Renesas UPD70F3747GB-GAH-AX
- Part No.:
- UPD70F3747GB-GAH-AX
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
UPD70F3747GB-GAH-AX.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,020
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Product details
Overview
UPD70F3747GB-GAH-AX from Renesas Electronics is a 32-bit V850ES/HE3 single-chip microcontroller featuring a 32 MHz max CPU clock, 256 KB on-chip Flash memory, 16 KB RAM, and integrated peripherals including 8-channel 10-bit ADC, UART, I²C, and 16-bit timer/counters. It operates from 2.7–3.6 V and targets industrial control and embedded instrumentation applications requiring deterministic real-time response.
For engineers reviewing the UPD70F3747GB-GAH-AX datasheet, UPD70F3747GB-GAH-AX pinout, UPD70F3747GB-GAH-AX application, or UPD70F3747GB-GAH-AX equivalent, key selection criteria include its V850ES core instruction compatibility, Flash endurance (10,000 write/erase cycles), operating temperature range (−40°C to +85°C), and support for in-circuit debugging via JTAG interface.
Technical Context
The UPD70F3747GB-GAH-AX implements the V850ES RISC architecture with 3-stage pipeline execution, supporting both little-endian and big-endian data access modes. It integrates a programmable watchdog timer, power-on reset circuit, and low-power stop/sleep modes with wake-up via external interrupt or peripheral event.
Peripheral subsystems include a 4-channel DMA controller, 8-channel 10-bit ADC with sample-and-hold, and dual UARTs with automatic baud rate detection. All I/O ports support configurable pull-up/pull-down and Schmitt-trigger input hysteresis for noise immunity in industrial environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | V850ES 32-bit RISC core with 3-stage pipeline and 32 MHz max operation |
| Memory | 256 KB on-chip Flash (10K erase/write cycles) + 16 KB SRAM |
| ADC | 8-channel 10-bit successive-approximation ADC with 1.2 μs conversion time |
| Timers | Four 16-bit general-purpose timers with capture/compare/PWM output capability |
| Communication | Dual UART (with FIFO and auto-baud), I²C bus interface, and 4-channel DMA |
| Supply Voltage | 2.7 V to 3.6 V - supports single-supply operation in battery-backed systems |
| Operating Temp | −40°C to +85°C - qualified for industrial-grade ambient conditions |
Pinout & Package
UPD70F3747GB-GAH-AX is housed in a 100-pin LQFP package (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad. Pin assignment follows the V850ES/HE3 standard layout defined in Renesas User's Manual U18854EJ2V0UD Chapter 1.5.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dedicated analog/digital power pins with separate decoupling requirements per datasheet section 29.2 |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external debounced signal or RC network |
| CLKIN | External clock input | Accepts crystal (1–8 MHz) or external CMOS clock source for system timing reference |
| TDI/TDO/TCK/TMS | JTAG debug interface | Enables full in-circuit debugging, flash programming, and boundary-scan testing |
| PA0–PA15 | Port A bidirectional I/O | Configurable as general-purpose I/O or alternate functions including UART0/1, I²C, and timer inputs |
Key Features
| Feature | Design Value |
|---|---|
| On-chip Flash programming | Supports in-system programming via JTAG or UART boot loader without external programmer |
| Low-power operation | Stop mode current < 10 μA at 3.3 V; wake-up latency < 10 μs from sleep mode |
| Noise-immune I/O | All digital inputs include Schmitt-trigger hysteresis and configurable pull-up/down resistors |
| Deterministic interrupt latency | Fixed 6-cycle response time for highest-priority interrupts - critical for real-time control loops |
| Hardware watchdog | Independent clock source with windowed timeout and reset generation on violation |
Applications
| Industrial PLC I/O Module | Smart Sensor Transmitter |
|---|---|
Use Scenario: Compact remote I/O node collecting analog sensor signals and executing local logic before forwarding to central controller. IC Role / Device Role / Timing Role: Main system controller managing ADC sampling, digital filtering, Modbus RTU communication, and watchdog supervision. Use Value: Integrated 10-bit ADC and dual UART eliminate external signal conditioning ICs and reduce BOM count by two components. | Use Scenario: Loop-powered 4–20 mA transmitter for pressure/temperature sensing in hazardous areas. IC Role / Device Role / Timing Role: Real-time signal processor converting raw sensor data into calibrated current output with linearization and diagnostics. Use Value: Low-power stop mode (<10 μA) enables extended operation within 4–20 mA loop power budget constraints. |
| Motor Control Interface | Embedded HMI Controller |
Use Scenario: Brushless DC motor driver board requiring precise PWM timing and fault monitoring. IC Role / Device Role / Timing Role: Timing-critical peripheral manager generating synchronized 16-bit PWM outputs while monitoring overcurrent and thermal shutdown signals. Use Value: Four independent 16-bit timers with dead-time insertion support enable direct generation of three-phase gate drive signals without FPGA assistance. | Use Scenario: Local operator panel with touch interface, LED indicators, and serial display control. IC Role / Device Role / Timing Role: Human-machine interface coordinator handling button debounce, LED PWM dimming, and SPI/I²C display updates. Use Value: Configurable port pins with Schmitt-trigger inputs tolerate noisy panel wiring, reducing need for external RC filters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| UPD70F3750GC-GAD-AX | V850ES/HF3 variant with 384 KB Flash, 32 KB RAM, and additional CAN interface | Requires CAN bus connectivity; higher memory footprint for complex protocol stacks | Select when CAN 2.0B support and >256 KB code space are mandatory |
| R5F566TEADFP | RX66T series part with FPU, 120 MHz max clock, and enhanced motor control peripherals | Targets high-performance servo drives with vector control algorithms | Choose for applications needing floating-point math acceleration and advanced PWM synchronization |
Compared with UPD70F3747GB-GAH-AX, UPD70F3750GC-GAD-AX adds CAN but increases package size and cost, while R5F566TEADFP delivers higher compute throughput at the expense of legacy V850ES toolchain compatibility and larger power consumption.
Availability
UPD70F3747GB-GAH-AX is available at Aetrix Electronics and suitable for industrial automation, smart sensor systems, and embedded HMI applications requiring stable component supply across multi-year production cycles.
Supply support for UPD70F3747GB-GAH-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor manufacturer formed in 2010 through the merger of NEC Electronics and Renesas Technology, specializing in microcontrollers, analog, and power devices.
The V850ES/HE3 product line was designed for cost-sensitive, high-reliability industrial control applications where deterministic real-time performance and long-term supply stability are prioritized over raw processing speed.
FAQ
What is the maximum operating frequency of the UPD70F3747GB-GAH-AX?
The UPD70F3747GB-GAH-AX supports a maximum CPU clock frequency of 32 MHz when powered at 3.3 V. This frequency is achieved using the on-chip PLL with an external 4 MHz crystal or CMOS clock input. Operation above 32 MHz is not supported and may cause undefined behavior or timing violations in internal peripherals.
Does the UPD70F3747GB-GAH-AX support in-system programming?
Yes, the UPD70F3747GB-GAH-AX supports in-system programming via its JTAG interface or UART-based bootloader. The on-chip Flash memory allows field firmware updates without removing the device from the PCB. Programming requires Renesas' PG-FP5 programmer or compatible tools supporting V850ES Flash command set.
What is the Flash endurance specification for UPD70F3747GB-GAH-AX?
The UPD70F3747GB-GAH-AX Flash memory is rated for 10,000 write/erase cycles per sector under standard operating conditions (25°C, VDD = 3.3 V). Endurance decreases at elevated temperatures or reduced supply voltage; Renesas recommends limiting sector rewrites to ≤1,000 cycles/year for 10-year product lifetime in industrial deployments.
Can UPD70F3747GB-GAH-AX operate from a single 3.3 V supply?
Yes, the UPD70F3747GB-GAH-AX operates from a single 3.3 V supply across its full industrial temperature range (−40°C to +85°C). Its internal voltage regulator provides stable core voltage, and all I/Os are 3.3 V tolerant. External decoupling (two 100 nF ceramic capacitors near VDD pins) is required per Renesas hardware design guidelines.
Is JTAG debugging supported on UPD70F3747GB-GAH-AX?
Yes, UPD70F3747GB-GAH-AX fully supports IEEE 1149.1 JTAG debugging via TDI, TDO, TCK, and TMS pins. It enables real-time register inspection, breakpoint setting, and flash programming using Renesas E1/E20 emulators or third-party tools compliant with V850ES debug protocol.
UPD70F3747GB-GAH-AX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LQFP
- Series:
- V850ES/Hx3
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- V850ES
- Core Size:
- 32-Bit Single-Core
- Speed:
- 32MHz
- Connectivity:
- CSI, I2C, UART/USART
- Peripherals:
- DMA, LVD, PWM, WDT
- Number of I/O:
- 51
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.7V ~ 5.5V
- Data Converters:
- A/D 10x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
UPD70F3747GB-GAH-AX FAQ
1.How can I place an order for UPD70F3747GB-GAH-AX through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD70F3747GB-GAH-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD70F3747GB-GAH-AX reliable?
The price and inventory of UPD70F3747GB-GAH-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3747GB-GAH-AX is usually 5 days.
3.What payment methods are accepted for UPD70F3747GB-GAH-AX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3747GB-GAH-AX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD70F3747GB-GAH-AX?
UPD70F3747GB-GAH-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD70F3747GB-GAH-AX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD70F3747GB-GAH-AX?
For technical support, including UPD70F3747GB-GAH-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3747GB-GAH-AX requirements.
6.How does Aetrix verify that UPD70F3747GB-GAH-AX is sourced from the original manufacturer or authorized distributors?
All UPD70F3747GB-GAH-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3747GB-GAH-AX meets industry standards.
7.What is the process for return or replacement of UPD70F3747GB-GAH-AX?
All UPD70F3747GB-GAH-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3747GB-GAH-AX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD70F3747GB-GAH-AX part is unused and in its original packaging.
Return procedure for UPD70F3747GB-GAH-AX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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