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Renesas UPD70F3743GJ-GAE-AX

Part No.:
UPD70F3743GJ-GAE-AX
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixUPD70F3743GJ-GAE-AX.pdf
Description:
IC MCU 32BIT 384KB FLASH 144LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,944

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Product details

Overview

UPD70F3743GJ-GAE-AX from Renesas Electronics is a 32-bit V850ES/JG3 microcontroller with 512 KB on-chip Flash, 48 KB RAM, and integrated peripherals including 16-bit timers (TMP/TMQ), UART, I²C, and CAN 2.0B controller. It operates at up to 32 MHz, supports single-cycle instruction execution, and targets real-time embedded control in industrial and automotive subsystems.

For engineers reviewing the UPD70F3743GJ-GAE-AX datasheet, UPD70F3743GJ-GAE-AX pinout, UPD70F3743GJ-GAE-AX application, or UPD70F3743GJ-GAE-AX equivalent, key selection criteria include its V850ES CPU core compatibility, CAN interface capability, Flash programming voltage range (2.7–3.6 V), and 100-pin LQFP package with dedicated debug pins (TCK/TDI/TDO/TMS).

Technical Context

The UPD70F3743GJ-GAE-AX implements the V850ES RISC architecture with 32-bit data path, 32 general-purpose registers, and 16 interrupt levels. It integrates a PLL-based clock generator supporting internal/external oscillators (1–20 MHz crystal) and programmable wait states for external memory access.

Its peripheral set includes two 16-bit timer/event counters (TMP and TMQ) with PWM, pulse-width measurement, and one-shot output modes; a full-duplex UART with automatic baud rate detection; an I²C-compatible serial interface; and a CAN 2.0B controller with 32 message objects and FIFO support - all accessible via memory-mapped I/O registers.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreV850ES 32-bit RISC core with 16 interrupt levels and single-cycle instruction execution
Flash Memory512 KB on-chip Flash with SuperFlash® technology; supports in-system programming at 2.7–3.6 V
RAM Size48 KB on-chip SRAM, accessible in zero-wait-state mode at max operating frequency
Max Clock Frequency32 MHz system clock via internal PLL; crystal input range 1–20 MHz
Communication Interfaces1× CAN 2.0B controller, 2× UART (1 with autobaud), 1× I²C-compatible interface
Package100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, Standard quality grade
Operating Voltage2.7 V to 3.6 V supply range; supports low-power stop and sleep modes

Pinout & Package

UPD70F3743GJ-GAE-AX is housed in a 100-pin LQFP package with exposed thermal pad. Pin functions include multiplexed I/O ports (P0–P9, PCT, PCM, PDH, PDL), dedicated CANH/CANL differential pair, JTAG debug interface (TCK/TDI/TDO/TMS/TRST), reset (RES#), and power/ground distribution optimized for noise immunity and thermal dissipation.

Pin/TerminalCircuit RoleDesign Meaning
P00–P07Port 0 bidirectional I/OConfigurable as general-purpose I/O or alternate functions including UART0 TX/RX, I²C SCL/SDA
P10–P17Port 1 bidirectional I/OSupports CAN0 TX/RX, timer input capture, and external interrupt sources
P30–P37Port 3 bidirectional I/OIncludes CAN1 TX/RX, UART1 TX/RX, and PWM output channels
TCK/TDI/TDO/TMS/TRSTJTAG debug interfaceEnables on-chip debugging, flash programming, and boundary-scan testing without external emulator hardware
CANH/CANLDifferential CAN bus terminalsDirect connection to ISO 11898-2 compliant transceiver; supports bit rates up to 1 Mbps
VDD/VSSPower supply and groundMultiple dedicated VDD/VSS pairs reduce switching noise and improve EMI performance

Key Features

FeatureDesign Value
V850ES CPU Core32-bit RISC architecture with 32 general-purpose registers, 16 priority-level interrupts, and deterministic real-time response
On-chip Flash Programming512 KB SuperFlash® with 100k-cycle endurance and 10-year data retention at 85°C
CAN 2.0B Controller32 message objects with maskable acceptance filtering, transmit/receive FIFOs, and error confinement logic
Low-Power OperationStop mode current < 10 µA; wake-up via external interrupt, RTC alarm, or CAN activity
Peripheral FlexibilityPin multiplexing allows shared use of I/O pins across UART, I²C, CAN, and timer functions without external glue logic

Applications

Industrial PLC I/O ModuleAutomotive Body Control Unit

Use Scenario: Real-time monitoring and actuation of digital inputs/outputs, analog sensor signals, and fieldbus communication in factory automation cabinets.

IC Role / Device Role / Timing Role: Central controller executing ladder logic, managing CANopen messaging, and synchronizing I/O scan cycles at ≤10 ms intervals.

Use Value: Integrated CAN 2.0B and 16-bit timers enable deterministic I/O timing and fieldbus interoperability without external protocol accelerators.

Use Scenario: Coordinating door locks, window lifts, lighting, and HVAC subsystems in passenger vehicles using LIN and CAN networks.

IC Role / Device Role / Timing Role: Main body controller running AUTOSAR-compliant software stack with time-triggered task scheduling and CAN message handling.

Use Value: 512 KB Flash supports dual-bank firmware updates; CAN controller handles concurrent diagnostic (UDS) and functional messaging.

Motor Drive Feedback InterfaceEnergy Meter Communication Hub

Use Scenario: Capturing encoder pulses, measuring motor phase currents, and generating PWM gate signals in brushless DC motor inverters.

IC Role / Device Role / Timing Role: Real-time peripheral manager interfacing with ADC, PWM generators, and quadrature encoder inputs via dedicated timer capture units.

Use Value: TMP/TMQ modules provide sub-microsecond resolution for pulse-width and period measurement critical for FOC algorithms.

Use Scenario: Aggregating consumption data from multiple metering ICs and relaying it over RS-485 (via UART) and wireless HAN (via CAN-connected gateway).

IC Role / Device Role / Timing Role: Protocol bridge between metrology front-end and communication backhaul, performing data formatting and secure timestamping.

Use Value: Dual UART + CAN enables simultaneous wired/wireless communication paths with independent baud rate and arbitration settings.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F57016ADFPRX600-series 32-bit MCU with 256 KB Flash, 32 KB RAM, and enhanced CAN FD supportTargets next-generation automotive ECUs requiring CAN FD bandwidth and higher safety compliance (ASIL-B)Select when upgrading from CAN 2.0B to CAN FD or requiring larger RAM for RTOS stacks
UPD70F3739GJ-GAE-AXSame V850ES/JG3 family; 384 KB Flash, 32 KB RAM, identical pinout and peripheral setSuitable for cost-optimized designs where reduced memory footprint is acceptableSelect for legacy design reuse or BOM rationalization where 512 KB Flash is not required

Compared with UPD70F3743GJ-GAE-AX, R5F57016ADFP offers CAN FD and higher safety features but requires PCB redesign; UPD70F3739GJ-GAE-AX provides drop-in compatibility with lower memory capacity, enabling direct substitution in space-constrained layouts.

Availability

UPD70F3743GJ-GAE-AX is available at Aetrix Electronics and suitable for industrial PLC I/O modules, automotive body control units, motor drive feedback interfaces, and energy meter communication hubs requiring stable component supply and long-term lifecycle support.

Supply support for UPD70F3743GJ-GAE-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor manufacturer headquartered in Japan, specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.

The UPD70F3743GJ-GAE-AX belongs to the V850ES/JG3 microcontroller family, designed for deterministic real-time control in resource-constrained embedded systems requiring high reliability and CAN connectivity.

FAQ

What is the maximum operating frequency of the UPD70F3743GJ-GAE-AX?

The UPD70F3743GJ-GAE-AX supports a maximum system clock frequency of 32 MHz when using the internal PLL with an external crystal oscillator in the 1–20 MHz range. This frequency is sustained across the full operating voltage range (2.7–3.6 V) and ambient temperature range (–40°C to +85°C), enabling deterministic real-time execution of control loops and communication protocols without throttling.

Does the UPD70F3743GJ-GAE-AX support CAN FD?

No, the UPD70F3743GJ-GAE-AX implements a CAN 2.0B controller compliant with ISO 11898-1, supporting bit rates up to 1 Mbps and standard/extended frame formats. It does not support CAN FD features such as flexible data-rate or extended payload length. For CAN FD capability, consider Renesas' RX600 or RA6M series MCUs instead of the UPD70F3743GJ-GAE-AX.

What debug interface does the UPD70F3743GJ-GAE-AX use?

The UPD70F3743GJ-GAE-AX uses a standard 5-pin JTAG interface (TCK, TDI, TDO, TMS, TRST#) for on-chip debugging, flash programming, and boundary-scan testing. This interface is fully compatible with Renesas' E1/E20 emulators and third-party tools supporting IEEE 1149.1, enabling real-time code download and breakpoint debugging without requiring additional SWD or cJTAG circuitry on the UPD70F3743GJ-GAE-AX target board.

Is the UPD70F3743GJ-GAE-AX pin-compatible with other V850ES/JG3 devices?

Yes, the UPD70F3743GJ-GAE-AX shares the same 100-pin LQFP package and pin assignment with other members of the V850ES/JG3 family, including UPD70F3739GJ-GAE-AX, UPD70F3740GJ-GAE-AX, and UPD70F3741GJ-GAE-AX. This allows direct PCB footprint reuse across variants differing only in Flash/RAM size or peripheral enablement, provided the target application does not require features disabled in lower-tier models.

What is the Flash endurance specification for the UPD70F3743GJ-GAE-AX?

The UPD70F3743GJ-GAE-AX incorporates SuperFlash® technology with guaranteed endurance of 100,000 write/erase cycles per sector and data retention of 10 years at 85°C. This specification applies to the full 512 KB on-chip Flash memory and is validated under standard operating conditions (2.7–3.6 V, –40°C to +85°C), making it suitable for firmware updates and parameter storage in industrial and automotive applications.

UPD70F3743GJ-GAE-AX Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
144-LQFP
Series:
V850ES/Jx3
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
128
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

UPD70F3743GJ-GAE-AX FAQ

1.How can I place an order for UPD70F3743GJ-GAE-AX through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD70F3743GJ-GAE-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD70F3743GJ-GAE-AX reliable?

The price and inventory of UPD70F3743GJ-GAE-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3743GJ-GAE-AX is usually 5 days.

3.What payment methods are accepted for UPD70F3743GJ-GAE-AX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3743GJ-GAE-AX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UPD70F3743GJ-GAE-AX?

UPD70F3743GJ-GAE-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD70F3743GJ-GAE-AX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD70F3743GJ-GAE-AX?

For technical support, including UPD70F3743GJ-GAE-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3743GJ-GAE-AX requirements.

6.How does Aetrix verify that UPD70F3743GJ-GAE-AX is sourced from the original manufacturer or authorized distributors?

All UPD70F3743GJ-GAE-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3743GJ-GAE-AX meets industry standards.

7.What is the process for return or replacement of UPD70F3743GJ-GAE-AX?

All UPD70F3743GJ-GAE-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3743GJ-GAE-AX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD70F3743GJ-GAE-AX part is unused and in its original packaging.

Return procedure for UPD70F3743GJ-GAE-AX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

UPD70F3743GJ-GAE-AX Tags

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