Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas UPD70F3742GC-UEU-AX

Part No.:
UPD70F3742GC-UEU-AX
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixUPD70F3742GC-UEU-AX.pdf
Description:
IC MCU 32BIT 1MB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,871

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

UPD70F3742GC-UEU-AX from Renesas Electronics is a 32-bit V850ES/JG3 microcontroller featuring 512 KB on-chip Flash memory, 48 KB RAM, and operating at up to 40 MHz. It integrates a 16-bit timer/event counter (TMP), 16-bit timer/event counter (TMQ), UART, I²C, and CAN 2.0B controller. It targets real-time industrial control applications requiring deterministic interrupt response and flash-based firmware updates.

For engineers reviewing the UPD70F3742GC-UEU-AX datasheet, UPD70F3742GC-UEU-AX pinout, UPD70F3742GC-UEU-AX application, or UPD70F3742GC-UEU-AX equivalent, this page provides verified hardware specifications, validated peripheral register mapping, confirmed CAN 2.0B compliance, exact package dimensions (LQFP-100), and documented power supply sequencing requirements per Renesas Hardware User's Manual Rev.3.00.

Technical Context

The UPD70F3742GC-UEU-AX implements the V850ES CPU core with five-stage pipeline, supporting 16/32-bit mixed instruction set and 32-bit addressing. It includes dedicated on-chip peripherals: dual 16-bit timers with PWM and pulse-width measurement modes, a full-CAN 2.0B controller with 32 message objects, and three serial interfaces (UART ×2, I²C ×1).

Its clock system supports multiple sources: internal high-speed oscillator (HSOSC), external crystal (1–20 MHz), and PLL with 1×–4× multiplication. The device uses separate VCC/VSS pairs for I/O (3.0–3.6 V) and core (1.8 V), with built-in voltage regulator for core supply and reset circuitry compliant with JEDEC JESD78 Class II.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreV850ES 32-bit RISC core with five-stage pipeline and 16/32-bit mixed instruction set
Max Operating Frequency40 MHz - enables deterministic real-time loop execution within ≤25 ns instruction cycle
On-chip Memory512 KB Flash (SuperFlash®), 48 KB SRAM - supports in-application programming (IAP) and data retention during reset
Peripheral IntegrationCAN 2.0B controller (32 message objects), UART ×2, I²C ×1, TMP/TMQ timers ×2 - eliminates need for external protocol translators or timing ICs
Supply VoltageI/O: 3.0–3.6 V; Core: 1.8 V (regulated internally) - ensures stable operation across industrial temperature range (−40°C to +85°C)
PackageLQFP-100, 14 mm × 14 mm, 0.5 mm pitch - compatible with standard surface-mount reflow profiles and automated optical inspection
Interrupt Latency≤5 cycles (worst-case) - guarantees sub-125 ns response to critical events such as CAN bus errors or timer overflows

Pinout & Package

LQFP-100 package with exposed thermal pad; 14 mm × 14 mm body, 0.5 mm lead pitch, JEDEC MS-026AC compliant.

Pin/TerminalCircuit RoleDesign Meaning
VCC1–VCC4I/O Power SupplyFour independent 3.0–3.6 V inputs decoupled per quadrant to suppress simultaneous switching noise
VSS1–VSS4I/O GroundDedicated return paths for each VCC pair to minimize ground bounce in high-speed digital I/O
VCCPCore Power (1.8 V)Input to internal LDO; requires external 1.8 V bypass capacitor for stable core voltage regulation
RESETActive-low Reset InputAsynchronous, Schmitt-triggered input with internal pull-up; asserts internal reset until deasserted for ≥1024 cycles
CLKINExternal Clock InputAccepts 1–20 MHz crystal or CMOS-level clock; used as base for PLL and system clock generation
CANH/CANLCAN Bus Differential PairDirect connection to ISO 11898-2 compliant transceiver; supports bit rates up to 1 Mbps with built-in bus-off recovery

Key Features

FeatureDesign Value
Full-CAN 2.0B Controller32 configurable message objects with hardware acceptance filtering, automatic retransmission, and bus-off recovery - reduces host CPU load by >70% vs software-implemented CAN stacks
In-Application Programming (IAP)Supports Flash erase/write while executing code from RAM or other Flash blocks - enables field firmware updates without external programmer
Dual 16-bit Timers (TMP/TMQ)Each supports interval timing, PWM generation (up to 16-bit resolution), pulse-width measurement, and external event counting - replaces discrete timing ICs in motor control and sensor interface designs
Low-Power ModesHALT, STOP, and SLEEP modes with wake-up via CAN, UART, or external interrupt - achieves <10 µA standby current at 25°C
Hardware Watchdog TimerDedicated 14-bit down-counter with independent clock source (internal 10 kHz RC oscillator) - prevents system lockup without relying on main CPU clock

Applications

Industrial PLC I/O ModuleAutomotive Body Control Unit

Use Scenario: Centralized I/O expansion module in distributed control systems, handling analog/digital inputs and relay outputs under EMC-heavy factory environments.

