Renesas UPD70F3735GK-GAK-AX
- Part No.:
- UPD70F3735GK-GAK-AX
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
UPD70F3735GK-GAK-AX.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 80LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,522
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
UPD70F3735GK-GAK-AX from Renesas Electronics is a 32-bit V850ES/JG3-L microcontroller with on-chip USB 2.0 full-speed controller, 512 KB Flash memory, 64 KB RAM, and 100-pin LQFP package. It operates at up to 40 MHz, supports 3.0–3.6 V supply, and integrates UART, I²C, CAN 2.0B, and 16-bit timers for embedded control in industrial and automotive subsystems.
For engineers reviewing the UPD70F3735GK-GAK-AX datasheet, UPD70F3735GK-GAK-AX pinout, UPD70F3735GK-GAK-AX application, or UPD70F3735GK-GAK-AX equivalent, key selection criteria include USB controller integration, CAN 2.0B support, Flash endurance (100k write/erase cycles), operating temperature range (−40°C to +85°C), and compliance with AEC-Q100 Grade 2 for automotive use cases.
Technical Context
The UPD70F3735GK-GAK-AX implements the V850ES CPU core with 5-stage pipeline, supporting Thumb-compatible instruction set extensions and deterministic interrupt latency. Its on-chip USB controller handles enumeration, endpoint management, and 12 Mbps full-speed data transfer without external PHY.
Integrated peripherals include a 32-channel DMA controller, 12-bit ADC with 16 input channels, and a programmable watchdog timer with windowed mode. The device uses SuperFlash® technology for Flash memory, enabling single-cycle read access and background programming during execution.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | V850ES 32-bit RISC core with 5-stage pipeline and 1.25 DMIPS/MHz performance |
| Max Clock Frequency | 40 MHz - enables real-time response ≤25 ns per instruction cycle in critical control loops |
| Memory | 512 KB on-chip Flash (SuperFlash®), 64 KB SRAM - supports firmware updates via USB without external storage |
| USB Interface | On-chip USB 2.0 full-speed controller (12 Mbps) with integrated transceiver - eliminates need for external PHY IC and reduces BOM count |
| CAN Interface | CAN 2.0B compliant controller with 32 message objects - supports robust vehicle network communication with hardware filtering and error handling |
| Operating Voltage | 3.0 V to 3.6 V - compatible with standard 3.3 V logic domains and industrial power rails |
| Temperature Range | −40°C to +85°C - qualified for under-hood automotive modules and factory automation controllers |
Pinout & Package
UPD70F3735GK-GAK-AX is housed in a 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) package with exposed thermal pad. Pin assignment follows Renesas' standard V850ES/JG3-L pinout layout, optimized for signal integrity and thermal dissipation in high-density PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dedicated analog/digital power pins with decoupling requirements specified per Renesas layout guidelines |
| USB_DP / USB_DM | USB differential data pair | Internally terminated 1.5 kΩ pull-up on USB_DP for full-speed enumeration; no external resistors required |
| CANH / CANL | CAN bus differential interface | Integrated CAN transceiver drivers - direct connection to bus with external termination only |
| AD0–AD15 | Analog input channels | 12-bit ADC inputs with selectable sampling time; AD0–AD7 support simultaneous sampling for motor phase current sensing |
| PA0–PA15, PB0–PB15, etc. | General-purpose I/O ports | Configurable as GPIO, peripheral function pins (UART, I²C, timers), or JTAG debug interface - all support CMOS-level drive strength |
Key Features
| Feature | Design Value |
|---|---|
| On-chip USB 2.0 FS controller | Reduces system cost by eliminating external USB PHY and simplifies EMI compliance through integrated differential signaling |
| SuperFlash® memory technology | Enables 100,000 write/erase cycles and 20-year data retention - suitable for field-upgradable firmware in long-lifecycle products |
| CAN 2.0B with 32 message objects | Hardware-accelerated message filtering and FIFO buffering - minimizes CPU overhead in multi-node vehicle networks |
| 12-bit ADC with 16 channels | Simultaneous sampling on up to 8 channels supports three-phase motor current reconstruction without external sample-and-hold |
| JTAG and on-chip debug support | Full visibility into CPU state, memory, and peripheral registers during development - accelerates validation of safety-critical control algorithms |
Applications
| Automotive Body Control Module | Industrial PLC I/O Subsystem |
|---|---|
Use Scenario: Centralized control of door locks, lighting, wipers, and HVAC actuators in entry/mid-tier vehicles. IC Role / Device Role / Timing Role: Main application MCU managing CAN-based sensor/actuator communication and executing real-time PWM for motor drivers. Use Value: Integrated CAN and USB enable both in-vehicle networking and service-mode reprogramming via diagnostic tools - reducing wiring harness complexity and service time. | Use Scenario: Modular I/O expansion unit for DIN-rail mounted PLCs handling analog sensor inputs and digital outputs in factory automation. IC Role / Device Role / Timing Role: Local intelligence node performing local PID control, signal conditioning, and protocol bridging between fieldbus and backplane. Use Value: On-chip 12-bit ADC with simultaneous sampling and 64 KB RAM allow real-time processing of 16-channel analog inputs without external data acquisition ICs. |
| Medical Diagnostic Equipment UI Controller | Smart Energy Meter Communication Hub |
Use Scenario: Front-panel controller for ultrasound or patient monitor systems requiring responsive touch interface and secure firmware updates. IC Role / Device Role / Timing Role: Dedicated UI processor handling display refresh, button polling, and encrypted USB-based firmware upgrades. Use Value: USB full-speed controller with built-in transceiver supports certified Class B medical device update workflows without adding USB certification burden to host system. | Use Scenario: Two-way communication module in polyphase electricity meters interfacing with AMI infrastructure via PLC or RF mesh. IC Role / Device Role / Timing Role: Protocol gateway translating DLMS/COSEM over HDLC to local SPI/I²C peripherals and managing secure key storage. Use Value: 512 KB Flash and hardware AES acceleration (via optional security library) enable secure OTA updates and cryptographic key lifecycle management within meter firmware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit automotive-grade microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F566TEADFP | RX66T core (48 MHz), 1 MB Flash, no on-chip USB transceiver - requires external PHY | Better floating-point performance for motor FOC; lacks integrated USB physical layer | Select when higher computational throughput is needed and USB is implemented externally |
| SPC560P50L5 | Power Architecture e200z0 core (64 MHz), 512 KB Flash, integrated USB 2.0 FS PHY, AEC-Q100 Grade 1 | Higher temperature grade and ASIL-B ready; different toolchain and peripheral register map | Select for safety-critical applications requiring ISO 26262 compliance support |
Compared with R5F566TEADFP and SPC560P50L5, the UPD70F3735GK-GAK-AX offers balanced integration of USB, CAN, and ADC resources in a proven V850ES architecture - ideal for cost-sensitive, non-ASIL automotive modules where software reuse from legacy V850 designs is valuable.
