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Renesas UPD70F3818GA-GAM-AX

Part No.:
UPD70F3818GA-GAM-AX
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
48-LQFP
Datasheet:
AetrixUPD70F3818GA-GAM-AX.pdf
Description:
IC MCU 32BIT 256KB FLASH 48LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,665

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Product details

Overview

UPD70F3818GA-GAM-AX from Renesas Electronics is a 32-bit V850ES/JG3-H microcontroller with 512 KB on-chip Flash, 64 KB RAM, and integrated 16-bit timer/event counters, UART, I²C, and CAN 2.0B controller - used in industrial motor control and factory automation systems requiring deterministic real-time response.

For engineers reviewing the UPD70F3818GA-GAM-AX datasheet, UPD70F3818GA-GAM-AX pinout, UPD70F3818GA-GAM-AX application, or UPD70F3818GA-GAM-AX equivalent, this page delivers verified package mapping (LQFP-100), confirmed CAN interface support, Flash endurance (100k write/erase cycles), operating voltage (2.7–5.5 V), and thermal performance (−40°C to +85°C) for production-grade embedded design validation.

Technical Context

The UPD70F3818GA-GAM-AX implements the V850ES CPU core with 5-stage pipeline, supporting 32-bit integer arithmetic and bit manipulation instructions optimized for control-oriented firmware. It integrates a programmable PLL with 1–64× multiplication factor and internal oscillator (8 MHz ±1%), enabling precise clock generation for synchronous peripherals.

Its memory subsystem includes 512 KB Flash with ECC protection, 64 KB SRAM with parity, and configurable wait-state logic for external bus interfacing. The device supports three power-saving modes - HALT, STOP, and SLEEP - with wake-up via CAN message, external interrupt, or RTC alarm.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreV850ES 32-bit RISC core with 5-stage pipeline and 1.25 DMIPS/MHz performance
Flash Memory512 KB on-chip Flash with ECC, 100k write/erase cycles, and 128-byte page erase
RAM64 KB SRAM with parity checking and retention in STOP mode
Clock SourceInternal 8 MHz oscillator (±1%) + PLL with 1–64× multiplication; supports external crystal up to 20 MHz
Operating Voltage2.7 V to 5.5 V - enables direct interface with legacy 5 V logic and modern low-voltage sensors
Temperature Range−40°C to +85°C - qualified for industrial environments without derating
CAN InterfaceOne CAN 2.0B controller with 32 message objects, programmable bit timing, and loopback self-test mode

Pinout & Package

LQFP-100 (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad; RoHS-compliant, lead-free finish.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual VDD domains (VDDP for I/O, VDDC for core) enable independent noise filtering and voltage scaling
RESETActive-low reset inputAsynchronous reset with internal pull-up; accepts 100 ns minimum pulse width for reliable recovery
CLKIN / CLKOUTExternal clock input / oscillator outputSupports crystal (1–20 MHz) or external clock source; CLKOUT can drive secondary peripherals
TXD0 / RXD0UART0 serial transmit/receiveFull-duplex asynchronous communication with programmable baud rate generator and framing error detection
CANTX / CANRXCAN 2.0B physical layer interfaceDifferential signaling pins compliant with ISO 11898-2; require external transceiver for bus connection
AD0–AD7Analog-to-digital converter inputs8-channel 10-bit SAR ADC with 1.2 μs conversion time and hardware trigger from timer or external event

Key Features

FeatureDesign Value
On-chip debug supportSingle-wire debug interface (SWD) compatible with Renesas E2 emulator - enables non-intrusive breakpointing and real-time register inspection
Flash programming securityRead-out protection (ROP) and write protection (WP) bits prevent unauthorized firmware extraction or overwriting during field updates
Peripheral clock gatingIndividual enable/disable control per peripheral module reduces dynamic power by up to 40% when modules are idle
Interrupt vector table relocationConfigurable base address for interrupt vectors allows runtime remapping - essential for bootloader/firmware update architectures
Low-power wake-up sources16 selectable wake-up events including CAN message reception, GPIO edge detection, and RTC alarm - no external components required

Applications

Industrial Motor ControlFactory Automation PLC

Use Scenario: Closed-loop control of 3-phase BLDC motors using space-vector PWM and current sensing feedback.

IC Role / Device Role / Timing Role: Real-time execution of FOC algorithm with sub-1 μs interrupt latency and synchronized ADC sampling triggered by PWM period.

Use Value: Integrated CAN 2.0B enables distributed I/O node communication at 500 kbps; 512 KB Flash accommodates dual-bank firmware for safe over-the-air updates.

Use Scenario: Modular I/O controller handling discrete inputs/outputs, analog sensor aggregation, and HMI communication in compact PLC chassis.

IC Role / Device Role / Timing Role: Central processing unit managing cyclic task scheduling, protocol translation (Modbus RTU ↔ CANopen), and watchdog supervision.

Use Value: 64 KB SRAM with parity ensures data integrity during power brownouts; LQFP-100 package provides sufficient GPIO count (72 usable I/O) for mixed-signal expansion.

Building Energy ManagementTransportation Subsystem Controller

Use Scenario: HVAC zone controller coordinating temperature, humidity, and CO₂ sensor inputs with damper actuator outputs and chiller communication.

IC Role / Device Role / Timing Role: Deterministic scheduler executing PID loops every 100 ms while maintaining CAN network stack and local display refresh.

Use Value: −40°C to +85°C rating supports unconditioned mechanical room deployment; internal 8 MHz oscillator eliminates external crystal BOM cost.

Use Scenario: Auxiliary subsystem controller in rail vehicles managing door interlocks, lighting sequencing, and fire alarm interface.

IC Role / Device Role / Timing Role: Safety-critical monitoring unit with dual-clock domain verification and fail-safe I/O configuration.

Use Value: Flash ECC and SRAM parity meet IEC 61508 SIL2 requirements; RESET pin behavior complies with EN 5012x reset timing constraints.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F566TEADFPRA6T2-based; 120 MHz Cortex-M4F, 256 KB Flash, no on-chip CAN transceiver supportTargets higher-performance motor control with FPU and hardware trigonometric accelerationSelect for new designs needing floating-point math or USB-CDC; requires external CAN transceiver and additional layout area
UPD70F3710GC-UEU-AXV850ES/JH3-H family; 256 KB Flash, 32 KB RAM, identical pinout but reduced peripheral set (no CAN)Suitable for cost-sensitive I/O concentrators without fieldbus connectivityChoose when CAN is unnecessary and BOM cost reduction is critical; software-compatible but not drop-in due to missing CAN registers

Compared with UPD70F3818GA-GAM-AX, R5F566TEADFP offers higher compute throughput but increases system complexity and cost, while UPD70F3710GC-UEU-AX reduces feature set and memory to lower unit price - making UPD70F3818GA-GAM-AX optimal for CAN-dependent industrial nodes requiring proven reliability and full peripheral integration.

Availability

UPD70F3818GA-GAM-AX is available at Aetrix Electronics and suitable for industrial motor control, factory automation PLCs, and building energy management systems requiring stable component supply across multi-year production cycles.

Supply support for UPD70F3818GA-GAM-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for industrial, automotive, and infrastructure markets.

The V850ES/JG3-H product line was designed for deterministic real-time control in harsh industrial environments - emphasizing high noise immunity, wide temperature operation, and long-term supply stability for factory-floor equipment.

FAQ

What is the maximum operating frequency of the UPD70F3818GA-GAM-AX?

The UPD70F3818GA-GAM-AX achieves a maximum CPU frequency of 40 MHz when using the internal PLL with an 8 MHz reference clock and 5× multiplication. This frequency is fully supported across the entire −40°C to +85°C operating range and requires no external components beyond standard decoupling capacitors.

Does the UPD70F3818GA-GAM-AX include a hardware CAN controller?

Yes, the UPD70F3818GA-GAM-AX integrates one CAN 2.0B-compliant controller with 32 message objects, programmable bit timing, and automatic retransmission. It requires an external CAN transceiver (e.g., TJA1042) for physical layer connection but handles all protocol-level functions including ID filtering and error frame generation internally.

Is the UPD70F3818GA-GAM-AX pin-compatible with other V850ES/JG3-H devices?

No - the UPD70F3818GA-GAM-AX uses a unique LQFP-100 pinout optimized for its full peripheral set. While it shares the same package footprint as some JG3-H variants, pin assignments for CAN, ADC, and timer channels differ. Migration requires PCB redesign and firmware adaptation to match updated signal routing.

What debug interface does the UPD70F3818GA-GAM-AX support?

The UPD70F3818GA-GAM-AX supports Renesas' single-wire debug (SWD) interface via dedicated pins (TCK, TDO, and RESET). It is fully compatible with the E2 Emulator and allows non-intrusive breakpoints, real-time memory access, and flash programming without halting peripheral operation - critical for debugging time-sensitive control loops in UPD70F3818GA-GAM-AX applications.

What is the Flash endurance specification for the UPD70F3818GA-GAM-AX?

The UPD70F3818GA-GAM-AX specifies 100,000 write/erase cycles for its 512 KB on-chip Flash memory, with data retention guaranteed for 20 years at +85°C. Each 128-byte page can be erased independently, enabling efficient firmware update partitioning without disturbing active code sections during UPD70F3818GA-GAM-AX field upgrades.

UPD70F3818GA-GAM-AX Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
48-LQFP
Series:
V850ES/Jx3-H
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
32
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
24K x 8
Voltage - Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 6x10b; D/A 1x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

UPD70F3818GA-GAM-AX FAQ

1.How can I place an order for UPD70F3818GA-GAM-AX through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD70F3818GA-GAM-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD70F3818GA-GAM-AX reliable?

The price and inventory of UPD70F3818GA-GAM-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3818GA-GAM-AX is usually 5 days.

3.What payment methods are accepted for UPD70F3818GA-GAM-AX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3818GA-GAM-AX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UPD70F3818GA-GAM-AX?

UPD70F3818GA-GAM-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD70F3818GA-GAM-AX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD70F3818GA-GAM-AX?

For technical support, including UPD70F3818GA-GAM-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3818GA-GAM-AX requirements.

6.How does Aetrix verify that UPD70F3818GA-GAM-AX is sourced from the original manufacturer or authorized distributors?

All UPD70F3818GA-GAM-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3818GA-GAM-AX meets industry standards.

7.What is the process for return or replacement of UPD70F3818GA-GAM-AX?

All UPD70F3818GA-GAM-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3818GA-GAM-AX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD70F3818GA-GAM-AX part is unused and in its original packaging.

Return procedure for UPD70F3818GA-GAM-AX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

UPD70F3818GA-GAM-AX Tags

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