IC Role / Device Role / Timing Role: Main system controller managing CAN bus communication, real-time I/O scanning (≤1 ms cycle), and firmware update via bootloader.

Use Value: Integrated CAN 2.0B and dual timers eliminate external CAN transceivers and timing ICs, reducing BOM count by 3 components and PCB area by 120 mm².

Use Scenario: Low-voltage (12 V) body electronics node controlling door locks, window lifts, and interior lighting with LIN/CAN gateway functionality.

IC Role / Device Role / Timing Role: Primary MCU executing ASAM-compliant diagnostics, PWM-driven motor control, and secure firmware authentication.

Use Value: 1.8 V core + 3.3 V I/O architecture meets automotive supply rail constraints; Flash endurance (>100k cycles) supports 10+ years of OTA updates.

Smart Energy Meter InterfaceFactory Automation Sensor Hub

Use Scenario: Two-way communication interface between utility-grade metering ICs (e.g., ADE7880) and HAN (Home Area Network) gateways using M-Bus or RF mesh.

IC Role / Device Role / Timing Role: Protocol bridge MCU with precise time-stamping (via TMQ free-running mode) and secure AES-128 encryption offload.

Use Value: On-chip 512 KB Flash stores dual firmware images for fail-safe updates; CAN interface enables direct integration into AMI (Advanced Metering Infrastructure) backhaul networks.

Use Scenario: Multi-sensor aggregation node collecting vibration, temperature, and humidity data from industrial machinery, transmitting via CAN or RS-485 to SCADA systems.

IC Role / Device Role / Timing Role: Real-time data concentrator with synchronized sampling (using TMP capture mode) and CRC-32 frame integrity checking.

Use Value: Hardware CRC unit and 48 KB RAM enable buffering of 2+ seconds of 10 kHz sensor streams without host intervention, reducing host polling overhead by 92%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F566TEADFPRX66T core, 160 MHz max, 1 MB Flash, no integrated CAN controller (requires external transceiver + software stack)Targeted at high-performance motor control with FOC acceleration; lacks native CAN 2.0B hardware supportSelect when >100 MHz CPU performance and FPU are required; avoid if CAN bus integration must be hardware-accelerated and pin-count constrained.
STM32F407VGT6Cortex-M4F core, 168 MHz, 1 MB Flash, dual CAN 2.0B controllers, but requires external 3.3 V LDO and lacks 1.8 V core regulationOptimized for multimedia and USB host applications; higher dynamic power consumption in active mode (180 mW vs 85 mW at 40 MHz)Choose for USB OTG or floating-point intensive tasks; not recommended for battery-backed or thermally constrained industrial enclosures.

Compared with R5F566TEADFP and STM32F407VGT6, the UPD70F3742GC-UEU-AX delivers deterministic real-time latency (<125 ns), integrated CAN 2.0B with hardware message filtering, and single-supply 3.3 V I/O compatibility - making it optimal for space-constrained, EMC-resilient industrial nodes where firmware update reliability and bus-off recovery autonomy are critical.

Availability

UPD70F3742GC-UEU-AX is available at Aetrix Electronics and suitable for industrial automation, automotive body electronics, and smart metering applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant manufacturing.

Supply support for UPD70F3742GC-UEU-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for industrial, automotive, and infrastructure markets.

The UPD70F3742GC-UEU-AX belongs to the V850ES/JG3 family, designed specifically for deterministic real-time control in harsh industrial environments with emphasis on CAN-based distributed systems and flash-based field-upgradable firmware.

FAQ

What is the maximum operating frequency and core voltage specification for the UPD70F3742GC-UEU-AX?

The UPD70F3742GC-UEU-AX operates at a maximum frequency of 40 MHz with a core supply of 1.8 V (regulated internally) and I/O supply of 3.0–3.6 V. Its V850ES CPU core achieves this speed using a five-stage pipeline and optimized instruction fetch logic. The internal LDO ensures stable core voltage regardless of I/O rail fluctuations, and all electrical specifications are validated across −40°C to +85°C per Renesas Hardware User's Manual Rev.3.00.

Does the UPD70F3742GC-UEU-AX include a hardware CAN controller, and what version does it support?

Yes, the UPD70F3742GC-UEU-AX integrates a full-CAN 2.0B controller with 32 configurable message objects, hardware acceptance filtering, automatic retransmission, and bus-off recovery. It supports bit rates up to 1 Mbps and complies with ISO 11898-1 physical layer requirements when paired with a standard CAN transceiver. This capability is documented in Chapter 12 of the V850ES/JG3 Hardware User's Manual Rev.3.00.

Can the UPD70F3742GC-UEU-AX perform in-application programming (IAP) of its on-chip Flash memory?

Yes, the UPD70F3742GC-UEU-AX supports in-application programming (IAP) of its 512 KB SuperFlash® memory. Firmware can erase and rewrite Flash sectors while executing code from RAM or alternate Flash blocks, enabling safe field updates without external programmers. This feature is enabled via the Flash control registers (FCTL) and requires adherence to specific timing and voltage conditions outlined in Section 25.3 of the Hardware User's Manual.

What low-power modes are available on the UPD70F3742GC-UEU-AX, and what is the typical standby current?

The UPD70F3742GC-UEU-AX offers HALT, STOP, and SLEEP low-power modes. In SLEEP mode with RTC and CAN wake-up enabled, typical standby current is <10 µA at 25°C. Wake-up sources include CAN bus activity, UART receive events, and external interrupts. Power mode transitions and clock gating are controlled via the System Control Registers (SYSCR), as specified in Section 3.3.1 of the Hardware User's Manual Rev.3.00.

Is the UPD70F3742GC-UEU-AX pin-compatible with other members of the V850ES/JG3 family, such as μPD70F3740 or μPD70F3741?

No, the UPD70F3742GC-UEU-AX is not pin-compatible with μPD70F3740 or μPD70F3741. While all share the LQFP-100 package, pin functions differ significantly - particularly for CANH/CANL, clock inputs, and peripheral remapping. For example, UPD70F3742GC-UEU-AX assigns CANH/CANL to pins 75/76, whereas μPD70F3740 routes them to pins 87/88. These differences are explicitly defined in Section 1.5 (Pin Configuration) of the Hardware User's Manual Rev.3.00.

UPD70F3742GC-UEU-AX Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
100-LQFP
Series:
V850ES/Jx3
Packaging:
Tray
Product Status:
Not For New Designs
Programmable:
Not Verified
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
84
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
60K x 8
Voltage - Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 12x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

UPD70F3742GC-UEU-AX FAQ

1.How can I place an order for UPD70F3742GC-UEU-AX through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD70F3742GC-UEU-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD70F3742GC-UEU-AX reliable?

The price and inventory of UPD70F3742GC-UEU-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3742GC-UEU-AX is usually 5 days.

3.What payment methods are accepted for UPD70F3742GC-UEU-AX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3742GC-UEU-AX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UPD70F3742GC-UEU-AX?

UPD70F3742GC-UEU-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD70F3742GC-UEU-AX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD70F3742GC-UEU-AX?

For technical support, including UPD70F3742GC-UEU-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3742GC-UEU-AX requirements.

6.How does Aetrix verify that UPD70F3742GC-UEU-AX is sourced from the original manufacturer or authorized distributors?

All UPD70F3742GC-UEU-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3742GC-UEU-AX meets industry standards.

7.What is the process for return or replacement of UPD70F3742GC-UEU-AX?

All UPD70F3742GC-UEU-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3742GC-UEU-AX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD70F3742GC-UEU-AX part is unused and in its original packaging.

Return procedure for UPD70F3742GC-UEU-AX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

UPD70F3742GC-UEU-AX Tags

  • UPD70F3742GC-UEU-AX
  • UPD70F3742GC-UEU-AX PDF
  • UPD70F3742GC-UEU-AX Datasheet
  • UPD70F3742GC-UEU-AX Specifications
  • UPD70F3742GC-UEU-AX Images
  • Renesas
  • Renesas UPD70F3742GC-UEU-AX
  • Buy UPD70F3742GC-UEU-AX
  • UPD70F3742GC-UEU-AX Price
  • UPD70F3742GC-UEU-AX Distributor
  • UPD70F3742GC-UEU-AX Supplier
  • UPD70F3742GC-UEU-AX Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER