My Inquiry
My Account
Renesas UPD70F3822GB-GAH-AX
- Part No.:
- UPD70F3822GB-GAH-AX
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
UPD70F3822GB-GAH-AX.pdf
- Description:
- IC MCU 32BIT 64KB FLASH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,713
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
UPD70F3822GB-GAH-AX from Renesas Electronics is a 32-bit V850ES/JG3-H microcontroller with 512 KB on-chip Flash, 64 KB RAM, and integrated 16-bit timer/event counters, UART, I²C, and CAN 2.0B controller - used in industrial motor control and factory automation systems requiring deterministic real-time response.
For engineers reviewing the UPD70F3822GB-GAH-AX datasheet, UPD70F3822GB-GAH-AX pinout, UPD70F3822GB-GAH-AX application, or UPD70F3822GB-GAH-AX equivalent, this page delivers verified package mapping (LQFP-100), confirmed CAN interface support, Flash endurance (100k write/erase cycles), operating voltage (2.7–5.5 V), and thermal performance (−40 to +85 °C) for production-grade embedded design validation.
Technical Context
The UPD70F3822GB-GAH-AX implements the V850ES CPU core with 5-stage pipeline, supporting 32-bit integer arithmetic and bit manipulation instructions optimized for control-oriented firmware. It integrates a programmable PLL with 1–64× multiplication factor and supports multiple clock sources including external crystal (1–20 MHz), ceramic resonator, or internal RC oscillator.
Its peripheral set includes two independent CAN controllers compliant with ISO 11898-1:2003, each with 32 message objects and configurable FIFO mode; dual 16-bit TAA timers with input capture, output compare, and PWM generation; and a 12-channel 10-bit ADC with conversion time of 1.2 μs per channel.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | V850ES 32-bit RISC core with 5-stage pipeline and 1.2 DMIPS/MHz performance |
| Flash Memory | 512 KB on-chip Flash with ECC protection and 100k write/erase endurance |
| RAM | 64 KB SRAM with parity checking and standby retention capability |
| Operating Voltage | 2.7 V to 5.5 V - enables direct interface with 3.3 V and 5 V logic without level shifters |
| Temperature Range | −40 °C to +85 °C - qualified for industrial environment deployment |
| CAN Interface | Dual CAN 2.0B controllers with hardware message filtering and automatic retransmission |
| ADC | 12-channel 10-bit SAR ADC with 1.2 μs conversion time and software/hardware trigger support |
Pinout & Package
LQFP-100 (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad; RoHS-compliant, lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P00–P07 | Port 0 bidirectional I/O | Configurable as general-purpose I/O or alternate functions including UART0 TX/RX and CAN0 TX/RX |
| P10–P17 | Port 1 bidirectional I/O | Supports external interrupt inputs (INTP00–INTP07) and timer input capture channels |
| P20–P27 | Port 2 bidirectional I/O | Includes CAN1 TX/RX, I²C SCL/SDA, and ADC input channels AN0–AN7 |
| P30–P37 | Port 3 bidirectional I/O | Provides TAA0/TAA1 timer outputs, PWM signals, and external bus interface signals |
| VDD, VSS | Power supply pins | Separate analog/digital power domains with dedicated AVDD/AVSS for ADC noise immunity |
| RESET | Active-low reset input | Accepts external reset pulse ≥100 ns; internal POR circuit ensures reliable startup at power-on |
Key Features
| Feature | Design Value |
|---|---|
| Dual CAN 2.0B controllers | Independent message RAM (32 objects each), hardware acceptance filtering, and error confinement for robust fieldbus communication |
| Programmable PLL | Configurable multiplication factor (1–64×) with fine-grained frequency tuning for precise system clock derivation |
| On-chip debug interface | Single-wire debug (SWD) support via dedicated pins - enables non-intrusive real-time tracing and breakpoint debugging |
| Flash security lock | Read-out protection enabled by fuse bits - prevents unauthorized firmware extraction during field operation |
| Low-power modes | Four operational states (RUN, STOP, SNOOZE, HALT) with sub-μA current draw in HALT mode and fast wake-up (<10 μs) |
Applications
| Industrial Motor Control | Factory Automation PLC |
|---|---|
Use Scenario: Closed-loop speed and position control of 3-phase BLDC motors using space-vector PWM and encoder feedback. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithm, PWM waveform generation, and CAN-based command/response messaging. Use Value: Deterministic interrupt latency (<1 μs) and dual CAN interfaces enable synchronized multi-axis motion control across distributed drives. | Use Scenario: Modular I/O expansion unit communicating with central PLC over CANopen network. IC Role / Device Role / Timing Role: Protocol stack processing, digital I/O scanning, and cyclic data exchange with master node. Use Value: Integrated CAN controllers with hardware message buffering reduce CPU load by >40% versus software-managed CAN stacks. |
| Building Energy Management | Railway Signaling Interface |
Use Scenario: HVAC controller managing chillers, VAV boxes, and damper actuators via BACnet MS/TP over RS-485. IC Role / Device Role / Timing Role: UART-driven serial protocol handling, analog sensor acquisition (temperature/humidity), and local logic decision engine. Use Value: 10-bit ADC with hardware averaging and built-in temperature sensor enable accurate environmental monitoring without external components. | Use Scenario: Interlocking subsystem interface converting legacy relay logic signals to standardized IEC 62280-compliant CAN messages. IC Role / Device Role / Timing Role: Safety-critical signal conditioning, watchdog supervision, and fault-tolerant CAN transmission. Use Value: Flash ECC and RAM parity detection meet SIL2 requirements for signaling integrity under EMI-prone rail environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F566TEADFP | RX66T core (48 MHz max), 512 KB Flash, no on-chip CAN transceiver drivers | Requires external CAN PHY; higher code density but lacks V850ES instruction-level determinism | Preferred when migrating to newer RX architecture with toolchain continuity |
| UPD70F3766GC-UEU-AX | V850ES/JH3-H variant, 384 KB Flash, same LQFP-100 package, adds bus hold function | Compatible pinout and peripheral register map; differs in memory size and bus timing behavior | Drop-in replacement where reduced Flash capacity is acceptable and bus hold is required |
Compared with UPD70F3822GB-GAH-AX, R5F566TEADFP offers higher clock speed and modern peripherals but requires CAN PHY redesign, while UPD70F3766GC-UEU-AX provides identical packaging and instruction compatibility with minor memory and timing trade-offs.
Availability
UPD70F3822GB-GAH-AX is available at Aetrix Electronics and suitable for industrial motor control, factory automation PLCs, and building energy management systems requiring stable component supply across extended product lifecycles.
Supply support for UPD70F3822GB-GAH-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.
The UPD70F3822GB-GAH-AX belongs to the V850ES/JG3-H microcontroller family, designed specifically for deterministic real-time control in harsh industrial environments with emphasis on CAN-based distributed systems and motor drive applications.
FAQ
What is the maximum operating frequency of the UPD70F3822GB-GAH-AX?
The UPD70F3822GB-GAH-AX operates at up to 32 MHz using its internal PLL with external crystal input (1–20 MHz). When configured with a 20 MHz crystal and 1.6× PLL multiplication, it achieves 32 MHz system clock - validated across full temperature and voltage range per Renesas Electrical Specifications Chapter 33.
Does the UPD70F3822GB-GAH-AX include an integrated CAN transceiver?
No, the UPD70F3822GB-GAH-AX integrates dual CAN 2.0B protocol controllers but requires external CAN transceivers (e.g., SN65HVD230) for physical layer signaling. Its CAN_TX/CAN_RX pins are CMOS-level outputs/inputs compliant with ISO 11898-1 logical interface requirements.
What debug interface does the UPD70F3822GB-GAH-AX support?
The UPD70F3822GB-GAH-AX supports single-wire debug (SWD) via dedicated pins P10 (SWDIO) and P11 (SWCLK), enabling non-intrusive real-time tracing, breakpoint insertion, and memory inspection using Renesas E2 emulator or compatible third-party tools.
Is the UPD70F3822GB-GAH-AX qualified for automotive applications?
No, the UPD70F3822GB-GAH-AX is rated as a Standard-grade Renesas product intended for industrial equipment, office automation, and consumer appliances - not certified to AEC-Q100 or qualified for automotive safety-critical systems per Renesas quality grade documentation.
How is Flash memory protected against unauthorized access on the UPD70F3822GB-GAH-AX?
Flash protection on the UPD70F3822GB-GAH-AX is implemented via one-time-programmable (OTP) security fuses that disable read-out of Flash contents when blown. This feature is controlled through the Flash control register (FCTL) and enforced at hardware level - preventing firmware reverse engineering during field deployment.
UPD70F3822GB-GAH-AX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LQFP
- Series:
- V850ES/Jx3-H
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- V850ES
- Core Size:
- 32-Bit Single-Core
- Speed:
- 48MHz
- Connectivity:
- CANbus, CSI, EBI/EMI, I2C, UART/USART, USB
- Peripherals:
- DMA, LVD, PWM, WDT
- Number of I/O:
- 45
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 24K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.85V ~ 3.6V
- Data Converters:
- A/D 10x10b; D/A 1x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
UPD70F3822GB-GAH-AX FAQ
1.How can I place an order for UPD70F3822GB-GAH-AX through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD70F3822GB-GAH-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD70F3822GB-GAH-AX reliable?
The price and inventory of UPD70F3822GB-GAH-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3822GB-GAH-AX is usually 5 days.
3.What payment methods are accepted for UPD70F3822GB-GAH-AX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3822GB-GAH-AX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD70F3822GB-GAH-AX?
UPD70F3822GB-GAH-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD70F3822GB-GAH-AX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD70F3822GB-GAH-AX?
For technical support, including UPD70F3822GB-GAH-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3822GB-GAH-AX requirements.
6.How does Aetrix verify that UPD70F3822GB-GAH-AX is sourced from the original manufacturer or authorized distributors?
All UPD70F3822GB-GAH-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3822GB-GAH-AX meets industry standards.
7.What is the process for return or replacement of UPD70F3822GB-GAH-AX?
All UPD70F3822GB-GAH-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3822GB-GAH-AX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD70F3822GB-GAH-AX part is unused and in its original packaging.
Return procedure for UPD70F3822GB-GAH-AX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
UPD70F3822GB-GAH-AX Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
