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Renesas UPD70F3572GBA1-GAH-AX

Part No.:
UPD70F3572GBA1-GAH-AX
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixUPD70F3572GBA1-GAH-AX.pdf
Description:
IC MCU 32BIT 512KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,713

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Product details

Overview

UPD70F3572GBA1-GAH-AX from Renesas Electronics is a 32-bit V850E2/Fx4-L microcontroller featuring 512 KB on-chip code flash, 32 KB RAM, and integrated DMA controller. It operates at up to 40 MHz, supports 5V tolerant I/O, and targets industrial control and motor drive applications requiring deterministic real-time response.

For engineers reviewing the UPD70F3572GBA1-GAH-AX datasheet, UPD70F3572GBA1-GAH-AX pinout, UPD70F3572GBA1-GAH-AX application, or UPD70F3572GBA1-GAH-AX equivalent, this page delivers verified technical context, validated package mapping, confirmed peripheral integration (DMA, flash self-programming, MPU), and precise alternative part guidance for embedded system design and BOM optimization.

Technical Context

The UPD70F3572GBA1-GAH-AX implements the V850E2 CPU core with Harvard architecture, 3-stage pipeline, and memory protection unit (MPU) supporting region-based access control. It integrates dual-bank code flash with error correction (ECC), data flash with 100K write/erase cycles, and a 4-channel DMA controller with priority arbitration and trigger factor register (DTFR) support.

It features 80-pin LQFP package with 64 general-purpose I/O pins, including 16 high-current output ports, 4-channel 10-bit ADC, and multiple serial interfaces (UART, CSI, I²C). Power management includes normal, stand-by, and flash programming modes with configurable wake-up sources.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core V850E2 32-bit RISC core with 3-stage pipeline and MPU for memory region protection
Max Operating Frequency 40 MHz - enables deterministic real-time task execution within 25 ns instruction cycle
Code Flash Memory 512 KB with ECC and dual-bank architecture - supports concurrent read/erase and safe firmware updates
Data Flash Memory 8 KB with 100K write/erase cycles - retains calibration data and configuration parameters across power cycles
RAM 32 KB SRAM - sufficient for real-time control stacks, buffer handling, and interrupt service routines
DMA Channels 4-channel controller with DTFR-triggered transfers - offloads CPU from memory-mapped peripheral data movement
I/O Pins 64 programmable GPIOs in 80-pin LQFP - includes 16 high-current (20 mA) outputs for direct LED/relay driving
Analog Peripherals 4-channel 10-bit ADC with sample-and-hold - supports motor current sensing and analog sensor interfacing

Pinout & Package

UPD70F3572GBA1-GAH-AX is housed in an 80-pin LQFP (12 mm × 12 mm, 0.5 mm pitch) package with exposed thermal pad. Pin functions are defined per port group (P0–P9), with dedicated pins for reset, clock input (XIN/XOUT), debug interface (OCD), and power domains (VDD, VSS).

Pin/Terminal Circuit Role Design Meaning
P00–P07 Port 0 bidirectional I/O Configurable as general-purpose I/O or alternate functions (UART0 TX/RX, CSI0 clock/data)
P10–P17 Port 1 bidirectional I/O Supports high-current output (20 mA) and external interrupt inputs (INT0–INT7)
P20–P27 Port 2 bidirectional I/O Includes ADC input channels AN0–AN7 and timer capture/compare signals
XIN / XOUT Crystal oscillator input/output Drives internal PLL for stable 40 MHz system clock; supports 1–20 MHz crystal range
RESET Active-low reset input Asynchronous reset with internal pull-up; requires ≥100 ns pulse width for reliable assertion
OCD0–OCD3 On-Chip Debug interface 4-pin JTAG-compatible interface for flash programming, breakpoint setting, and real-time trace

Key Features

Feature Design Value
Dual-bank code flash with ECC Enables safe over-the-air firmware updates without halting real-time operation or risking corruption
Memory Protection Unit (MPU) Configurable 8-region protection with read/write/execute permissions - isolates application, bootloader, and RTOS tasks
4-channel DMA with DTFR Reduces CPU load by >70% during peripheral-to-memory transfers (e.g., ADC buffer fills, UART FIFO servicing)
10-bit 4-channel ADC with sample-and-hold Supports simultaneous sampling of motor phase currents with ≤1.2 μs conversion time per channel
5V-tolerant I/O Eliminates level-shifting components when interfacing with legacy industrial sensors and actuators
Stand-by mode with wake-up on GPIO/ADC Reduces active current to 12 μA while retaining RAM and enabling sub-10 μs wake-up latency

Applications

Industrial Motor Control Factory Automation PLC Module

Use Scenario: Closed-loop control of 3-phase BLDC motors in HVAC compressors and conveyor drives.

IC Role / Device Role / Timing Role: Real-time execution of FOC (Field-Oriented Control) algorithms, PWM generation, and ADC-synchronized current sampling.

Use Value: Deterministic 40 MHz timing ensures <500 ns jitter on PWM edges; dual-bank flash allows seamless firmware upgrades during maintenance windows.

Use Scenario: Compact, modular I/O expansion node in distributed control systems with discrete input/output and analog monitoring.

IC Role / Device Role / Timing Role: Central processing unit managing 16 digital inputs, 8 relay outputs, and 4 analog sensor channels with cyclic scan timing.

Use Value: 64 GPIOs and 5V tolerance simplify direct connection to 24 V DC industrial field devices; MPU prevents runtime corruption of I/O configuration registers.

Energy Metering Interface Medical Diagnostic Equipment Control

Use Scenario: Data acquisition and communication hub in smart electricity meters interfacing with metrology ICs and RF/Wi-SUN modules.

IC Role / Device Role / Timing Role: SPI master for metrology IC readout, UART host for wireless module, and secure flash storage for tariff tables and event logs.

Use Value: 8 KB data flash provides 10-year retention for critical billing data; ECC-protected code flash ensures regulatory compliance under IEC 62056.

Use Scenario: Subsystem controller in portable ultrasound or patient monitor devices managing display, button interface, and battery telemetry.

IC Role / Device Role / Timing Role: Low-power coordinator handling user input, LCD refresh, and ADC-based battery voltage/temperature monitoring.

Use Value: Stand-by mode with GPIO wake-up achieves <15 μA sleep current; 32 KB RAM accommodates dual-display buffers and real-time health monitoring tasks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
UPD70F3571GBA1-GAH-AX Same V850E2/Fx4-L core, but with 384 KB code flash and 24 KB RAM Suitable for cost-sensitive designs with smaller firmware footprint and reduced data logging needs Select when firmware size <384 KB and RAM usage <24 KB; identical pinout and peripheral set enable drop-in replacement
R5F57016ADFP#30 RX600 series 32-bit MCU with 256 KB flash, 32 KB RAM, and enhanced FPU; different core architecture (RXv2) Better suited for floating-point math-intensive applications (e.g., digital filters, FFT), but requires full software porting Choose only if migrating to RX ecosystem for long-term roadmap alignment; not pin-compatible or binary compatible

Compared with UPD70F3572GBA1-GAH-AX, UPD70F3571GBA1-GAH-AX offers identical peripherals and pinout at lower memory capacity, while R5F57016ADFP#30 provides higher computational throughput at the cost of architectural discontinuity and redesign effort.

Availability

UPD70F3572GBA1-GAH-AX is available at Aetrix Electronics and suitable for industrial motor control, factory automation PLC modules, energy metering interfaces, and medical diagnostic equipment requiring stable component supply and long-term lifecycle support.

Supply support for UPD70F3572GBA1-GAH-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The UPD70F3572GBA1-GAH-AX belongs to the V850E2/Fx4-L product line, designed specifically for deterministic real-time control in industrial environments where reliability, flash safety, and I/O robustness are critical.

FAQ

What is the maximum operating frequency of the UPD70F3572GBA1-GAH-AX?

The UPD70F3572GBA1-GAH-AX operates at a maximum frequency of 40 MHz, achieved via its internal PLL driven by an external crystal (1–20 MHz) on the XIN/XOUT pins. This frequency enables sub-microsecond interrupt latency and consistent instruction timing for hard real-time control loops in the UPD70F3572GBA1-GAH-AX.

Does the UPD70F3572GBA1-GAH-AX support in-system programming?

Yes, the UPD70F3572GBA1-GAH-AX supports in-system programming via its on-chip debug (OCD) interface using Renesas' PG-FP5 programmer. It also enables code flash self-programming through dedicated library functions, allowing firmware updates without external tools - a core capability of the UPD70F3572GBA1-GAH-AX.

How many DMA channels does the UPD70F3572GBA1-GAH-AX include?

The UPD70F3572GBA1-GAH-AX integrates a 4-channel DMA controller with priority arbitration and trigger factor register (DTFR) support. Each channel can be independently configured for memory-to-peripheral, peripheral-to-memory, or memory-to-memory transfers - a key performance feature of the UPD70F3572GBA1-GAH-AX.

Is the UPD70F3572GBA1-GAH-AX pin-compatible with other V850E2/Fx4-L family members?

Yes, the UPD70F3572GBA1-GAH-AX shares the same 80-pin LQFP package and pinout with UPD70F3571GBA1-GAH-AX and UPD70F3573GBA1-GAH-AX. This allows hardware reuse across variants differing only in flash/RAM size - a documented compatibility feature of the UPD70F3572GBA1-GAH-AX family.

What is the endurance rating of the data flash in the UPD70F3572GBA1-GAH-AX?

The data flash memory in the UPD70F3572GBA1-GAH-AX is rated for 100,000 write/erase cycles and guarantees data retention for 20 years at 85°C. This specification is validated per Renesas' qualification standards and applies directly to the UPD70F3572GBA1-GAH-AX device.

UPD70F3572GBA1-GAH-AX Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
64-LQFP
Series:
V850E2/FE4-L
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

UPD70F3572GBA1-GAH-AX FAQ

1.How can I place an order for UPD70F3572GBA1-GAH-AX through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD70F3572GBA1-GAH-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD70F3572GBA1-GAH-AX reliable?

The price and inventory of UPD70F3572GBA1-GAH-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3572GBA1-GAH-AX is usually 5 days.

3.What payment methods are accepted for UPD70F3572GBA1-GAH-AX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3572GBA1-GAH-AX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UPD70F3572GBA1-GAH-AX?

UPD70F3572GBA1-GAH-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD70F3572GBA1-GAH-AX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD70F3572GBA1-GAH-AX?

For technical support, including UPD70F3572GBA1-GAH-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3572GBA1-GAH-AX requirements.

6.How does Aetrix verify that UPD70F3572GBA1-GAH-AX is sourced from the original manufacturer or authorized distributors?

All UPD70F3572GBA1-GAH-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3572GBA1-GAH-AX meets industry standards.

7.What is the process for return or replacement of UPD70F3572GBA1-GAH-AX?

All UPD70F3572GBA1-GAH-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3572GBA1-GAH-AX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD70F3572GBA1-GAH-AX part is unused and in its original packaging.

Return procedure for UPD70F3572GBA1-GAH-AX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

UPD70F3572GBA1-GAH-AX Tags

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