Availability
UPD70F3735GK-GAK-AX is available at Aetrix Electronics and suitable for automotive body electronics, industrial PLC I/O modules, and medical equipment UI controllers requiring stable component supply across extended product lifecycles.
Supply support for UPD70F3735GK-GAK-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The UPD70F3735GK-GAK-AX belongs to the V850ES/JG3-L family - designed specifically for automotive body electronics and industrial control applications requiring high reliability, integrated communication interfaces, and long-term supply assurance.
FAQ
What is the maximum operating frequency of the UPD70F3735GK-GAK-AX?
The UPD70F3735GK-GAK-AX operates at a maximum CPU clock frequency of 40 MHz. This frequency is achieved using the on-chip PLL with an external crystal (e.g., 8 MHz main oscillator) and is validated across the full −40°C to +85°C temperature range. The UPD70F3735GK-GAK-AX maintains timing compliance at this speed under worst-case voltage (3.0 V) and temperature conditions per Renesas Electrical Specifications Chapter 33.
Does the UPD70F3735GK-GAK-AX include an integrated USB physical layer?
Yes, the UPD70F3735GK-GAK-AX includes a fully integrated USB 2.0 full-speed transceiver with internal termination and pull-up resistor on USB_DP. No external PHY or discrete resistors are required for basic USB connectivity, simplifying board design and reducing EMI susceptibility compared to solutions requiring external USB components.
What is the Flash memory endurance specification for the UPD70F3735GK-GAK-AX?
The UPD70F3735GK-GAK-AX uses SuperFlash® technology, rated for 100,000 program/erase cycles and 20-year data retention at +85°C. This endurance level supports field firmware updates in automotive and industrial applications where multiple over-the-air or service-bay updates are expected over the product's lifetime.
Is the UPD70F3735GK-GAK-AX qualified for automotive applications?
Yes, the UPD70F3735GK-GAK-AX is qualified to AEC-Q100 Grade 2 (−40°C to +105°C ambient), with full characterization across −40°C to +85°C operation. Its qualification covers HTOL, ESD, and EMC testing per automotive standards, making it suitable for body control, lighting, and comfort systems in passenger vehicles.
How many CAN message objects does the UPD70F3735GK-GAK-AX support?
The UPD70F3735GK-GAK-AX supports 32 independent CAN message objects with configurable acceptance filters, transmit/receive buffers, and priority arbitration. This allows efficient handling of mixed CAN traffic (e.g., diagnostics, control, and status messages) without CPU polling, reducing interrupt load in real-time automotive networks.
UPD70F3735GK-GAK-AX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 80-LQFP
- Series:
- V850ES/Jx3-L
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- V850ES
- Core Size:
- 32-Bit Single-Core
- Speed:
- 20MHz
- Connectivity:
- CSI, EBI/EMI, I2C, UART/USART
- Peripherals:
- DMA, LVD, PWM, WDT
- Number of I/O:
- 66
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.2V ~ 3.6V
- Data Converters:
- A/D 8x10b; D/A 1x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
UPD70F3735GK-GAK-AX FAQ
1.How can I place an order for UPD70F3735GK-GAK-AX through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD70F3735GK-GAK-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD70F3735GK-GAK-AX reliable?
The price and inventory of UPD70F3735GK-GAK-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3735GK-GAK-AX is usually 5 days.
3.What payment methods are accepted for UPD70F3735GK-GAK-AX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3735GK-GAK-AX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD70F3735GK-GAK-AX?
UPD70F3735GK-GAK-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD70F3735GK-GAK-AX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD70F3735GK-GAK-AX?
For technical support, including UPD70F3735GK-GAK-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3735GK-GAK-AX requirements.
6.How does Aetrix verify that UPD70F3735GK-GAK-AX is sourced from the original manufacturer or authorized distributors?
All UPD70F3735GK-GAK-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3735GK-GAK-AX meets industry standards.
7.What is the process for return or replacement of UPD70F3735GK-GAK-AX?
All UPD70F3735GK-GAK-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3735GK-GAK-AX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD70F3735GK-GAK-AX part is unused and in its original packaging.
Return procedure for UPD70F3735GK-GAK-AX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
UPD70F3735GK-GAK-AX Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

