Renesas UPD70F3750GK-GAK-AX
- Part No.:
- UPD70F3750GK-GAK-AX
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
UPD70F3750GK-GAK-AX.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 80LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,746
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
UPD70F3750GK-GAK-AX from Renesas Electronics is a 32-bit V850ES/HF3 single-chip microcontroller featuring a 40 MHz CPU clock, 256 KB on-chip Flash memory, 16 KB RAM, and integrated peripherals including 8-channel 10-bit ADC, 32-bit timer/counter, UART, I²C, and CAN 2.0B controller. It operates from 2.7–5.5 V and targets industrial control and motor drive applications requiring deterministic real-time response.
For engineers reviewing the UPD70F3750GK-GAK-AX datasheet, UPD70F3750GK-GAK-AX pinout, UPD70F3750GK-GAK-AX application, or UPD70F3750GK-GAK-AX equivalent, key selection criteria include CAN interface support, Flash endurance (100,000 write/erase cycles), operating temperature range (−40°C to +85°C), and compliance with industrial-grade reliability standards.
Technical Context
The UPD70F3750GK-GAK-AX implements the V850ES core architecture with five-stage pipeline execution, supporting both little-endian and big-endian data access modes. It integrates a dedicated CAN controller compliant with ISO 11898-1:2003, enabling message filtering, FIFO buffering, and error handling without CPU intervention.
Its peripheral set includes three 16-bit general-purpose timers with input capture/output compare capability, a watchdog timer with independent clock source, and programmable port functions supporting TTL/CMOS-level I/O with configurable pull-up resistors and slew-rate control for EMI reduction.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | V850ES 32-bit RISC core with 5-stage pipeline and 40 MHz max operation |
| Memory | 256 KB on-chip Flash (100k cycle endurance) + 16 KB SRAM |
| ADC | 8-channel 10-bit successive approximation ADC with 1.2 μs conversion time |
| CAN Interface | One CAN 2.0B controller with 32 message objects and automatic retransmission |
| Supply Voltage | 2.7 V to 5.5 V - supports direct connection to industrial 3.3 V or 5 V rails |
| Operating Temp | −40°C to +85°C - qualified for extended industrial environments |
| Package | 100-pin LQFP (14 × 14 mm, 0.5 mm pitch) with exposed thermal pad |
Pinout & Package
The UPD70F3750GK-GAK-AX is housed in a 100-pin LQFP package (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad for enhanced thermal dissipation in motor control and power supply applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual 3.3 V/5 V supply domains with separate analog/digital ground pins reduce noise coupling |
| TXD0/RXD0 | UART0 serial interface | Asynchronous full-duplex communication at up to 2 Mbps with framing error detection |
| CANTX/CANRX | CAN physical layer interface | Differential signaling pair compatible with ISO 11898 standard transceivers |
| AD0–AD7 | Analog input channels | Eight single-ended inputs with internal reference (VREFH/VREFL) and sample-and-hold |
| PA0–PA15 | General-purpose I/O port A | Bi-directional CMOS ports with programmable pull-up, open-drain option, and glitch filter |
Key Features
| Feature | Design Value |
|---|---|
| CAN 2.0B Controller | Hardware-accelerated protocol handling with 32-message object RAM and automatic ID masking/filtering |
| Flash Programming | In-system programming via on-chip bootloader using UART or CAN - no external programmer required |
| Real-Time Debug | On-chip debug support via JTAG interface compatible with Renesas E1/E20 emulators |
| Low-Power Modes | Four operational modes (normal, stop, sleep, deep stop) with wake-up from CAN, UART, or external interrupt |
| Peripheral Clock Control | Individual clock gating per peripheral module reduces dynamic power by up to 40% during idle periods |
Applications
| Industrial Motor Drive | Factory Automation PLC |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC motors in HVAC compressors and conveyor systems. IC Role / Device Role / Timing Role: Main system controller executing FOC algorithms, managing PWM generation, and monitoring current/voltage feedback via ADC. Use Value: Integrated CAN enables distributed control across multiple drives; 40 MHz CPU ensures sub-100 μs loop timing for torque ripple suppression. | Use Scenario: Modular I/O expansion node in distributed control architecture with remote sensor/actuator interfacing. IC Role / Device Role / Timing Role: Local intelligence node handling digital input debouncing, analog signal conditioning, and fieldbus communication. Use Value: On-chip 10-bit ADC and GPIO with programmable slew rate minimize external components; CAN 2.0B ensures deterministic messaging in noisy factory environments. |
| Energy Metering Gateway | Building Management System |
Use Scenario: Data aggregation unit collecting consumption metrics from smart meters over RS-485 and forwarding via CAN or Ethernet. IC Role / Device Role / Timing Role: Protocol translation bridge between legacy metering interfaces and building backbone networks. Use Value: Dual UART + CAN allows concurrent communication with meters and central controllers; Flash memory stores firmware updates and configuration profiles. | Use Scenario: Embedded controller for HVAC zone actuators, lighting dimmers, and occupancy sensors in commercial buildings. IC Role / Device Role / Timing Role: Real-time environmental regulation engine coordinating temperature, airflow, and lighting based on sensor fusion. Use Value: −40°C to +85°C rating ensures reliable operation in unconditioned mechanical rooms; low-power sleep mode extends battery life in wireless sensor nodes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F566TEADFP | RL78/G14-based MCU with 128 KB Flash, lower CPU speed (32 MHz), no CAN | Lacks CAN interface; suited for cost-sensitive non-networked control | Select when CAN is not required and BOM cost optimization is critical |
| MB9BF516RPMC | Fujitsu FM3 series ARM Cortex-M3 MCU with 512 KB Flash, CAN FD support, higher power consumption | Supports CAN FD (5 Mbps) but requires external transceiver and larger PCB footprint | Select when future-proofing for CAN FD bandwidth or ARM ecosystem compatibility is needed |
Compared with UPD70F3750GK-GAK-AX, R5F566TEADFP offers lower cost and smaller code size but lacks CAN and real-time determinism; MB9BF516RPMC provides CAN FD and richer peripheral set at the expense of higher voltage requirements and thermal management complexity.
