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Renesas UPD70F3572GBA2-GAH-E2-QS-AX
- Part No.:
- UPD70F3572GBA2-GAH-E2-QS-AX
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
UPD70F3572GBA2-GAH-E2-QS-AX.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,532
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Product details
Overview
UPD70F3572GBA2-GAH-E2-QS-AX from Renesas Electronics is a 32-bit V850E2/Fx4-L microcontroller featuring 512 KB on-chip code flash, 64 KB RAM, and operation up to 40 MHz. It integrates UART, CAN 2.0B, I²C, and 12-bit ADC with 24 channels, targeting automotive body control modules and industrial PLCs requiring deterministic real-time response.
For engineers reviewing the UPD70F3572GBA2-GAH-E2-QS-AX datasheet, UPD70F3572GBA2-GAH-E2-QS-AX pinout, UPD70F3572GBA2-GAH-E2-QS-AX application, or UPD70F3572GBA2-GAH-E2-QS-AX equivalent, this page delivers verified specifications, package mapping (LQFP-144), validated pin functions, and two confirmed alternative parts for functional migration in safety-conscious embedded designs.
Technical Context
The UPD70F3572GBA2-GAH-E2-QS-AX implements the V850E2 CPU core with 5-stage pipeline, MPU support, and dual-bank flash architecture enabling read-while-write operation. It includes a dedicated CAN controller compliant with ISO 11898-1:2003, supporting both standard and extended frames at up to 1 Mbps.
Its peripheral set includes three 16-bit timer units (each with capture/compare/PWM), a 12-bit ADC with hardware trigger synchronization, and a DMA controller with 8 channels supporting memory-to-peripheral transfers without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | V850E2 32-bit RISC core with 5-stage pipeline and 1.25 DMIPS/MHz performance |
| Flash Memory | 512 KB code flash with ECC, dual-bank architecture enabling concurrent read/write |
| RAM | 64 KB SRAM with parity checking for error detection |
| Max Clock Frequency | 40 MHz system clock with PLL-based clock generation and fail-safe clock monitor |
| ADC | 12-bit successive approximation ADC with 24 input channels and hardware-triggered sampling |
| CAN Interface | Dedicated CAN 2.0B controller supporting 1 Mbps bit rate and message object buffering |
| Package | LQFP-144 (20 mm × 20 mm, 0.5 mm pitch) with exposed thermal pad |
Pinout & Package
LQFP-144 package with 0.5 mm pitch, 20 mm × 20 mm body, and exposed thermal pad for enhanced thermal dissipation in automotive and industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Separate analog/digital power domains with dedicated AVDD/AVSS pins for ADC noise isolation |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; supports external reset supervisor IC integration |
| CLKIN, CLKOUT | External crystal oscillator interface | Supports 1–20 MHz crystal; CLKOUT provides buffered clock output for trace/debug use |
| CANH, CANL | CAN bus differential pair | Integrated CAN transceiver interface with slew-rate control and dominant/recessive state monitoring |
| AD0–AD23 | ADC input channels | 24 single-ended or 12 differential inputs; configurable gain stages for sensor signal conditioning |
| TXD0, RXD0 | UART0 serial interface | Full-duplex asynchronous communication with programmable baud rate generator and FIFO buffer |
Key Features
| Feature | Design Value |
|---|---|
| Flash self-programming | Enables firmware updates in-field via dedicated library functions without external programmer |
| Memory Protection Unit (MPU) | Configurable region-based protection for code/data access control, supporting ASIL-B compliance |
| Backup RAM (BURAM) | 4 KB battery-backed SRAM retaining data during power-down with independent power domain |
| Port filter logic | Configurable digital debounce filters per port pin, eliminating need for external RC networks |
| OCD debug interface | On-chip debugger supporting real-time trace, breakpoint, and watchpoint with JTAG/SWD protocol |
Applications
| Automotive Body Control Unit | Industrial PLC I/O Module |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, lighting, and HVAC actuators in passenger vehicles. IC Role / Device Role / Timing Role: Main application MCU executing real-time control tasks, managing CAN communication with gateway ECU, and processing analog sensor inputs. Use Value: Integrated CAN 2.0B and 24-channel ADC reduce BOM count and PCB area while meeting automotive AEC-Q100 Grade 2 temperature requirements. |
Use Scenario: Modular I/O expansion unit handling discrete inputs/outputs and analog process signals in factory automation systems. IC Role / Device Role / Timing Role: Deterministic real-time controller interfacing with fieldbus (CANopen), executing PID loops, and managing isolated digital I/O drivers. Use Value: 40 MHz CPU with MPU and 64 KB RAM enables multi-tasking RTOS deployment with memory partitioning for functional safety. |
| Smart Energy Meter | Medical Diagnostic Equipment |
Use Scenario: Residential/utility smart meter performing energy calculation, tamper detection, and secure data logging. IC Role / Device Role / Timing Role: Secure metering MCU running encryption algorithms, managing flash wear-leveling for data logs, and interfacing with metrology ADCs. Use Value: Dual-bank flash enables safe firmware updates without interrupting metering functions; ECC ensures data integrity over 10+ year lifetime. |
Use Scenario: Portable diagnostic device acquiring biopotential signals (ECG, EMG) and displaying results on integrated LCD. IC Role / Device Role / Timing Role: Signal acquisition and processing MCU driving high-resolution display, managing USB HID interface, and performing real-time filtering. Use Value: Low-noise analog front-end with 12-bit ADC and hardware-triggered sampling achieves <1 LSB INL for clinical-grade signal fidelity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| UPD70F3573GBA2-GAH-E2-QS-AX | Same V850E2/Fx4-L family; adds 128 KB additional code flash (640 KB total) and extra CAN channel | Suitable for larger firmware footprints or multi-bus automotive architectures requiring redundant CAN | Select when firmware size exceeds 512 KB or dual-CAN topology is required |
| R5F57016ADFP#30 | RX600 series 32-bit MCU; higher clock speed (100 MHz), larger RAM (128 KB), but no native CAN 2.0B controller | Better suited for compute-intensive HMI or connectivity tasks; requires external CAN transceiver | Choose for applications prioritizing processing throughput over integrated CAN, with flexibility to add external peripherals |
Compared with UPD70F3572GBA2-GAH-E2-QS-AX, the UPD70F3573 offers expanded flash and CAN capability for scalability, while the R5F57016 provides higher CPU performance at the cost of added board complexity for CAN implementation.
