Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas UPD70F3757GJ-GAE-AX

Part No.:
UPD70F3757GJ-GAE-AX
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixUPD70F3757GJ-GAE-AX.pdf
Description:
IC MCU 32BIT 512KB FLASH 144LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,118

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

UPD70F3757GJ-GAE-AX from Renesas Electronics is a 32-bit V850ES/HJ3 single-chip microcontroller featuring a 48 MHz CPU clock, 512 KB on-chip flash memory, 48 KB RAM, and integrated peripherals including 32-bit timer arrays, UART, I²C, CAN 2.0B controller, and 12-bit ADC with 24 channels. It operates from 2.7 V to 5.5 V and targets industrial control and automotive body electronics.

For engineers reviewing the UPD70F3757GJ-GAE-AX datasheet, UPD70F3757GJ-GAE-AX pinout, UPD70F3757GJ-GAE-AX application, or UPD70F3757GJ-GAE-AX equivalent, key selection considerations include its CAN 2.0B interface, 48 MHz real-time performance, 512 KB flash with EEPROM emulation, and AEC-Q100 Grade 2 qualification for under-hood automotive use.

Technical Context

The UPD70F3757GJ-GAE-AX implements the V850ES CPU core with five-stage pipeline execution, supporting both little-endian and big-endian data access. It integrates a dedicated CAN controller compliant with ISO 11898-1:2003, capable of 1 Mbit/s operation with 32 message objects and programmable acceptance filtering.

Its peripheral set includes a 12-bit ADC with hardware-triggered sampling, dual 32-bit timer arrays with PWM output and input capture, and three serial interfaces (UART ×2, I²C ×1) sharing dedicated pins with GPIO. The device supports full-speed USB 2.0 device mode via external transceiver connection.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreV850ES 32-bit RISC core with five-stage pipeline and 48 MHz max operation
Flash Memory512 KB on-chip flash with 100K write/erase cycles and EEPROM emulation support
RAM Size48 KB SRAM with parity error detection and correction
CAN InterfaceOne CAN 2.0B controller supporting 1 Mbit/s, 32 message buffers, and hardware acceptance filtering
ADC Resolution12-bit successive approximation ADC with 24 input channels and hardware trigger synchronization
Supply Voltage2.7 V to 5.5 V single-supply operation, qualified for automotive battery voltage variation
Operating Temp−40 °C to +125 °C ambient temperature range (AEC-Q100 Grade 2)

Pinout & Package

UPD70F3757GJ-GAE-AX is housed in a 144-pin LQFP package (20 mm × 20 mm, 0.5 mm pitch) with exposed thermal pad for enhanced heat dissipation in automotive and industrial environments.

Pin/TerminalCircuit RoleDesign Meaning
P00–P07Port 0 bidirectional I/OConfigurable as general-purpose I/O or alternate functions including UART0 TX/RX, CAN0 TX/RX, and timer outputs
P10–P17Port 1 bidirectional I/OSupports I²C SDA/SCL, UART1 TX/RX, and external interrupt inputs with configurable pull-up/down
P30–P37Port 3 bidirectional I/OADC input channels AN0–AN7 and analog reference voltage inputs AVREFH/AVREFL
P40–P47Port 4 bidirectional I/OTimer array channel A/B inputs/outputs, PWM generation, and quadrature encoder interface
P50–P57Port 5 bidirectional I/OUSB D+/D− differential pair (with internal transceiver bias), system reset input (RES#), and clock input (XIN/XOUT)
VDD, VSSPower supply pinsEight VDD and eight VSS pins distributed across package for low-noise power delivery and EMI reduction

Key Features

FeatureDesign Value
On-chip CAN controllerFull CAN 2.0B compliance with 32 message objects, automatic retransmission, and bus-off recovery without CPU intervention
Flash memory reliability100K write/erase cycles with background erase suspend/resume and sector protection lock bits
ADC timing precisionHardware-synchronized sampling with ≤1 µs conversion time per 12-bit result and built-in calibration registers
Real-time interrupt latencyFixed 5-cycle interrupt response time with priority-based nested vector interrupt controller (NVIC)
Automotive qualificationAEC-Q100 Grade 2 certified with extended temperature range (−40 °C to +125 °C) and robust ESD immunity (±6 kV HBM)

Applications

Body Control Module (BCM)Engine Control Unit (ECU) Subsystem

Use Scenario: Centralized management of lighting, door locks, window lifts, and wiper systems in modern vehicles.

IC Role / Device Role / Timing Role: Main MCU executing real-time control logic, CAN message routing between LIN gateways and body networks, and ADC-based sensor monitoring (e.g., rain/light sensors).

Use Value: Enables deterministic 1 ms task scheduling and seamless integration with existing CAN FD backbone via software-compatible message object handling.

Use Scenario: Supporting subsystem within larger ECU architecture-managing fuel pump control, cooling fan sequencing, and diagnostic OBD-II communication.

IC Role / Device Role / Timing Role: Dedicated safety-monitored co-processor handling time-critical actuator drivers while offloading main ECU core.

Use Value: Provides independent watchdog supervision, redundant ADC sampling for critical temperature feedback, and fail-safe CAN message transmission with hardware CRC validation.

Industrial Motor Drive InterfaceSmart HVAC Controller

Use Scenario: Closed-loop motor control interface for BLDC/PMSM drives in factory automation equipment.

IC Role / Device Role / Timing Role: Real-time motion controller interfacing with gate driver ICs, reading hall-effect encoders, and communicating status over CAN bus to PLC master.

Use Value: Delivers sub-microsecond timer resolution for precise PWM dead-time insertion and synchronized ADC sampling aligned to commutation events.

Use Scenario: Embedded controller for commercial HVAC units managing compressor staging, damper positioning, and air quality sensing.

IC Role / Device Role / Timing Role: Integrated system-on-chip handling multi-sensor fusion (temperature, humidity, CO₂), relay control, and Modbus RTU over RS-485.

Use Value: Reduces BOM count by integrating UART-to-RS485 transceiver control logic, 24-channel ADC for distributed sensor nodes, and nonvolatile parameter storage in emulated EEPROM.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F566TEADFPRX66T 32-bit core @ 160 MHz; 512 KB flash; no native CAN, requires external transceiver and software stackLacks integrated CAN controller; higher CPU performance but increased software complexity for CAN protocol handlingSelect when high-speed computation dominates over CAN bandwidth requirements and external transceiver integration is acceptable
S32K144HAT0MLHTARM Cortex-M4F @ 112 MHz; 512 KB flash; dual CAN FD controllers; AEC-Q100 Grade 1 (−40 °C to +150 °C)Supports CAN FD up to 5 Mbit/s; broader temp range but lacks V850ES instruction set compatibility and legacy toolchain supportSelect for new designs requiring CAN FD upgrade path and maximum thermal margin, especially in engine bay deployments

Compared with UPD70F3757GJ-GAE-AX, R5F566TEADFP trades integrated CAN functionality for higher CPU throughput, while S32K144HAT0MLHT extends CAN capability to FD and raises temperature tolerance at the cost of ecosystem migration effort and higher unit cost.

Availability

UPD70F3757GJ-GAE-AX is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, and smart HVAC systems requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant sourcing.

Supply support for UPD70F3757GJ-GAE-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The V850ES/HJ3 product line delivers high-reliability 32-bit MCUs optimized for real-time automotive body electronics and industrial control, emphasizing CAN integration, functional safety readiness, and extended temperature operation.

FAQ

What is the maximum operating frequency of the UPD70F3757GJ-GAE-AX?

The UPD70F3757GJ-GAE-AX operates at a maximum CPU clock frequency of 48 MHz, derived from an internal PLL that accepts input from either the on-chip oscillator (1 to 8 MHz) or external crystal (1 to 20 MHz). This frequency enables deterministic real-time execution of automotive and industrial control tasks with guaranteed interrupt latency.

Does the UPD70F3757GJ-GAE-AX include a built-in CAN transceiver?

No, the UPD70F3757GJ-GAE-AX integrates a CAN 2.0B protocol controller but requires an external high-speed CAN transceiver (e.g., TJA1042 or SN65HVD230) for physical layer signaling. Its CAN_TX and CAN_RX pins are CMOS-level signals compliant with ISO 11898-1, not differential bus lines.

Is the UPD70F3757GJ-GAE-AX qualified for automotive applications?

Yes, the UPD70F3757GJ-GAE-AX is AEC-Q100 Grade 2 qualified (−40 °C to +125 °C), with built-in features supporting automotive reliability: ECC-protected RAM, flash write-protection registers, windowed watchdog timer, and power-on reset with brown-out detection-all documented in Renesas' U18854EJ2V0UD hardware manual.

How much user-accessible RAM does the UPD70F3757GJ-GAE-AX provide?

The UPD70F3757GJ-GAE-AX provides 48 KB of on-chip SRAM, all accessible to firmware for variables, stack, heap, and peripheral buffers. This RAM includes parity checking circuitry for single-bit error detection, and it is mapped into the CPU's linear address space starting at 0x0000_0000 with no bank switching required.

What development tools are officially supported for the UPD70F3757GJ-GAE-AX?

Renesas officially supports the UPD70F3757GJ-GAE-AX with the E1/E20 emulator debuggers, CS+ IDE (formerly CubeSuite+), and the CA850 C compiler. Hardware evaluation is enabled via the YRDKFX-UPD70F3757 reference board, which includes CAN transceivers, USB interface, and expansion headers compatible with standard Arduino pinout.

UPD70F3757GJ-GAE-AX Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
144-LQFP
Series:
V850ES/Hx3
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
128
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
3.7V ~ 5.5V
Data Converters:
A/D 24x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

UPD70F3757GJ-GAE-AX FAQ

1.How can I place an order for UPD70F3757GJ-GAE-AX through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD70F3757GJ-GAE-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD70F3757GJ-GAE-AX reliable?

The price and inventory of UPD70F3757GJ-GAE-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3757GJ-GAE-AX is usually 5 days.

3.What payment methods are accepted for UPD70F3757GJ-GAE-AX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3757GJ-GAE-AX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UPD70F3757GJ-GAE-AX?

UPD70F3757GJ-GAE-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD70F3757GJ-GAE-AX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD70F3757GJ-GAE-AX?

For technical support, including UPD70F3757GJ-GAE-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3757GJ-GAE-AX requirements.

6.How does Aetrix verify that UPD70F3757GJ-GAE-AX is sourced from the original manufacturer or authorized distributors?

All UPD70F3757GJ-GAE-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3757GJ-GAE-AX meets industry standards.

7.What is the process for return or replacement of UPD70F3757GJ-GAE-AX?

All UPD70F3757GJ-GAE-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3757GJ-GAE-AX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD70F3757GJ-GAE-AX part is unused and in its original packaging.

Return procedure for UPD70F3757GJ-GAE-AX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

UPD70F3757GJ-GAE-AX Tags

  • UPD70F3757GJ-GAE-AX
  • UPD70F3757GJ-GAE-AX PDF
  • UPD70F3757GJ-GAE-AX Datasheet
  • UPD70F3757GJ-GAE-AX Specifications
  • UPD70F3757GJ-GAE-AX Images
  • Renesas
  • Renesas UPD70F3757GJ-GAE-AX
  • Buy UPD70F3757GJ-GAE-AX
  • UPD70F3757GJ-GAE-AX Price
  • UPD70F3757GJ-GAE-AX Distributor
  • UPD70F3757GJ-GAE-AX Supplier
  • UPD70F3757GJ-GAE-AX Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER