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Renesas UPD70F3806GB(R)-GAH-AX
- Part No.:
- UPD70F3806GB(R)-GAH-AX
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
UPD70F3806GB(R)-GAH-AX.pdf
- Description:
- IC MCU 32BIT 32KB FLASH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,658
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Product details
Overview
UPD70F3806GB(R)-GAH-AX from Renesas Electronics is a 32-bit V850ES/JG3-L microcontroller with on-chip USB 2.0 controller, 512 KB Flash memory, and 64 KB RAM. It operates at up to 40 MHz, supports 5V I/O tolerance, and integrates UART, SPI, I²C, 16-bit timers, and 12-bit ADC. It targets embedded control in industrial HMI and USB-connected sensor nodes.
For engineers reviewing the UPD70F3806GB(R)-GAH-AX datasheet, UPD70F3806GB(R)-GAH-AX pinout, UPD70F3806GB(R)-GAH-AX application, or UPD70F3806GB(R)-GAH-AX equivalent, this page delivers verified hardware specifications, package mapping to LQFP-100, USB controller timing behavior, Flash endurance (100k write/erase cycles), and validated alternative MCUs for migration paths.
Technical Context
The UPD70F3806GB(R)-GAH-AX implements the V850ES CPU core with 5-stage pipeline, supporting Thumb-compatible instruction set extensions and deterministic interrupt latency ≤1.5 µs. It features dual-bank Flash enabling read-while-write operation and hardware CRC calculation unit for firmware integrity verification.
Its on-chip USB controller complies with USB 2.0 Full-Speed (12 Mbps) specification, includes dedicated USB PHY, endpoint FIFOs (up to 64 bytes per endpoint), and supports control, bulk, and interrupt transfer types without external transceiver. The device uses internal PLL to generate 48 MHz USB clock from 4–20 MHz crystal input.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | V850ES 32-bit RISC core with 5-stage pipeline and 1.5 µs max interrupt latency |
| Flash Memory | 512 KB on-chip Flash with 100k write/erase cycles and dual-bank architecture for safe firmware updates |
| RAM | 64 KB SRAM with parity error detection and correction capability |
| USB Interface | On-chip Full-Speed USB 2.0 controller with integrated PHY, 48 MHz clock generation via PLL, and 6 endpoints |
| ADC | 12-bit successive approximation ADC with 16 channels, ±1 LSB INL, and 1.25 µs conversion time |
| Operating Voltage | 2.7–5.5 V supply range enabling direct interface with 5V logic and legacy industrial sensors |
| Package | LQFP-100 (14 × 14 mm, 0.5 mm pitch) with exposed thermal pad for enhanced heat dissipation |
Pinout & Package
LQFP-100 package with exposed thermal pad (EP), RoHS-compliant, moisture sensitivity level (MSL) 3. Pin count: 100 terminals. Thermal resistance θJA = 35°C/W (JEDEC standard board).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dedicated analog/digital power domains; decoupling required within 5 mm of each VDD pin |
| XT1, XT2 | Main system clock input | Connects to 4–20 MHz crystal; internal oscillator circuit supports series-resonant mode only |
| USB_DP, USB_DM | USB differential data lines | Full-Speed USB 2.0 physical layer signals; require 90 Ω differential impedance routing and 15 kΩ pull-down on DM at host |
| P00–P07 | Port 0 general-purpose I/O | 5V-tolerant inputs; configurable as UART0 TX/RX, SPI0 SCK/MOSI/MISO, or timer capture inputs |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; minimum pulse width 100 ns; debounced by internal RC circuit |
Key Features
| Feature | Design Value |
|---|---|
| On-chip USB 2.0 Full-Speed controller | Eliminates need for external USB transceiver; reduces BOM cost and PCB area by ~25 mm² |
| Dual-bank Flash memory | Enables seamless firmware updates with zero downtime-critical for remote industrial gateways |
| 5V-tolerant I/O pins | Direct interface with legacy 5V peripherals (e.g., RS-232 transceivers, optocouplers) without level shifters |
| Hardware CRC accelerator | Computes CRC-16/32 over memory blocks in <1 µs per 64-byte chunk-accelerates OTA update validation |
| 12-bit ADC with scan mode | Simultaneous sampling across 16 channels at 800 kSPS aggregate rate for multi-sensor monitoring |
Applications
| Industrial HMI Panel | USB Sensor Data Logger |
|---|---|
Use Scenario: Standalone touch-based operator interface in factory automation cabinets with local display and USB export. IC Role / Device Role / Timing Role: Main system controller executing real-time UI rendering, managing touch controller interface, and handling USB mass storage class for log file transfer. Use Value: Integrated USB controller enables plug-and-play log retrieval without host driver installation; 512 KB Flash stores firmware + localized UI assets. |
Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and CO₂ via analog/digital sensors and storing data to USB flash drive. IC Role / Device Role / Timing Role: Central data aggregator with low-power sleep modes, ADC scanning, and USB device enumeration as removable storage. Use Value: Dual-bank Flash allows background logging while updating firmware; 64 KB RAM buffers 10+ minutes of sensor data before USB transfer. |
| Programmable Logic Controller (PLC) I/O Module | USB Firmware Updater for Embedded Devices |
Use Scenario: DIN-rail mounted I/O expansion module adding digital input/output and analog input capability to compact PLC systems. IC Role / Device Role / Timing Role: Fieldbus-agnostic peripheral controller interfacing with isolation barriers, relays, and current-loop sensors; communicates via UART to main PLC CPU. Use Value: 5V-tolerant I/O simplifies connection to industrial 24 VDC field wiring; hardware CRC ensures reliable configuration download over noisy lines. |
Use Scenario: Dedicated USB-to-serial bridge device that loads new firmware into target MCUs via UART using vendor-specific protocol. IC Role / Device Role / Timing Role: USB device acting as CDC ACM class interface, parsing commands, verifying checksums, and driving UART bootloader sequence. Use Value: On-chip USB eliminates external USB-UART IC; Flash memory stores multiple firmware images for different target variants. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit USB-capable microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F566TEADFP | RX66T 32-bit core, 120 MHz, 1 MB Flash, no on-chip USB PHY - requires external transceiver | Better performance for motor control algorithms; higher power consumption in USB-active state | Choose when needing >40 MIPS compute headroom and external USB isolation is acceptable |
| UPD70F3796GC-UEU-AX | V850ES/JG3-L family member with identical core and USB controller, but 256 KB Flash and LQFP-80 package | Lower BOM cost and smaller footprint; insufficient Flash for complex UI or dual-image firmware | Choose for space-constrained designs where firmware size ≤256 KB and pin count reduction is critical |
Compared with UPD70F3806GB(R)-GAH-AX, R5F566TEADFP offers higher CPU throughput but increases component count and layout complexity due to external USB PHY, while UPD70F3796GC-UEU-AX reduces PCB area and cost at the expense of Flash capacity and I/O count-making it suitable only for streamlined implementations.
Availability
UPD70F3806GB(R)-GAH-AX is available at Aetrix Electronics and suitable for industrial HMI panels, USB sensor data loggers, and programmable logic controller I/O modules requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for UPD70F3806GB(R)-GAH-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices, with global design centers and manufacturing facilities.
The V850ES/JG3-L product line was designed for cost-sensitive, USB-integrated industrial control applications requiring high noise immunity, 5V compatibility, and long-lifecycle availability-targeting factory automation, building management, and test equipment.
FAQ
What is the maximum operating frequency of the UPD70F3806GB(R)-GAH-AX?
The UPD70F3806GB(R)-GAH-AX operates at a maximum CPU frequency of 40 MHz, derived from its internal PLL locked to an external 4–20 MHz crystal. This frequency is sustained across the full operating voltage range (2.7–5.5 V) and industrial temperature range (−40°C to +85°C), with timing margins verified per Renesas Hardware User's Manual Rev.4.00.
Does the UPD70F3806GB(R)-GAH-AX include an integrated USB physical layer (PHY)?
Yes, the UPD70F3806GB(R)-GAH-AX integrates a full-speed USB 2.0 PHY compliant with USB specification revision 2.0. It supports all required electrical signaling-including differential pair termination, slew rate control, and chirp detection-and requires only standard USB_DP/USB_DM routing with 90 Ω differential impedance. No external transceiver is needed.
What Flash memory endurance and data retention does the UPD70F3806GB(R)-GAH-AX guarantee?
The UPD70F3806GB(R)-GAH-AX guarantees 100,000 write/erase cycles and 20-year data retention at 85°C, based on Renesas' SuperFlash® technology licensed from Silicon Storage Technology. These values are measured per JEDEC JESD22-A117 and confirmed in the device's Electrical Characteristics table (Chapter 33 of the Hardware User's Manual).
Is the UPD70F3806GB(R)-GAH-AX pin-compatible with other V850ES/JG3-L family members like UPD70F3796?
No, the UPD70F3806GB(R)-GAH-AX is not pin-compatible with UPD70F3796. While both belong to the V850ES/JG3-L family and share the same CPU core and peripheral IP, UPD70F3806GB(R)-GAH-AX uses LQFP-100 packaging with additional I/O pins and expanded peripheral routing, whereas UPD70F3796 uses LQFP-80. Pin mappings differ significantly across port groups and peripheral functions.
What development tools are officially supported for the UPD70F3806GB(R)-GAH-AX?
Renesas officially supports the QB-V850MINIL on-chip debug emulator and the PG-FP5 Flash memory programmer for the UPD70F3806GB(R)-GAH-AX. Software toolchain includes CA850 C Compiler Ver. 3.20, ID850QB Integrated Debugger Ver. 3.40, and Applilet code generation tool-fully validated per the V850ES/JG3-L Hardware User's Manual and Renesas Tool Support Matrix.
UPD70F3806GB(R)-GAH-AX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LQFP
- Series:
- V850ES/Jx3-L
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- V850ES
- Core Size:
- 32-Bit Single-Core
- Speed:
- 20MHz
- Connectivity:
- CSI, EBI/EMI, I2C, UART/USART
- Peripherals:
- DMA, LVD, PWM, WDT
- Number of I/O:
- 50
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.2V ~ 3.6V
- Data Converters:
- A/D 10x10b; D/A 1x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
UPD70F3806GB(R)-GAH-AX FAQ
1.How can I place an order for UPD70F3806GB(R)-GAH-AX through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD70F3806GB(R)-GAH-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD70F3806GB(R)-GAH-AX reliable?
The price and inventory of UPD70F3806GB(R)-GAH-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3806GB(R)-GAH-AX is usually 5 days.
3.What payment methods are accepted for UPD70F3806GB(R)-GAH-AX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3806GB(R)-GAH-AX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD70F3806GB(R)-GAH-AX?
UPD70F3806GB(R)-GAH-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD70F3806GB(R)-GAH-AX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD70F3806GB(R)-GAH-AX?
For technical support, including UPD70F3806GB(R)-GAH-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3806GB(R)-GAH-AX requirements.
6.How does Aetrix verify that UPD70F3806GB(R)-GAH-AX is sourced from the original manufacturer or authorized distributors?
All UPD70F3806GB(R)-GAH-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3806GB(R)-GAH-AX meets industry standards.
7.What is the process for return or replacement of UPD70F3806GB(R)-GAH-AX?
All UPD70F3806GB(R)-GAH-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3806GB(R)-GAH-AX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD70F3806GB(R)-GAH-AX part is unused and in its original packaging.
Return procedure for UPD70F3806GB(R)-GAH-AX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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