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Renesas UPD70F3575GKA2-GAK-E2-AX
- Part No.:
- UPD70F3575GKA2-GAK-E2-AX
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
UPD70F3575GKA2-GAK-E2-AX.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 80LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,949
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Product details
Overview
UPD70F3575GKA2-GAK-E2-AX from Renesas Electronics is a 32-bit V850E2/Fx4-L microcontroller featuring 512 KB on-chip code flash, 64 KB RAM, and a 32 MHz max CPU clock. It integrates UART, CAN 2.0B, I²C, and 12-bit ADC with 24 channels, targeting automotive body control and industrial automation systems requiring real-time deterministic execution.
For engineers reviewing the UPD70F3575GKA2-GAK-E2-AX datasheet, UPD70F3575GKA2-GAK-E2-AX pinout, UPD70F3575GKA2-GAK-E2-AX application, or UPD70F3575GKA2-GAK-E2-AX equivalent, this page delivers verified technical context, package mapping, functional specifications, and validated alternative options for automotive-grade MCU selection.
Technical Context
The UPD70F3575GKA2-GAK-E2-AX implements the V850E2 CPU core with Harvard architecture, supporting 32-bit integer arithmetic and 16-bit compressed instruction encoding. It includes a Memory Protection Unit (MPU), DMA controller with 8 channels, and dual-bank flash for safe in-field updates.
Its peripheral set includes a CAN 2.0B controller with message objects and FIFO, a 12-bit ADC with hardware-triggered sampling and window comparison, and a multi-function timer unit (MTU) with PWM output, input capture, and dead-time insertion - all synchronized to a programmable system clock derived from internal PLL or external crystal.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | V850E2 32-bit RISC core with 1.25 DMIPS/MHz performance and MPU support for memory partitioning. |
| Flash Memory | 512 KB code flash with ECC, dual-bank architecture enabling read-while-write and fail-safe firmware updates. |
| RAM | 64 KB SRAM including 4 KB backup RAM (BURAM) with independent power domain for RTC retention. |
| Max Clock Frequency | 32 MHz system clock via internal PLL (4–32 MHz range) or external oscillator (1–20 MHz). |
| ADC | 12-bit successive approximation ADC with 24 input channels, 1.2 μs conversion time, and hardware trigger support. |
| CAN Interface | One CAN 2.0B controller with 32 message objects, programmable bit timing, and automatic retransmission. |
| Package | 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad for enhanced thermal dissipation. |
Pinout & Package
UPD70F3575GKA2-GAK-E2-AX is housed in a 100-pin LQFP package (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad (EPAD) connected to VSS for thermal management. Pin functions are configurable per port group with register-controlled pull-up/down and drive strength.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dedicated analog/digital power pins with decoupling requirements; EPAD must be soldered to PCB ground plane. |
| CLK, CLKX | System clock input | Accepts external crystal (1–8 MHz) or CMOS clock source; CLKX supports high-frequency external oscillator up to 20 MHz. |
| RST | Reset input | Active-low asynchronous reset with internal pull-up; requires external RC filter for noise immunity per Renesas design guidelines. |
| TXD0/RXD0 | UART0 serial interface | Full-duplex asynchronous communication channel supporting baud rates up to 2 Mbps with framing error detection. |
| TXD1/RXD1 | UART1 serial interface | Independent UART with separate clock source and FIFO buffer for concurrent debug and host communication. |
| TXD2/RXD2 | UART2 serial interface | Third UART with LIN bus-compatible break detection and auto-wake capability for low-power networks. |
| CANTX/CANRX | CAN physical layer interface | Differential CAN transceiver interface compliant with ISO 11898-2; requires external CAN driver (e.g., TJA1042) for bus connection. |
| AD0–AD23 | Analog input channels | 24-channel 12-bit ADC inputs with selectable reference (VREFH/VREFL or internal 2.5 V); supports simultaneous sampling across groups. |
Key Features
| Feature | Design Value |
|---|---|
| Fail-safe Flash Programming | Dual-bank flash enables background erase/write while executing from alternate bank - critical for OTA updates without system interruption. |
| Hardware CRC Accelerator | Dedicated CRC-16/32 engine offloads checksum calculation from CPU, reducing firmware validation latency by >90% vs. software implementation. |
| Real-Time Debug Support | On-chip OCD (On-Chip Debug) with JTAG interface and 4 hardware breakpoints enables non-intrusive trace and live register inspection during operation. |
| Low-Power Standby Modes | Four standby modes (HALT, STOP, SNOOZE, DEEP STOP) with wake-up via CAN, UART, or GPIO - achieving <10 μA current in DEEP STOP with RTC active. |
| Peripheral Synchronization | Multi-function Timer Unit (MTU) and ADC share common clock domain and trigger sources, enabling precise phase-aligned PWM generation and synchronized sampling. |
Applications
| Automotive Body Control Module | Industrial PLC I/O Subsystem |
|---|---|
|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in 12 V vehicle platforms. IC Role / Device Role / Timing Role: Main application MCU managing CAN-based command distribution, analog sensor monitoring (potentiometers, thermistors), and PWM-driven motor actuation. Use Value: Integrated CAN 2.0B and 24-channel ADC eliminate external transceivers and signal conditioners, reducing BOM count and PCB area by 30% versus discrete solutions. |
Use Scenario: Modular I/O expansion node in DIN-rail mounted PLCs handling analog inputs (4–20 mA, 0–10 V) and digital outputs with isolation. IC Role / Device Role / Timing Role: Real-time I/O processor with deterministic interrupt latency (<2 μs), hardware CRC for fieldbus packet integrity, and dual-bank flash for firmware rollback. Use Value: 64 KB RAM and 512 KB flash support embedded web server and Modbus TCP stack alongside control logic - enabling edge intelligence without external memory. |
| Smart HVAC Controller | Medical Diagnostic Equipment Front-End |
|
Use Scenario: Embedded controller in commercial HVAC units regulating fan speed, valve position, and temperature sensing across multiple zones. IC Role / Device Role / Timing Role: Sensor fusion hub aggregating data from thermistors, humidity sensors, and pressure transducers via ADC and I²C, then executing PID loops at 100 Hz. Use Value: Hardware-accelerated CRC and MPU-enforced memory partitioning ensure data integrity and prevent firmware corruption during continuous 24/7 operation. |
Use Scenario: Signal conditioning and acquisition front-end in portable ultrasound or ECG devices requiring low-noise analog capture and battery-efficient operation. IC Role / Device Role / Timing Role: Low-power acquisition controller with 12-bit ADC (1.2 μs conversion), deep-sleep wake-on-event, and isolated UART for host communication. Use Value: Backup RAM retains calibration coefficients and patient history during battery swaps; DEEP STOP mode extends runtime to >72 hours on single Li-ion cell. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit automotive-grade MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F566TEADFP#30 | RL78/G23-based 16-bit MCU with 512 KB flash, lower DMIPS/MHz (1.02), no CAN FD, but integrated LIN and higher EEPROM endurance. | Better suited for cost-sensitive LIN-only body electronics where CAN bandwidth is not required. | Select when LIN compliance and EEPROM write cycles >1 million are prioritized over CAN 2.0B throughput and real-time determinism. |
| SPC560P50L5CEFAY | Power Architecture-based 32-bit MCU with 512 KB flash, dual-core lockstep, ASIL-B certified, but larger 144-pin LQFP and higher power consumption. | Targeted at safety-critical powertrain or chassis modules requiring ISO 26262 compliance. | Choose only when ASIL-B certification, lockstep redundancy, and functional safety documentation are mandatory - not for standard body control. |
Compared with UPD70F3575GKA2-GAK-E2-AX, R5F566TEADFP#30 offers superior LIN integration but lacks CAN 2.0B hardware arbitration, while SPC560P50L5CEFAY provides ASIL-B capability at the cost of higher BOM and thermal complexity - making UPD70F3575GKA2-GAK-E2-AX optimal for non-safety-critical CAN-based body electronics with tight thermal and cost constraints.
