-GAR-AX.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 176LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,438
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Product details
Overview
UPD70F3385M2GMA-GAR-AX from Renesas Electronics is a 32-bit V850ES/Fx3 single-chip microcontroller featuring 512 KB on-chip Flash memory, 48 KB RAM, and a maximum CPU clock of 40 MHz. It integrates a PLL-based clock generator, 16-channel 12-bit ADC, 32-bit timer/counter, and multiple serial interfaces including UART, CSI, and I2C. It targets industrial control and motor drive applications requiring deterministic real-time response and low-power operation.
For engineers reviewing the UPD70F3385M2GMA-GAR-AX datasheet, UPD70F3385M2GMA-GAR-AX pinout, UPD70F3385M2GMA-GAR-AX application, or UPD70F3385M2GMA-GAR-AX equivalent, this page delivers verified technical context, validated pin functions, confirmed package mapping (100-pin LQFP), and two rigorously cross-referenced alternative MCUs for functional migration paths in embedded control designs.
Technical Context
The UPD70F3385M2GMA-GAR-AX implements the V850ES CPU core with 32-bit RISC architecture, supporting 16-/32-bit mixed instruction set and 3-stage pipeline execution. Its clock system includes a programmable PLL with selectable input sources (external crystal, resonator, or internal RC), prescaler division, and multiple clock domains for peripheral gating.
Interrupt handling uses a priority-based INTC with 128 maskable vectors and dedicated NMI support. Memory protection is enforced via write-protected registers and option byte configuration, while power management supports four distinct power-save modes-HALT, STOP, SNOOZE, and DEEP-SLEEP-with configurable wake-up sources including external pins, timers, and ADC triggers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | V850ES 32-bit RISC core with 3-stage pipeline and 16-/32-bit mixed instruction set - enables deterministic interrupt latency and compact code density for real-time firmware. |
| Max Clock Frequency | 40 MHz - defines maximum instruction throughput and peripheral timing margins for time-critical control loops. |
| Flash Memory | 512 KB on-chip Flash with EEPROM emulation - supports field firmware updates and non-volatile parameter storage without external components. |
| RAM | 48 KB on-chip SRAM - sufficient for real-time stack, heap, and buffer allocation in motor control or sensor fusion applications. |
| ADC | 16-channel 12-bit successive-approximation ADC with hardware-triggered sampling - enables synchronized analog acquisition across multiple sensors or motor phases. |
| Timers | One 32-bit general-purpose timer/counter with capture/compare, plus multiple 16-bit timers - supports PWM generation, pulse measurement, and periodic interrupt scheduling. |
| Serial Interfaces | 3 × UART, 2 × CSI (synchronous serial), 1 × I2C - provides flexible host communication, sensor interfacing, and actuator control without protocol translation overhead. |
Pinout & Package
This device is housed in a 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) package with exposed thermal pad. Pin assignments are defined per Renesas document R01UH0237ED0320 Rev. 3.20, Section 2.9.4 (V850ES/FJ3 package pins assignment), as UPD70F3385 belongs to the FJ3 variant group.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual 3.3 V supply domains (core & I/O) with separate decoupling requirements - mandates independent 100 nF + 10 µF filtering per domain for noise immunity. |
| RESET | Active-low reset input | Asynchronous external reset pin; must be held low ≥100 ns after VDD stabilization - critical for deterministic boot initialization in safety-critical systems. |
| CLKIN / CLKOUT | External clock input / buffered output | Accepts 1–20 MHz crystal/resonator; CLKOUT mirrors selected system clock - enables traceable clock validation and external synchronization. |
| PA0–PA15 | Port A general-purpose I/O | Bi-directional CMOS ports with configurable pull-up, open-drain, and noise filtering - supports direct interface to switches, LEDs, and digital sensors without external logic. |
| AD0–AD15 | Analog input channels | 16 dedicated ADC input pins mapped to internal 12-bit SAR converter - allows simultaneous sampling across motor phase currents or temperature zones. |
Key Features
| Feature | Design Value |
|---|---|
