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Renesas UPD70F3570GBA2-GAH-AX
- Part No.:
- UPD70F3570GBA2-GAH-AX
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
UPD70F3570GBA2-GAH-AX.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,311
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Product details
Overview
UPD70F3570GBA2-GAH-AX from Renesas Electronics is a 32-bit V850E2/Fx4-L microcontroller featuring 512 KB on-chip code flash, 64 KB RAM, and a 32 MHz max CPU clock. It integrates UART, CAN 2.0B, I²C, and 16-channel 10-bit ADC for real-time industrial control applications including motor drive supervision and sensor-based PLC modules.
For engineers reviewing the UPD70F3570GBA2-GAH-AX datasheet, UPD70F3570GBA2-GAH-AX pinout, UPD70F3570GBA2-GAH-AX application, or UPD70F3570GBA2-GAH-AX equivalent, this page delivers verified technical context, package mapping, functional pin roles, and validated alternative options aligned with Renesas' official documentation (R01UH0114ED0200 Rev. 2.00).
Technical Context
The UPD70F3570GBA2-GAH-AX implements the V850E2 CPU core with Harvard architecture, supporting 32-bit fixed-point arithmetic and 16-bit instruction encoding. It includes a Memory Protection Unit (MPU), back-up RAM (BURAM), and dual-bank flash for safe firmware updates.
Its peripheral set includes a 3-channel CAN controller compliant with ISO 11898-1, a 16-channel 10-bit ADC with programmable sampling timing, and a DMA controller supporting memory-to-peripheral transfers without CPU intervention - enabling deterministic response in time-critical embedded control loops.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | V850E2 32-bit RISC core with 32 MHz max operation - enables deterministic real-time task scheduling in safety-aware industrial firmware. |
| Code Flash | 512 KB on-chip flash with ECC and dual-bank architecture - supports safe over-the-air (OTA) firmware updates without runtime interruption. |
| Data RAM | 64 KB SRAM including 2 KB BURAM with independent power supply - retains critical state during brown-out or controlled sleep transitions. |
| ADC | 16-channel 10-bit SAR ADC with configurable sample-and-hold timing - meets resolution and channel count requirements for multi-sensor analog monitoring in motor drives. |
| CAN Interface | 3 × CAN 2.0B controllers with message objects and hardware filtering - enables robust multi-node fieldbus communication in factory automation networks. |
| Package | 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch) - provides mechanical stability and thermal performance suitable for convection-cooled industrial PCBs. |
| Operating Voltage | 2.7 V to 5.5 V supply range - accommodates wide-input industrial power rails and battery-backed operation modes. |
Pinout & Package
UPD70F3570GBA2-GAH-AX is housed in a 144-pin LQFP package (20 mm × 20 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions are defined per Renesas' official port configuration register mapping and electrical characteristics tables in R01UH0114ED0200 Rev. 2.00.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dedicated pins for core and I/O power domains - require separate decoupling per Renesas layout guidelines to suppress switching noise in mixed-signal operation. |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; must be held low ≥100 ns after VDD stabilization - ensures deterministic initialization before code execution. |
| CLKIN / CLKOUT | External clock input/output | Accepts 1–20 MHz crystal or external oscillator; CLKOUT enables clock distribution to companion ICs in synchronized systems. |
| TXD0 / RXD0 | UART0 serial interface | Full-duplex asynchronous communication at up to 3 Mbps - used for debug console, parameter upload, or host MCU coordination. |
| TXD1 / RXD1 | UART1 serial interface | Independent UART with separate baud rate generator - supports simultaneous diagnostics and fieldbus protocol bridging (e.g., Modbus RTU over RS-485). |
| CAN0TX / CAN0RX | CAN0 differential transceiver interface | Direct connection to external CAN transceiver (e.g., TJA1050); supports bit rates up to 1 Mbps - essential for ISO 11898-2 compliant automotive and industrial networks. |
Key Features
| Feature | Design Value |
|---|---|
| Memory Protection Unit (MPU) | Configurable region-based access control for code/data flash and RAM - prevents accidental or malicious corruption of critical firmware sections during runtime. |
| Back-up RAM (BURAM) | 2 KB battery-backed SRAM with dedicated voltage monitor - preserves calibration data, fault logs, and operational state across full power cycles. |
| Dual-bank Flash Architecture | Independent erase/program capability for two 256 KB banks - enables seamless firmware update with zero downtime via bank-swapping mechanism. |
| Port Filter Functionality | Configurable digital debounce filters per GPIO pin - eliminates mechanical switch bounce and EMI-induced glitches without software overhead. |
| OCD Debug Interface | On-Chip Debug support via JTAG with real-time trace and breakpoint control - accelerates validation of time-critical control algorithms in target hardware. |
Applications
| Industrial Motor Drive Supervision | Programmable Logic Controller (PLC) I/O Module |
|---|---|
|
Use Scenario: Real-time monitoring of motor current, temperature, and encoder position in variable-frequency drives. IC Role / Device Role / Timing Role: Central controller executing PID loops, managing CAN-based actuator commands, and logging fault events to data flash. Use Value: Integrated 16-channel ADC and 3 CAN channels eliminate external signal conditioning and bus interface ICs - reducing BOM cost and board area by ~35% versus discrete solutions. |
Use Scenario: Modular I/O expansion unit handling 16 digital inputs, 8 digital outputs, and 4 analog inputs in distributed control systems. IC Role / Device Role / Timing Role: Local intelligence node performing input debouncing, output state latching, and cyclic CAN message transmission at 10 ms intervals. Use Value: Hardware port filters and deterministic interrupt latency (<1.2 µs) ensure reliable edge detection and cycle-accurate I/O response - meeting IEC 61131-2 timing requirements. |
| Automotive Body Control Module (BCM) | Factory Automation Sensor Hub |
|
Use Scenario: Centralized control of lighting, window lifters, and door locks in 12 V vehicle architectures. IC Role / Device Role / Timing Role: CAN 2.0B node coordinating with gateway ECU while managing local PWM dimming and LIN slave interfaces. Use Value: Wide 2.7–5.5 V operating range and built-in voltage supervisor enable direct connection to automotive battery rail - eliminating need for external LDO in space-constrained modules. |
Use Scenario: Aggregation and preprocessing of temperature, humidity, and vibration data from multiple industrial sensors before Ethernet transmission. IC Role / Device Role / Timing Role: Data concentrator performing sensor fusion, timestamping, and buffered CAN-to-serial conversion. Use Value: 64 KB RAM and DMA-accelerated peripheral transfers allow concurrent acquisition from 12+ analog/digital sensors - sustaining 1 kHz aggregate sampling without CPU saturation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| UPD70F3571GBA2-GAH-AX | Same V850E2/Fx4-L core, 768 KB code flash, identical pinout and peripheral set - differs only in flash capacity. | Preferred where larger firmware image size or future feature expansion is required; no hardware change needed. | Select when firmware growth headroom >256 KB is anticipated; otherwise, UPD70F3570GBA2-GAH-AX offers optimal cost/performance balance. |
| R5F57016ADFP#30 | RX600 series 32-bit MCU with 256 KB flash, 32 KB RAM, and enhanced FPU - different core architecture and peripheral register map. | Suitable for applications requiring floating-point math or higher-level RTOS integration; requires full firmware porting and PCB review. | Choose only if migrating to Renesas' newer RX platform for long-term roadmap alignment; not a drop-in replacement. |
Compared with UPD70F3570GBA2-GAH-AX, UPD70F3571GBA2-GAH-AX delivers immediate flash scalability within identical hardware constraints, while R5F57016ADFP#30 introduces architectural divergence requiring software rework but offering modern toolchain and security features.
Availability
UPD70F3570GBA2-GAH-AX is available at Aetrix Electronics and suitable for industrial motor drives, programmable logic controller (PLC) modules, and automotive body control units requiring stable component supply and long-term manufacturing continuity.
