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Renesas UPD70F3826GB(R)-GAH-AX

Part No.:
UPD70F3826GB(R)-GAH-AX
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixUPD70F3826GB(R)-GAH-AX.pdf
Description:
IC MCU 32BIT 64KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,568

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Product details

Overview

UPD70F3826GB(R)-GAH-AX from Renesas is a 32-bit V850ES/JE3-E single-chip microcontroller with 64 KB Flash, 32 KB RAM (including 16 KB data RAM), 26 I/O pins, 10-bit A/D converter (10 channels), Ethernet controller, USB function controller, and 54 internal interrupt sources. It operates at 2.85–3.6 V and −40 to +85°C, targeting embedded networked peripherals such as printers and home audio systems.

For engineers reviewing the UPD70F3826GB(R)-GAH-AX datasheet, UPD70F3826GB(R)-GAH-AX pinout, UPD70F3826GB(R)-GAH-AX application, or UPD70F3826GB(R)-GAH-AX equivalent, key selection criteria include its 64-pin LQFP package, integrated Ethernet PHY interface (P1MDIO/P1MDC/P1COL/P1CRS), real-time output function (6-bit), and CAN absence - distinguishing it from UPD70F3829GB(R)-GAH-AX.

Technical Context

The UPD70F3826GB(R)-GAH-AX implements the V850ES architecture with 32×32-bit general-purpose registers, hardware 16×16→32-bit multiplier, saturation instructions, and bit manipulation support. Its CPU executes instructions in one clock cycle at up to 50 MHz (20 ns min), enabled by PLL-based clock generation (fX = 3–6.25 MHz → fXX = 24–50 MHz).

Peripheral integration includes a 4-channel DMA controller targeting on-chip RAM and peripheral I/O, 5-channel 16-bit timer/event counter AA (TAA) with interval capability, 4-channel 16-bit interval timer M (TMM), and dedicated real-time counter (RTC) and watchdog timer (WDT). No motor control or CAN functions are implemented in this JE3-E variant.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreV850ES/JE3-E 32-bit RISC with 83-instruction set and one-cycle execution at 50 MHz
Flash Memory64 KB on-chip Flash for program storage; supports in-system programming
RAM32 KB total RAM (16 KB data RAM + 16 KB general-purpose RAM)
I/O Pins26 programmable I/O lines, including 12 5 V-tolerant inputs for mixed-voltage interfacing
A/D Converter10-bit resolution × 10 channels; enables analog sensor monitoring without external ADC
Ethernet InterfaceIntegrated 10/100 Mbps Ethernet controller with dedicated PHY pins (P1MDIO, P1MDC, P1COL, P1CRS)
USB FunctionFull-speed USB 2.0 device controller (UDMF/UDPF/UVDD pins); no host capability
Operating Voltage2.85–3.6 V supply range; compatible with standard 3.3 V logic and power rails

Pinout & Package

Package: 64-pin plastic LQFP (fine pitch, 10 × 10 mm), RoHS-compliant lead-free construction.

Pin/TerminalCircuit RoleDesign Meaning
P1MDIOEthernet PHY Management Data I/OBi-directional MDIO signal for IEEE 802.3-compliant PHY register access
P1MDCEthernet PHY Management ClockOutput-only 2.5 MHz clock for MDIO bus timing synchronization
P1COLEthernet Collision DetectionInput indicating simultaneous transmit/receive on shared medium (half-duplex mode)
P1CRSEthernet Carrier SenseInput asserting when medium is busy; used for CSMA/CD arbitration
P70–P79Analog Input Channels10 dedicated pins (ANI0–ANI9) for 10-bit A/D conversion with internal reference (AVREF0)
X1/X2Main Crystal OscillatorConnects 3–6.25 MHz crystal for PLL-based system clock generation
XT1/XT2Sub-clock CrystalConnects 32.768 kHz crystal for RTC and low-power wake-up timing
RESETActive-Low Reset InputAsynchronous reset assertion resets CPU, peripherals, and internal registers

Key Features

FeatureDesign Value
Hardware Multiplier16×16→32-bit signed multiplication in single cycle; accelerates DSP-like math and control loops
Saturation ArithmeticPrevents overflow wraparound in fixed-point calculations; critical for motor and audio control stability
Real-Time Output (RTO)6-bit programmable output port with independent timing control; supports precise waveform generation
Power-Save ModesHALT, IDLE1, IDLE2, STOP, subclock, and sub-IDLE modes; enables <1 μA standby current in STOP mode
On-Chip DebugMINICUBE and MINICUBE2 support via DDI/DCK/DDO/DRST pins; enables non-intrusive real-time debugging
Internal Oscillator220 kHz RC oscillator (fR) for clock fallback and low-power wake-up without external crystal

Applications

Printer Control UnitHome Audio Network Node

Use Scenario: Embedded controller managing print job queuing, raster image processing, and bidirectional communication with PC/host.