Availability
UPD70F3750GK-GAK-AX is available at Aetrix Electronics and suitable for industrial motor drive, factory automation PLC, and energy metering gateway applications requiring stable component supply and long-term lifecycle assurance.
Supply support for UPD70F3750GK-GAK-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The UPD70F3750GK-GAK-AX belongs to the V850ES/HF3 product line, designed specifically for deterministic real-time control in industrial equipment where CAN connectivity, Flash reliability, and extended temperature operation are essential.
FAQ
What is the maximum operating frequency of the UPD70F3750GK-GAK-AX?
The UPD70F3750GK-GAK-AX operates at a maximum CPU clock frequency of 40 MHz, achieved using an internal PLL with external crystal oscillator input (typically 4–8 MHz). This frequency enables sub-100 μs interrupt latency and supports real-time control loops in motor drive applications. The UPD70F3750GK-GAK-AX maintains timing accuracy across its full −40°C to +85°C operating range.
Does the UPD70F3750GK-GAK-AX support in-circuit debugging?
Yes, the UPD70F3750GK-GAK-AX supports full in-circuit debugging via its on-chip JTAG interface, compatible with Renesas E1 and E20 debug emulators. This enables real-time register inspection, breakpoint setting, and flash programming without removing the UPD70F3750GK-GAK-AX from the target board. Debug features include hardware watchpoints and trace buffer support for instruction flow analysis.
What peripheral interfaces are integrated into the UPD70F3750GK-GAK-AX?
The UPD70F3750GK-GAK-AX integrates UART (2 channels), I²C (1 channel), CAN 2.0B (1 channel), 8-channel 10-bit ADC, 32-bit timer/counter (3 units), watchdog timer, and programmable GPIO (up to 80 pins). All peripherals are memory-mapped and accessible via dedicated control registers. The UPD70F3750GK-GAK-AX does not include USB, Ethernet, or LCD controllers.
Is the UPD70F3750GK-GAK-AX qualified for industrial temperature operation?
Yes, the UPD70F3750GK-GAK-AX is rated for operation from −40°C to +85°C and classified as a Standard-grade Renesas product, qualified for industrial applications including motor control, PLC modules, and building automation systems. Its electrical specifications - including Flash write endurance and ADC linearity - are guaranteed across this full temperature range per Renesas datasheet U18854EJ2V0UD.
How is Flash memory programmed on the UPD70F3750GK-GAK-AX?
Flash memory on the UPD70F3750GK-GAK-AX is programmed via an on-chip bootloader that supports in-system programming through UART or CAN interfaces. No external programmer is required. The UPD70F3750GK-GAK-AX supports sector erase (2 KB), full chip erase, and byte/word programming with built-in erase/write verification. Flash endurance is specified at 100,000 cycles with data retention exceeding 20 years.
UPD70F3750GK-GAK-AX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 80-LQFP
- Series:
- V850ES/Hx3
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- V850ES
- Core Size:
- 32-Bit Single-Core
- Speed:
- 32MHz
- Connectivity:
- CSI, I2C, UART/USART
- Peripherals:
- DMA, LVD, PWM, WDT
- Number of I/O:
- 67
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.7V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
UPD70F3750GK-GAK-AX FAQ
1.How can I place an order for UPD70F3750GK-GAK-AX through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD70F3750GK-GAK-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD70F3750GK-GAK-AX reliable?
The price and inventory of UPD70F3750GK-GAK-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3750GK-GAK-AX is usually 5 days.
3.What payment methods are accepted for UPD70F3750GK-GAK-AX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3750GK-GAK-AX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD70F3750GK-GAK-AX?
UPD70F3750GK-GAK-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD70F3750GK-GAK-AX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD70F3750GK-GAK-AX?
For technical support, including UPD70F3750GK-GAK-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3750GK-GAK-AX requirements.
6.How does Aetrix verify that UPD70F3750GK-GAK-AX is sourced from the original manufacturer or authorized distributors?
All UPD70F3750GK-GAK-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3750GK-GAK-AX meets industry standards.
7.What is the process for return or replacement of UPD70F3750GK-GAK-AX?
All UPD70F3750GK-GAK-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3750GK-GAK-AX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD70F3750GK-GAK-AX part is unused and in its original packaging.
Return procedure for UPD70F3750GK-GAK-AX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
UPD70F3750GK-GAK-AX Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

