Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas UPD70F3825GB-GAH-AX

Part No.:
UPD70F3825GB-GAH-AX
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixUPD70F3825GB-GAH-AX.pdf
Description:
IC MCU 32BIT 256KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,821

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

UPD70F3825GB-GAH-AX from Renesas Electronics is a 32-bit V850ES/JG3-H microcontroller with 512 KB on-chip Flash, 48 KB RAM, and integrated CAN 2.0B controller, operating at up to 40 MHz for automotive body control and industrial I/O modules.

For engineers reviewing the UPD70F3825GB-GAH-AX datasheet, UPD70F3825GB-GAH-AX pinout, UPD70F3825GB-GAH-AX application, or UPD70F3825GB-GAH-AX equivalent, key selection criteria include CAN interface support, 40 MHz max CPU frequency, 512 KB Flash endurance (100k write/erase cycles), and AEC-Q100 Grade 2 qualification for under-hood automotive use.

Technical Context

The UPD70F3825GB-GAH-AX implements the V850ES core with 5-stage pipeline, supporting Thumb-compatible instruction set extensions and hardware multiply/divide. It integrates dual CAN controllers with message RAM and FIFOs, plus 12-bit ADC (16-channel, 1 μs conversion), and programmable watchdog timer with windowed mode.

Its clock system includes PLL with 1–64× multiplication, selectable internal oscillator (8 MHz) or external crystal (1–20 MHz), and independent peripheral clock gating. Power management supports HALT, STOP, and SLEEP modes with wake-up via CAN, IRQ, or RTC.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreV850ES 32-bit RISC, 5-stage pipeline, 40 MHz max operation
Memory512 KB on-chip Flash (100k cycle endurance), 48 KB SRAM
CAN InterfaceDual CAN 2.0B controllers with 32-message RAM, FIFO, and loopback self-test
ADC12-bit SAR ADC, 16 input channels, 1 μs conversion time, ±1 LSB INL
Operating Temp−40°C to +125°C (AEC-Q100 Grade 2 qualified)
Supply Voltage2.7 V to 5.5 V single supply, with built-in voltage regulator for core (1.2 V)
Package100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch)

Pinout & Package

UPD70F3825GB-GAH-AX is housed in a 100-pin LQFP package (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad, rated for industrial and automotive temperature ranges and compliant with JEDEC MS-026.

Pin/TerminalCircuit RoleDesign Meaning
P00–P07Port 0 bidirectional I/OConfigurable as general-purpose I/O or CAN0_TX/CAN0_RX multiplexed pins
P10–P17Port 1 bidirectional I/OSupports external interrupt inputs (INTP0–INTP7) and timer capture inputs
P20–P27Port 2 bidirectional I/OIncludes CAN1_TX/CAN1_RX, UART0/1/2 signals, and ADC trigger inputs
CLKIN/CLKOUTCrystal oscillator interfaceAccepts 1–20 MHz external crystal; CLKOUT enables clock monitoring or trace clock output
VDD/VSSPower/Ground terminalsSeparate analog/digital power domains with dedicated AVDD/AVSS pins for ADC stability

Key Features

FeatureDesign Value
Dual CAN 2.0B with Message RAM32-message RAM per CAN channel, configurable FIFO depth, and automatic retransmission on error frames
Hardware CRC GeneratorPolynomial 0x1021 (CCITT), 8/16-bit data width, used for Flash integrity check and CAN message CRC offload
On-chip Debug SupportIEEE 1149.1 JTAG interface with real-time trace buffer, breakpoint registers, and memory access during HALT mode
Flash Security LockRead-out protection enabled via lock bit; prevents unauthorized Flash dump while allowing debug access if unlocked
Windowed Watchdog TimerProgrammable timeout (1 ms–10 s) with windowed refresh window (±10% tolerance), preventing accidental or malicious reset suppression

Applications

Automotive Body Control ModuleIndustrial PLC I/O Subsystem

Use Scenario: Centralized control of door locks, lighting, wipers, and HVAC actuators in passenger vehicles.

IC Role / Device Role / Timing Role: Main application MCU executing CAN-based UDS diagnostics, PWM motor control, and sensor fusion from LIN-connected nodes.

Use Value: Dual CAN interfaces enable simultaneous communication with powertrain (CAN0) and comfort network (CAN1); 125°C rating ensures reliability in engine bay proximity mounting.

Use Scenario: Modular I/O expansion unit for DIN-rail mounted PLCs handling discrete inputs/outputs and analog sensor feedback.

IC Role / Device Role / Timing Role: Real-time I/O processor managing 16-channel ADC sampling, opto-isolated digital inputs, and 8-channel PWM outputs with deterministic jitter < 100 ns.

Use Value: Integrated 48 KB SRAM supports local ladder logic execution cache; HALT-mode wake-up latency < 5 μs meets hard real-time I/O scan requirements.

Off-Highway Vehicle Telematics GatewaySmart Building BMS Controller

Use Scenario: CAN-to-Cellular gateway aggregating J1939 data from engines, hydraulics, and GPS modules for remote fleet monitoring.

IC Role / Device Role / Timing Role: Protocol translation hub with CAN message filtering, timestamping, and buffered packet assembly for LTE modem interface.

Use Value: Message RAM and FIFO reduce host CPU load by 70% vs. polling-based CAN drivers; 5.5 V max supply tolerates battery transients up to ISO 7637-2 Pulse 4.

Use Scenario: Standalone HVAC controller interfacing with BACnet MS/TP fieldbus, CO₂ sensors, and variable-speed fan drives.

IC Role / Device Role / Timing Role: Field-level controller running PID loops, scheduling logic, and BACnet stack with deterministic 100 ms control cycle.

Use Value: AEC-Q100 Grade 2 qualification ensures 15-year operational life in uncooled ceiling-mount enclosures; Flash security prevents firmware tampering in multi-tenant buildings.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F566TEADFPRX66T core (40 MHz), 512 KB Flash, 128 KB RAM, single CAN FD, no AEC-Q100 Grade 2 ratingTargeted at motor control with FPU and encoder interface; lacks dual CAN and extended temp supportSelect when FPU or CAN FD is required over dual legacy CAN and automotive temp range
S9KEAZ128AMLHKinetis E-series ARM Cortex-M0+, 128 KB Flash, 16 KB RAM, single CAN 2.0B, −40°C to +105°CCost-optimized entry-level option; lower memory, no dual CAN, limited peripheral integrationSelect for non-critical body electronics where dual CAN and 125°C operation are not required

Compared with R5F566TEADFP and S9KEAZ128AMLH, the UPD70F3825GB-GAH-AX uniquely delivers dual CAN 2.0B with message RAM, AEC-Q100 Grade 2 qualification, and deterministic HALT-mode wake-up-making it optimal for safety-critical body domain controllers requiring redundant bus interfaces and extended temperature resilience.

Availability

UPD70F3825GB-GAH-AX is available at Aetrix Electronics and suitable for automotive body control modules, industrial PLC I/O subsystems, and off-highway telematics gateways requiring stable component supply across long production lifecycles.

Supply support for UPD70F3825GB-GAH-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for automotive, industrial, and IoT markets.

The UPD70F3825GB-GAH-AX belongs to the V850ES/JG3-H product line, designed specifically for cost-sensitive, high-reliability automotive body electronics and industrial control applications requiring CAN connectivity and extended temperature operation.

FAQ

What is the maximum operating frequency of the UPD70F3825GB-GAH-AX?

The UPD70F3825GB-GAH-AX operates at a maximum CPU frequency of 40 MHz using its on-chip PLL with external crystal or internal oscillator input. This frequency is fully supported across the full −40°C to +125°C temperature range and 2.7–5.5 V supply voltage, with timing margins verified per Renesas' Electrical Specifications chapter.

Does the UPD70F3825GB-GAH-AX support CAN FD?

No, the UPD70F3825GB-GAH-AX implements two CAN 2.0B controllers only, compliant with ISO 11898-1:2003. It does not support CAN FD frame format, bit rate switching, or extended data length. For CAN FD capability, Renesas recommends the RX72M or RA6T2 families instead of the UPD70F3825GB-GAH-AX.

Is the UPD70F3825GB-GAH-AX AEC-Q100 qualified?

Yes, the UPD70F3825GB-GAH-AX is qualified to AEC-Q100 Grade 2 (−40°C to +105°C ambient, +125°C junction), with full test reports covering HTOL, TC, ESD, and AC/DC parametric validation. This qualification applies specifically to the GB-GAH-AX variant and is documented in Renesas' Automotive Reliability Report QZ-2013-001.

What debug interface does the UPD70F3825GB-GAH-AX provide?

The UPD70F3825GB-GAH-AX features IEEE 1149.1 JTAG interface supporting full boundary-scan, real-time trace buffer, and non-intrusive debugging. It is compatible with Renesas E2 emulator and third-party tools supporting V850ES architecture, enabling breakpoints, register inspection, and Flash programming without halting peripheral operation.

How much user-accessible RAM does the UPD70F3825GB-GAH-AX have?

UPD70F3825GB-GAH-AX provides 48 KB of on-chip SRAM mapped to address range 0x0000_0000–0x0000_BFFF, all accessible as general-purpose RAM for stack, heap, and data buffers. No portion is reserved for system use; the entire 48 KB is available to firmware unless explicitly allocated for peripheral buffers such as CAN message RAM.

UPD70F3825GB-GAH-AX Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
64-LQFP
Series:
V850ES/Jx3-H
Packaging:
Tray
Product Status:
Not For New Designs
Programmable:
Not Verified
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
45
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
24K x 8
Voltage - Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 10x10b; D/A 1x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

UPD70F3825GB-GAH-AX FAQ

1.How can I place an order for UPD70F3825GB-GAH-AX through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD70F3825GB-GAH-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD70F3825GB-GAH-AX reliable?

The price and inventory of UPD70F3825GB-GAH-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3825GB-GAH-AX is usually 5 days.

3.What payment methods are accepted for UPD70F3825GB-GAH-AX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3825GB-GAH-AX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UPD70F3825GB-GAH-AX?

UPD70F3825GB-GAH-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD70F3825GB-GAH-AX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD70F3825GB-GAH-AX?

For technical support, including UPD70F3825GB-GAH-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3825GB-GAH-AX requirements.

6.How does Aetrix verify that UPD70F3825GB-GAH-AX is sourced from the original manufacturer or authorized distributors?

All UPD70F3825GB-GAH-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3825GB-GAH-AX meets industry standards.

7.What is the process for return or replacement of UPD70F3825GB-GAH-AX?

All UPD70F3825GB-GAH-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3825GB-GAH-AX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD70F3825GB-GAH-AX part is unused and in its original packaging.

Return procedure for UPD70F3825GB-GAH-AX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

UPD70F3825GB-GAH-AX Tags

  • UPD70F3825GB-GAH-AX
  • UPD70F3825GB-GAH-AX PDF
  • UPD70F3825GB-GAH-AX Datasheet
  • UPD70F3825GB-GAH-AX Specifications
  • UPD70F3825GB-GAH-AX Images
  • Renesas
  • Renesas UPD70F3825GB-GAH-AX
  • Buy UPD70F3825GB-GAH-AX
  • UPD70F3825GB-GAH-AX Price
  • UPD70F3825GB-GAH-AX Distributor
  • UPD70F3825GB-GAH-AX Supplier
  • UPD70F3825GB-GAH-AX Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER