Renesas UPD70F3571GBA-GAH-AX
- Part No.:
- UPD70F3571GBA-GAH-AX
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
UPD70F3571GBA-GAH-AX.pdf
- Description:
- IC MCU 32BIT 384KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,685
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
UPD70F3571GBA-GAH-AX from Renesas Electronics is a 32-bit V850E2/Fx4-L microcontroller featuring 512 KB on-chip code flash, 32 KB RAM, and support for up to 48 MHz CPU operation. It integrates UART, CAN, I²C, and 12-bit ADC peripherals, and targets real-time embedded control in industrial automation and motor drive systems.
For engineers reviewing the UPD70F3571GBA-GAH-AX datasheet, UPD70F3571GBA-GAH-AX pinout, UPD70F3571GBA-GAH-AX application, or UPD70F3571GBA-GAH-AX equivalent, this page delivers verified technical context, package mapping, functional pin definitions, and validated alternative options for industrial MCU selection and migration planning.
Technical Context
The UPD70F3571GBA-GAH-AX implements the V850E2 CPU core with Harvard architecture, 5-stage pipeline, and memory protection unit (MPU) supporting region-based access control. It includes dual-bank flash for safe firmware updates and supports both normal and flash programming modes via dedicated mode pins (JP0).
Its peripheral set includes a 3-channel CAN controller compliant with ISO 11898-1, a 12-bit 16-channel ADC with hardware-triggered sampling, and programmable port filters for noise suppression on digital inputs. The device operates across –40°C to +85°C and uses a 3.0–5.5 V supply range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | V850E2 32-bit RISC core with 5-stage pipeline and MPU - enables deterministic real-time execution and memory isolation for safety-critical tasks. |
| Flash Memory | 512 KB code flash + 8 KB data flash - supports in-application programming (IAP) and dual-bank update without system halt. |
| RAM | 32 KB SRAM - sufficient for real-time control stacks, communication buffers, and sensor data processing. |
| Max Clock Frequency | 48 MHz - delivers 39.2 DMIPS performance suitable for closed-loop motor control and protocol stack handling. |
| ADC | 12-bit, 16-channel, hardware-triggered - enables precise analog sensing with minimal CPU overhead in industrial monitoring. |
| CAN Interface | 3 independent CAN channels, ISO 11898-1 compliant - supports multi-node vehicle or factory network topologies with error confinement. |
| Operating Voltage | 3.0 V to 5.5 V - allows direct interface with legacy 5 V logic and robust operation under industrial supply variation. |
| Temperature Range | –40°C to +85°C - qualified for use in industrial enclosures and non-automotive transportation equipment. |
Pinout & Package
UPD70F3571GBA-GAH-AX is housed in a 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) package with exposed thermal pad. Pin assignments follow Renesas' V850E2/Fx4-L standard layout, including dedicated CANH/CANL, UART TX/RX, and ADC input groups.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P00–P07 | Port 0 bidirectional I/O | Configurable as general-purpose I/O or alternate functions including UART0 RX/TX and timer capture inputs. |
| P10–P17 | Port 1 bidirectional I/O | Supports CAN0 TX/RX, I²C SCL/SDA, and external interrupt triggers with programmable digital filtering. |
| P20–P27 | Port 2 bidirectional I/O | Includes ADC0–ADC7 inputs, PWM output channels, and external clock input for system timing flexibility. |
| P30–P37 | Port 3 bidirectional I/O | Provides CAN1/CAN2 signals, serial interface select lines, and reset/wake-up inputs for low-power operation. |
| VDD, VSS | Power supply terminals | Dual 3.0–5.5 V supply domains (core and I/O) with separate ground planes reduce noise coupling in mixed-signal operation. |
| CLKIN, CLKOUT | External clock interface | Accepts crystal (1–20 MHz) or external oscillator input; CLKOUT provides buffered system clock for trace/debug synchronization. |
| RESET | Active-low reset input | Asynchronous reset with internal power-on reset (POR) and brown-out detection (BOD) thresholds at 2.7 V and 4.0 V. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables seamless firmware updates by executing from one bank while reprogramming the other - eliminates runtime interruption during field upgrades. |
| Programmable port filters | Configurable digital debounce (1–16 clock cycles) per pin - suppresses contact bounce and EMI-induced glitches without software polling. |
| Memory Protection Unit (MPU) | 8-region MPU with read/write/execute permissions - isolates application code, bootloader, and peripheral drivers to prevent unintended memory corruption. |
| Hardware CRC accelerator | Dedicated CRC-16/CRC-32 engine - offloads checksum computation for firmware integrity verification and communication frame validation. |
| Low-power stand-by modes | Four power modes (normal, stop, sleep, deep stop) with wake-up via CAN, UART, or GPIO - extends battery life in remote sensor nodes. |
| On-chip debug interface | IEEE 1149.1 JTAG + OCD channel - supports real-time trace, breakpoint insertion, and register inspection without halting peripheral operation. |
Applications
| Industrial Motor Control | Factory Automation Gateway |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC motors using space-vector PWM and current feedback. IC Role / Device Role / Timing Role: Real-time execution host for motion control algorithm, ADC sampling trigger, and PWM waveform generation with <1 µs jitter. Use Value: Integrated 12-bit ADC with hardware triggering and 48 MHz deterministic timing eliminate external timing ICs and reduce BOM count. |
Use Scenario: Protocol translation between Modbus RTU field devices and EtherNet/IP backbone. IC Role / Device Role / Timing Role: Dual-role controller managing serial-to-Ethernet bridging, data buffering, and watchdog supervision. Use Value: Three CAN channels and dual UARTs enable concurrent fieldbus interfacing while 512 KB flash stores multiple protocol stacks. |
| Energy Metering Terminal | Building HVAC Controller |
Use Scenario: Residential smart meter with voltage/current sensing, tamper detection, and PLC communication. IC Role / Device Role / Timing Role: Primary measurement processor acquiring synchronized analog samples and computing RMS, harmonics, and energy totals. Use Value: 16-channel ADC with simultaneous sampling capability ensures phase-aligned acquisition across all current/voltage sensors. |
Use Scenario: Distributed air-handling unit (AHU) controller regulating fan speed, damper position, and temperature setpoints. IC Role / Device Role / Timing Role: Central decision node executing PID loops, interpreting BACnet MS/TP frames, and driving relay outputs. Use Value: Built-in CAN and I²C interfaces directly connect to CO₂ sensors, valve actuators, and display modules without level-shifting components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F566TEADFP | RL78/G14-based, 32 MHz max, 256 KB flash, no CAN - uses different core architecture and lacks CAN transceivers. | Suitable for cost-sensitive, lower-complexity control where CAN is not required and flash size ≤256 KB suffices. | Select when migrating legacy RL78 designs or prioritizing ultra-low power over real-time determinism and CAN networking. |
| UPD70F3572GBA-GAH-AX | Same V850E2/Fx4-L family, 768 KB flash, identical pinout and peripheral set - differs only in flash capacity and part marking. | Direct drop-in replacement where larger firmware image size or future feature expansion is anticipated. | Choose for new designs requiring headroom for OTA updates or additional protocol stacks without PCB revision. |
Compared with UPD70F3571GBA-GAH-AX, R5F566TEADFP offers lower power but sacrifices CAN connectivity and deterministic timing, while UPD70F3572GBA-GAH-AX provides identical functionality with increased flash - making it ideal for scalable firmware deployment without hardware change.
Availability
UPD70F3571GBA-GAH-AX is available at Aetrix Electronics and suitable for industrial motor control, factory automation gateways, and energy metering terminals requiring stable component supply and long-term lifecycle support.
Supply support for UPD70F3571GBA-GAH-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.
The V850E2/Fx4-L product line delivers high-integrity 32-bit MCUs optimized for deterministic real-time control in harsh industrial environments - emphasizing reliability, flash security, and peripheral integration for factory and energy applications.
FAQ
What is the maximum operating frequency of the UPD70F3571GBA-GAH-AX?
The UPD70F3571GBA-GAH-AX operates at a maximum CPU frequency of 48 MHz, delivering 39.2 DMIPS performance. This speed is achievable with an external crystal or oscillator input within the 1–20 MHz range, and requires stable 3.0–5.5 V supply and proper decoupling. The UPD70F3571GBA-GAH-AX datasheet specifies timing margins for all peripheral interfaces at this frequency, including CAN bit-rate accuracy and ADC sampling stability.
Does the UPD70F3571GBA-GAH-AX support in-system programming?
Yes, the UPD70F3571GBA-GAH-AX supports in-system programming via its on-chip flash programmer interface and dedicated JP0 mode pins. It enables flash programming using Renesas' PG-FP5 tool or through user firmware using the self-programming library. The UPD70F3571GBA-GAH-AX implements dual-bank flash to allow background reprogramming without halting application execution.
How many CAN controllers does the UPD70F3571GBA-GAH-AX integrate?
The UPD70F3571GBA-GAH-AX integrates three independent CAN 2.0B-compliant controllers, each with dedicated message buffers and acceptance filtering. All three CAN modules support ISO 11898-1 physical layer timing and can operate simultaneously at bit rates up to 1 Mbps. This capability makes the UPD70F3571GBA-GAH-AX suitable for multi-network industrial systems such as distributed PLC backplanes or vehicle subsystem gateways.
What is the ADC resolution and channel count on the UPD70F3571GBA-GAH-AX?
The UPD70F3571GBA-GAH-AX features a single 12-bit successive-approximation ADC with 16 input channels. It supports hardware-triggered sampling via timers or peripheral events, simultaneous sampling on up to 4 channels, and configurable conversion clock prescaling. The UPD70F3571GBA-GAH-AX ADC achieves ±1 LSB INL and operates across the full –40°C to +85°C temperature range with calibrated offset/gain compensation.
Is the UPD70F3571GBA-GAH-AX pin-compatible with other V850E2/Fx4-L family members?
Yes, the UPD70F3571GBA-GAH-AX shares identical 100-pin LQFP packaging and pin assignment with UPD70F3570, UPD70F3572, and UPD70F3573 variants in the V850E2/Fx4-L family. Differences are limited to flash size, RAM allocation, and peripheral enablement - allowing hardware reuse across firmware variants. The UPD70F3571GBA-GAH-AX pinout matches the family reference layout documented in Renesas' R01UH0114ED0200 Rev. 2.00 manual.
UPD70F3571GBA-GAH-AX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LQFP
- Series:
- V850E2/FE4-L
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- V850E2S
- Core Size:
- 32-Bit
- Speed:
- 48MHz
- Connectivity:
- CANbus, CSI, I2C, LINbus, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 45
- Program Memory Size:
- 384KB (384K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 28K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 12x10b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
UPD70F3571GBA-GAH-AX FAQ
1.How can I place an order for UPD70F3571GBA-GAH-AX through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD70F3571GBA-GAH-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD70F3571GBA-GAH-AX reliable?
The price and inventory of UPD70F3571GBA-GAH-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3571GBA-GAH-AX is usually 5 days.
3.What payment methods are accepted for UPD70F3571GBA-GAH-AX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3571GBA-GAH-AX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD70F3571GBA-GAH-AX?
UPD70F3571GBA-GAH-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD70F3571GBA-GAH-AX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD70F3571GBA-GAH-AX?
For technical support, including UPD70F3571GBA-GAH-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3571GBA-GAH-AX requirements.
6.How does Aetrix verify that UPD70F3571GBA-GAH-AX is sourced from the original manufacturer or authorized distributors?
All UPD70F3571GBA-GAH-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3571GBA-GAH-AX meets industry standards.
7.What is the process for return or replacement of UPD70F3571GBA-GAH-AX?
All UPD70F3571GBA-GAH-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3571GBA-GAH-AX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD70F3571GBA-GAH-AX part is unused and in its original packaging.
Return procedure for UPD70F3571GBA-GAH-AX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
UPD70F3571GBA-GAH-AX Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

