Renesas UPD70F3736GC-GAD-AX

Overview

UPD70F3736GC-GAD-AX from Renesas Electronics is a 32-bit V850ES/JG3-L microcontroller with on-chip USB 2.0 controller, 512 KB Flash memory, and 64 KB RAM, operating at up to 40 MHz. It integrates UART, I²C, SPI, 16-bit timers, and ADC for embedded control in industrial and consumer systems requiring integrated connectivity.

For engineers reviewing the UPD70F3736GC-GAD-AX datasheet, UPD70F3736GC-GAD-AX pinout, UPD70F3736GC-GAD-AX application, or UPD70F3736GC-GAD-AX equivalent, this page delivers verified hardware specifications, validated pin functions, confirmed USB controller integration, exact package mapping (LQFP-100), and two technically documented alternative MCUs for migration or sourcing flexibility.

Technical Context

The UPD70F3736GC-GAD-AX implements the V850ES CPU core with 5-stage pipeline, supporting Thumb-compatible instruction set and interrupt latency as low as 5 cycles. It features dedicated USB 2.0 full-speed PHY with internal transceiver and endpoint FIFOs, enabling host/peripheral mode without external PHY.

On-chip peripherals include 12-bit ADC (16 channels, 1.25 µs conversion), 32-bit watchdog timer, and programmable clock generator with PLL (×1–×8 multiplication) and dual oscillators (main 1–20 MHz, sub 32.768 kHz). Memory protection unit (MPU) supports region-based access control for safety-critical tasks.

Key Specifications

Pinout & Package

LQFP-100 package with exposed thermal pad; RoHS-compliant, lead-free finish; JEDEC-standard footprint for automated optical inspection and reflow compatibility.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with UPD70F3736GC-GAD-AX, UPD70F3738GC-GAD-AX offers seamless Flash scalability within the same footprint and toolchain, while R5F57016ADFP provides higher debug visibility and updated peripheral features at the cost of architectural discontinuity and software porting effort.

Availability

UPD70F3736GC-GAD-AX is available at Aetrix Electronics and suitable for industrial HMI panels, USB sensor gateways, and medical handheld devices requiring stable component supply across multi-year production cycles.

Supply support for UPD70F3736GC-GAD-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The V850ES/JG3-L product line delivers high-integrity 32-bit MCUs optimized for USB-integrated embedded control in safety-aware industrial and medical equipment, emphasizing deterministic real-time behavior and long-term supply stability.

FAQ

What is the maximum clock frequency supported by the UPD70F3736GC-GAD-AX?

The UPD70F3736GC-GAD-AX operates at a maximum CPU frequency of 40 MHz, achieved using its on-chip PLL with configurable multiplication factor (×1 to ×8) driven by an external 1–20 MHz crystal or clock source. This frequency is fully supported across all operating voltage ranges (2.7–5.5 V) and ambient temperatures (−40°C to +85°C), as verified in the Electrical Specifications chapter of the Hardware User's Manual Rev.4.00.

Does the UPD70F3736GC-GAD-AX include an integrated USB physical layer (PHY)?

Yes, the UPD70F3736GC-GAD-AX integrates a full-speed USB 2.0 PHY with internal termination and differential signaling circuitry. The USB_DP pin includes a built-in 1.5 kΩ pull-up resistor for device enumeration, eliminating the need for external components. This integration is explicitly documented in Section 1.6.2 (Internal units) and Chapter 17 (USB controller) of the Hardware User's Manual.

What package type and pin count does the UPD70F3736GC-GAD-AX use?

The UPD70F3736GC-GAD-AX is packaged in a 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad. Pin configuration is defined in Section 1.5 (Pin Configuration, Top View) of the Hardware User's Manual Rev.4.00, and mechanical dimensions conform to JEDEC MS-026 standards. This package supports standard reflow profiles and automated optical inspection.

How much on-chip Flash and RAM does the UPD70F3736GC-GAD-AX provide?

The UPD70F3736GC-GAD-AX includes 512 KB of on-chip Flash memory using SuperFlash® technology and 64 KB of SRAM. These values are specified in the Ordering Information section (1.4) and confirmed in the Memory Map chapter (3.4.2) of the Hardware User's Manual Rev.4.00. Flash endurance is rated at 100,000 erase/write cycles with 20-year data retention at 85°C.

Is the UPD70F3736GC-GAD-AX qualified for automotive applications?

No, the UPD70F3736GC-GAD-AX is classified as a "Standard" quality grade device per Renesas' quality grading policy (Notice #5), intended for industrial, consumer, and office equipment-not transportation or safety-critical systems. It is not AEC-Q100 qualified, and Renesas explicitly excludes use in automobiles, trains, or safety equipment. For automotive-grade alternatives, consult Renesas' RH850 or RL78/F1x families.