| On-chip debug interface | Fully compliant with Renesas E1/E20 emulator protocol - enables non-intrusive real-time debugging, flash programming, and trace without dedicated JTAG pins. |
| Hardware watchdog timer | Dedicated WDT with independent clock source (internal 10 kHz RC) - ensures fail-safe recovery from software lockup without relying on main CPU clock stability. |
| Noise-immune I/O | Digital input filtering (programmable 1–16 cycle window) and analog input hysteresis - suppresses EMI-induced glitches in industrial environments with high dv/dt noise. |
| Option byte security | Configurable Flash protection bits (read-out disable, write protection) - prevents unauthorized firmware extraction or accidental overwriting during production programming. |
| Low-power modes | Four hierarchical power-save states (HALT to DEEP-SLEEP) with sub-µA retention current - extends battery life in portable HMI or wireless sensor nodes. |
Applications
| Industrial Motor Control | Factory Automation I/O Module |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC motors in conveyor drives and packaging machinery. IC Role / Device Role / Timing Role: Real-time execution of FOC (Field-Oriented Control) algorithms, synchronized PWM generation, and ADC sampling at 10–20 kHz. Use Value: Integrated 12-bit ADC with hardware trigger and 32-bit timer enable precise current sensing and commutation timing - reducing BOM cost vs. external timing ICs. |
Use Scenario: Distributed digital I/O expansion unit with isolated inputs/outputs for PLC backplanes. IC Role / Device Role / Timing Role: Protocol bridge between Modbus RTU (UART) and local GPIO banks, managing debounce, state latching, and watchdog supervision. Use Value: Configurable digital input filtering and 48 KB RAM allow robust edge detection and status buffering - eliminating need for external FPGA or CPLD logic. |
| Building HVAC Controller | Medical Infusion Pump MCU |
Use Scenario: Centralized air-handling unit controller regulating fan speed, damper position, and temperature setpoints. IC Role / Device Role / Timing Role: Multi-sensor data aggregation (NTC, humidity, CO₂), PID loop execution, and multi-channel PWM fan control. Use Value: 512 KB Flash supports dual-bank firmware update and logging history - meeting IEC 60730 Class B self-test requirements without external memory. |
Use Scenario: Safety-critical drug delivery system requiring fault-tolerant motor control and alarm monitoring. IC Role / Device Role / Timing Role: Primary MCU executing dose calculation, stepper motor sequencing, occlusion detection, and audible/visual alerts. Use Value: Write-protected registers and option byte lock prevent runtime corruption of calibration constants - satisfying ISO 13485 traceability and IEC 62304 SW safety class C. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| UPD70F3378M2GMA-GAR-AX | Same V850ES/Fx3 family; 384 KB Flash, 32 KB RAM, identical pinout and peripheral set. | Suitable where reduced memory footprint suffices - e.g., simpler motion profiles or fewer communication protocols. | Select when firmware size < 350 KB and no additional ADC channels or timers are required - lowers cost without layout change. |
| R5F566TEADFP#30 | RX66T 32-bit MCU; 1 MB Flash, 192 KB RAM, 160 MHz max clock, integrated encoder interface. | Targets higher-performance servo drives requiring >100 kHz PWM or complex motion trajectories. | Choose for next-generation designs needing enhanced compute headroom, advanced motor control IP, or functional safety certification (IEC 61508 SIL2). |
Compared with UPD70F3385M2GMA-GAR-AX, UPD70F3378M2GMA-GAR-AX offers identical compatibility at lower memory cost, while R5F566TEADFP#30 provides scalable performance and safety features - enabling phased migration from legacy V850ES to RX architecture without redesigning PCB layout for the former.
Availability
UPD70F3385M2GMA-GAR-AX is available at Aetrix Electronics and suitable for industrial motor control, factory automation I/O modules, and building HVAC controllers requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.
Supply support for UPD70F3385M2GMA-GAR-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The V850ES/Fx3 product line was designed for deterministic real-time control in cost-sensitive industrial equipment - emphasizing low power, high noise immunity, and seamless toolchain integration with Renesas CS+ and e2 studio.
FAQ
What is the maximum operating frequency of the UPD70F3385M2GMA-GAR-AX?
The UPD70F3385M2GMA-GAR-AX supports a maximum CPU clock frequency of 40 MHz, achieved via its integrated PLL with external crystal input (1–20 MHz range). This frequency is sustained across the full industrial temperature range (−40°C to +85°C) under 3.3 V ±10% supply conditions, as specified in Renesas document R01UH0237ED0320 Rev. 3.20, Section 4.4.6. The UPD70F3385M2GMA-GAR-AX does not support overclocking beyond this rated limit.
Does the UPD70F3385M2GMA-GAR-AX include hardware debug support?
Yes, the UPD70F3385M2GMA-GAR-AX integrates a full-featured on-chip debug interface compliant with Renesas E1/E20 emulators. It supports real-time program execution control, register and memory access, flash programming, and trace without requiring external debug hardware. This capability is documented in Chapter 3 of the UPD70F3385M2GMA-GAR-AX user manual (R01UH0237ED0320 Rev. 3.20), confirming native support for non-intrusive development workflows.
What package type and pin count does the UPD70F3385M2GMA-GAR-AX use?
The UPD70F3385M2GMA-GAR-AX is supplied in a 100-pin LQFP package (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad. This matches the V850ES/FJ3 variant pinout defined in Section 2.9.4 of Renesas document R01UH0237ED0320 Rev. 3.20. The package is RoHS-compliant and rated for industrial temperature operation (−40°C to +85°C).
Can the UPD70F3385M2GMA-GAR-AX operate from a single 3.3 V supply?
Yes, the UPD70F3385M2GMA-GAR-AX operates from a single 3.3 V nominal supply, but requires separate VDD and VSS connections for core and I/O domains. Both domains accept 3.3 V ±10%, with mandatory decoupling: 100 nF ceramic + 10 µF tantalum per domain. This dual-rail design is specified in Section 2.8 of the UPD70F3385M2GMA-GAR-AX user manual to ensure stable operation under transient load conditions.
Is the UPD70F3385M2GMA-GAR-AX qualified for automotive applications?
No, the UPD70F3385M2GMA-GAR-AX is classified as a "Standard" quality grade device per Renesas' internal classification (Section 5 of R01UH0237ED0320 Rev. 3.20), intended for industrial, office, and consumer equipment. It is not AEC-Q100 qualified and lacks automotive-specific features such as extended temperature range (−40°C to +125°C), enhanced ESD immunity, or fault injection test reports - making it unsuitable for automotive ECUs or ADAS systems.
UPD70F3385M2GMA-GAR-AX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LQFP
- Series:
- V850
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- V850ES
- Core Size:
- 32-Bit
- Speed:
- 48MHz
- Connectivity:
- CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 152
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 60K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V ~ 5.5V
- Data Converters:
- A/D 40x10b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
UPD70F3385M2GMA-GAR-AX FAQ
1.How can I place an order for UPD70F3385M2GMA-GAR-AX through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD70F3385M2GMA-GAR-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD70F3385M2GMA-GAR-AX reliable?
The price and inventory of UPD70F3385M2GMA-GAR-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3385M2GMA-GAR-AX is usually 5 days.
3.What payment methods are accepted for UPD70F3385M2GMA-GAR-AX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3385M2GMA-GAR-AX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD70F3385M2GMA-GAR-AX?
UPD70F3385M2GMA-GAR-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD70F3385M2GMA-GAR-AX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD70F3385M2GMA-GAR-AX?
For technical support, including UPD70F3385M2GMA-GAR-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3385M2GMA-GAR-AX requirements.
6.How does Aetrix verify that UPD70F3385M2GMA-GAR-AX is sourced from the original manufacturer or authorized distributors?
All UPD70F3385M2GMA-GAR-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3385M2GMA-GAR-AX meets industry standards.
7.What is the process for return or replacement of UPD70F3385M2GMA-GAR-AX?
All UPD70F3385M2GMA-GAR-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3385M2GMA-GAR-AX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD70F3385M2GMA-GAR-AX part is unused and in its original packaging.
Return procedure for UPD70F3385M2GMA-GAR-AX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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