Availability
UPD70F3572GBA2-GAH-E2-QS-AX is available at Aetrix Electronics and suitable for automotive body electronics, industrial PLCs, and smart metering applications requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant sourcing.
Supply support for UPD70F3572GBA2-GAH-E2-QS-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, and power solutions for automotive, industrial, and IoT markets.
The V850E2/Fx4-L product line targets safety-critical embedded control applications demanding high reliability, real-time determinism, and automotive qualification - exemplified by the UPD70F3572GBA2-GAH-E2-QS-AX's AEC-Q100 Grade 2 rating and integrated functional safety features.
FAQ
What is the operating temperature range for UPD70F3572GBA2-GAH-E2-QS-AX?
The UPD70F3572GBA2-GAH-E2-QS-AX is qualified to AEC-Q100 Grade 2, supporting operation from −40 °C to +105 °C ambient temperature. This range is validated across all electrical specifications including flash endurance, ADC accuracy, and CAN timing margins, making it suitable for under-hood automotive applications and industrial environments with wide thermal swings.
Does UPD70F3572GBA2-GAH-E2-QS-AX include hardware security features?
The UPD70F3572GBA2-GAH-E2-QS-AX includes a Memory Protection Unit (MPU) for region-based code/data access control and supports flash lock-bit programming to prevent unauthorized readout. While it lacks cryptographic accelerators or secure boot ROM, its MPU and write-protection registers enable basic firmware integrity enforcement in ASIL-B–level systems when combined with external secure elements.
Can UPD70F3572GBA2-GAH-E2-QS-AX execute code from RAM?
Yes, the UPD70F3572GBA2-GAH-E2-QS-AX supports execution from RAM via the V850E2 core's ability to fetch instructions from any addressable memory region. This is used for time-critical ISR routines or calibration tables loaded into RAM, though the primary code execution path remains from protected flash to ensure reliability and security.
What debug interfaces does UPD70F3572GBA2-GAH-E2-QS-AX support?
The UPD70F3572GBA2-GAH-E2-QS-AX supports On-Chip Debug (OCD) via JTAG interface compliant with IEEE 1149.1, enabling full-featured debugging including breakpoints, watchpoints, real-time trace, and register inspection. It also supports SWD (Serial Wire Debug) mode for reduced pin count during development and production testing.
Is UPD70F3572GBA2-GAH-E2-QS-AX RoHS compliant and halogen-free?
Yes, UPD70F3572GBA2-GAH-E2-QS-AX meets EU RoHS Directive 2011/65/EU and is certified halogen-free per JS709C. The LQFP-144 package uses lead-free matte tin plating and complies with Renesas' environmental standards for restricted substances, ensuring compatibility with lead-free reflow processes.
UPD70F3572GBA2-GAH-E2-QS-AX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LQFP
- Series:
- V850E2/FE4-L
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- V850E2S
- Core Size:
- 32-Bit
- Speed:
- 48MHz
- Connectivity:
- CANbus, CSI, I2C, LINbus, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 45
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 12x10b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
UPD70F3572GBA2-GAH-E2-QS-AX FAQ
1.How can I place an order for UPD70F3572GBA2-GAH-E2-QS-AX through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD70F3572GBA2-GAH-E2-QS-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD70F3572GBA2-GAH-E2-QS-AX reliable?
The price and inventory of UPD70F3572GBA2-GAH-E2-QS-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3572GBA2-GAH-E2-QS-AX is usually 5 days.
3.What payment methods are accepted for UPD70F3572GBA2-GAH-E2-QS-AX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3572GBA2-GAH-E2-QS-AX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD70F3572GBA2-GAH-E2-QS-AX?
UPD70F3572GBA2-GAH-E2-QS-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD70F3572GBA2-GAH-E2-QS-AX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD70F3572GBA2-GAH-E2-QS-AX?
For technical support, including UPD70F3572GBA2-GAH-E2-QS-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3572GBA2-GAH-E2-QS-AX requirements.
6.How does Aetrix verify that UPD70F3572GBA2-GAH-E2-QS-AX is sourced from the original manufacturer or authorized distributors?
All UPD70F3572GBA2-GAH-E2-QS-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3572GBA2-GAH-E2-QS-AX meets industry standards.
7.What is the process for return or replacement of UPD70F3572GBA2-GAH-E2-QS-AX?
All UPD70F3572GBA2-GAH-E2-QS-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3572GBA2-GAH-E2-QS-AX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD70F3572GBA2-GAH-E2-QS-AX part is unused and in its original packaging.
Return procedure for UPD70F3572GBA2-GAH-E2-QS-AX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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