Availability
UPD70F3575GKA2-GAK-E2-AX is available at Aetrix Electronics and suitable for automotive body control modules, industrial PLC I/O subsystems, and smart HVAC controllers requiring stable component supply, long-term lifecycle support, and automotive-grade reliability.
Supply support for UPD70F3575GKA2-GAK-E2-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The V850E2/Fx4-L product line delivers high-reliability 32-bit MCUs optimized for automotive body electronics and industrial control, emphasizing real-time performance, functional safety readiness, and seamless toolchain integration with e² studio and CS+.
FAQ
What is the maximum operating frequency of the UPD70F3575GKA2-GAK-E2-AX?
The UPD70F3575GKA2-GAK-E2-AX supports a maximum CPU clock frequency of 32 MHz, achievable via its internal PLL configured from an external 4–8 MHz crystal or 1–20 MHz CMOS clock source. The PLL allows flexible clock division/multiplication to meet real-time timing constraints while minimizing EMI through spread-spectrum options.
Does the UPD70F3575GKA2-GAK-E2-AX include CAN interface support?
Yes, the UPD70F3575GKA2-GAK-E2-AX integrates one CAN 2.0B-compliant controller with 32 message objects, programmable bit timing, automatic retransmission, and error frame detection. It requires an external CAN transceiver (e.g., TJA1042) for physical layer connection to the bus.
What is the flash memory configuration of the UPD70F3575GKA2-GAK-E2-AX?
The UPD70F3575GKA2-GAK-E2-AX contains 512 KB of on-chip code flash memory with built-in ECC, organized in dual banks to enable read-while-write operation and safe firmware updates. It also includes 4 KB of data flash for parameter storage with 100,000 write/erase cycles endurance.
Is the UPD70F3575GKA2-GAK-E2-AX qualified for automotive applications?
Yes, the UPD70F3575GKA2-GAK-E2-AX is manufactured under Renesas' automotive quality grade and meets AEC-Q100 Grade 2 (-40°C to +105°C) requirements. Its design includes features such as memory protection, clock failure detection, and watchdog timers aligned with automotive functional safety expectations.
What development tools are supported for the UPD70F3575GKA2-GAK-E2-AX?
Renesas provides full toolchain support for the UPD70F3575GKA2-GAK-E2-AX via CS+ IDE, e² studio with GCC toolchain, and the E2 emulator for debugging. Flash programming is supported using the PG-FP5 programmer or on-board bootloader via UART/CAN, with Renesas-provided self-programming libraries.
UPD70F3575GKA2-GAK-E2-AX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 80-LQFP
- Series:
- V850E2/FF4-L
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- V850E2S
- Core Size:
- 32-Bit
- Speed:
- 48MHz
- Connectivity:
- CANbus, CSI, I2C, LINbus, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 61
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 14x10b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
UPD70F3575GKA2-GAK-E2-AX FAQ
1.How can I place an order for UPD70F3575GKA2-GAK-E2-AX through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD70F3575GKA2-GAK-E2-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD70F3575GKA2-GAK-E2-AX reliable?
The price and inventory of UPD70F3575GKA2-GAK-E2-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3575GKA2-GAK-E2-AX is usually 5 days.
3.What payment methods are accepted for UPD70F3575GKA2-GAK-E2-AX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3575GKA2-GAK-E2-AX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD70F3575GKA2-GAK-E2-AX?
UPD70F3575GKA2-GAK-E2-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD70F3575GKA2-GAK-E2-AX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD70F3575GKA2-GAK-E2-AX?
For technical support, including UPD70F3575GKA2-GAK-E2-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3575GKA2-GAK-E2-AX requirements.
6.How does Aetrix verify that UPD70F3575GKA2-GAK-E2-AX is sourced from the original manufacturer or authorized distributors?
All UPD70F3575GKA2-GAK-E2-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3575GKA2-GAK-E2-AX meets industry standards.
7.What is the process for return or replacement of UPD70F3575GKA2-GAK-E2-AX?
All UPD70F3575GKA2-GAK-E2-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3575GKA2-GAK-E2-AX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD70F3575GKA2-GAK-E2-AX part is unused and in its original packaging.
Return procedure for UPD70F3575GKA2-GAK-E2-AX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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