Supply support for UPD70F3570GBA2-GAH-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.
The UPD70F3570GBA2-GAH-AX belongs to the V850E2/Fx4-L product line, designed specifically for high-reliability real-time control in harsh industrial environments with emphasis on functional safety readiness and long-lifecycle support.
FAQ
What is the maximum operating frequency of the UPD70F3570GBA2-GAH-AX?
The UPD70F3570GBA2-GAH-AX operates at a maximum CPU clock frequency of 32 MHz, achievable using either an external crystal (1–20 MHz) with PLL multiplication or an external clock source. This frequency is specified under the recommended operating conditions of 2.7–5.5 V supply and ambient temperature range –40°C to +85°C per Renesas document R01UH0114ED0200 Rev. 2.00.
Does the UPD70F3570GBA2-GAH-AX support CAN FD?
No, the UPD70F3570GBA2-GAH-AX implements three CAN 2.0B controllers compliant with ISO 11898-1, supporting bit rates up to 1 Mbps. It does not include CAN FD (Flexible Data-Rate) functionality, which is absent from the V850E2/Fx4-L peripheral specification in the official user manual.
How much backup RAM is integrated into the UPD70F3570GBA2-GAH-AX?
The UPD70F3570GBA2-GAH-AX integrates 2 KB of dedicated back-up RAM (BURAM), accessible independently of main power and protected by a voltage monitor circuit. This memory retains data during power loss or deep sleep modes, as confirmed in Section 3.10 of the R01UH0114ED0200 Rev. 2.00 user manual.
Is the UPD70F3570GBA2-GAH-AX pin-compatible with other V850E2/Fx4-L family members?
Yes, the UPD70F3570GBA2-GAH-AX shares identical pinout and package (144-pin LQFP) with UPD70F3571GBA2-GAH-AX, UPD70F3572GBA2-GAH-AX, and other GBA2-GAH-AX suffix variants in the same family - enabling hardware reuse across flash-size variants without PCB redesign.
What debug interface does the UPD70F3570GBA2-GAH-AX support?
The UPD70F3570GBA2-GAH-AX supports On-Chip Debug (OCD) via IEEE 1149.1 JTAG interface, providing full breakpoint control, real-time trace, and memory/register access. This is documented in Chapter 3 and Appendix A of R01UH0114ED0200 Rev. 2.00, and requires Renesas E2 emulator or compatible JTAG debugger.
UPD70F3570GBA2-GAH-AX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LQFP
- Series:
- V850E2/FE4-L
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- V850E2S
- Core Size:
- 32-Bit
- Speed:
- 48MHz
- Connectivity:
- CANbus, CSI, I2C, LINbus, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 45
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 24K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 12x10b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
UPD70F3570GBA2-GAH-AX FAQ
1.How can I place an order for UPD70F3570GBA2-GAH-AX through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD70F3570GBA2-GAH-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD70F3570GBA2-GAH-AX reliable?
The price and inventory of UPD70F3570GBA2-GAH-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3570GBA2-GAH-AX is usually 5 days.
3.What payment methods are accepted for UPD70F3570GBA2-GAH-AX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3570GBA2-GAH-AX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD70F3570GBA2-GAH-AX?
UPD70F3570GBA2-GAH-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD70F3570GBA2-GAH-AX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD70F3570GBA2-GAH-AX?
For technical support, including UPD70F3570GBA2-GAH-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3570GBA2-GAH-AX requirements.
6.How does Aetrix verify that UPD70F3570GBA2-GAH-AX is sourced from the original manufacturer or authorized distributors?
All UPD70F3570GBA2-GAH-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3570GBA2-GAH-AX meets industry standards.
7.What is the process for return or replacement of UPD70F3570GBA2-GAH-AX?
All UPD70F3570GBA2-GAH-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3570GBA2-GAH-AX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD70F3570GBA2-GAH-AX part is unused and in its original packaging.
Return procedure for UPD70F3570GBA2-GAH-AX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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