IC Role / Device Role / Timing Role: Central MCU executing real-time print engine timing, Ethernet packet handling, and USB device enumeration.

Use Value: Integrated Ethernet and USB eliminate external PHY/interface ICs; 64 KB Flash accommodates firmware + font storage.

Use Scenario: Networked audio streamer receiving PCM data over Ethernet and converting to analog output via DAC.

IC Role / Device Role / Timing Role: System-on-chip managing Ethernet MAC layer, USB audio class compliance, and A/D monitoring of front-panel controls.

Use Value: 10-bit A/D converter reads volume knobs and buttons; real-time output drives LED indicators with precise PWM timing.

Industrial Ethernet GatewaySmart Home Hub Controller

Use Scenario: Protocol translator bridging Modbus RTU field devices to Ethernet/IP networks in building automation.

IC Role / Device Role / Timing Role: Deterministic Ethernet controller with DMA-accelerated packet buffering and UARTC-based serial protocol parsing.

Use Value: 4-channel DMA enables zero-copy packet forwarding between Ethernet and UARTC; 54 interrupt sources handle concurrent fieldbus events.

Use Scenario: Central hub aggregating Zigbee/Z-Wave sensor data and exposing REST API over Ethernet to cloud services.

IC Role / Device Role / Timing Role: Secure network endpoint with Ethernet MAC, USB for firmware updates, and A/D for environmental sensing (temp/humidity).

Use Value: 26 I/O pins support GPIO expansion headers; 32 KB RAM buffers encrypted TLS handshake and MQTT payloads.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
UPD70F3827GB(R)-GAH-AX128 KB Flash, 48 KB RAM (same JE3-E core, 64-pin LQFP)Supports larger firmware images and more complex protocol stacks (e.g., full TCP/IP stack + web server)Select when firmware size exceeds 64 KB or additional RAM is required for dynamic heap allocation.
UPD70F3830GK(R)-GAK-AX80-pin LQFP, 42 I/O, 1-channel motor control, 57 internal interrupts (V850ES/JF3-E)Enables direct BLDC motor drive with complementary PWM outputs; adds UARTC channel 4 and CSIF channel 3Choose for applications requiring motor actuation alongside Ethernet, where extra I/O and timer resources justify larger package.

Compared with UPD70F3826GB(R)-GAH-AX, UPD70F3827GB(R)-GAH-AX offers double Flash/RAM for scalable firmware, while UPD70F3830GK(R)-GAK-AX trades compactness for expanded I/O, motor control, and interrupt capacity - making each optimal for distinct BOM cost vs. feature trade-offs.

Availability

UPD70F3826GB(R)-GAH-AX is available at Aetrix Electronics and suitable for printer control units, home audio network nodes, and industrial Ethernet gateways requiring stable component supply across long-life production cycles.

Supply support for UPD70F3826GB(R)-GAH-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The V850ES/JE3-E product line delivers deterministic real-time performance for networked embedded systems, emphasizing Ethernet connectivity, low-power operation, and code efficiency in resource-constrained environments.

FAQ

What is the maximum operating frequency of the UPD70F3826GB(R)-GAH-AX?

The UPD70F3826GB(R)-GAH-AX achieves a minimum instruction execution time of 20 ns, corresponding to a maximum system clock frequency of 50 MHz when using the PLL mode (fX = 3–6.25 MHz multiplied by 8). This frequency is sustained across the full operating voltage range (2.85–3.6 V) and temperature range (−40 to +85°C).

Does the UPD70F3826GB(R)-GAH-AX include a CAN controller?

No, the UPD70F3826GB(R)-GAH-AX does not include a CAN controller. CAN functionality is only present in specific variants within the family: UPD70F3829GB(R)-GAH-AX (JE3-E), UPD70F3833GK(R)-GAK-AX (JF3-E), and UPD70F3837GC(R)-UEU-AX (JG3-E). The UPD70F3826GB(R)-GAH-AX omits CAN to reduce cost and complexity for Ethernet-focused applications.

What debug interfaces are supported by the UPD70F3826GB(R)-GAH-AX?

The UPD70F3826GB(R)-GAH-AX supports Renesas MINICUBE and MINICUBE2 debug adapters via four dedicated pins: DDI (debug data input), DDO (debug data output), DCK (debug clock), and DRST (debug reset). These enable non-intrusive real-time debugging, flash programming, and breakpoint execution without requiring JTAG TAP logic.

How is the Ethernet PHY interfaced on the UPD70F3826GB(R)-GAH-AX?

The UPD70F3826GB(R)-GAH-AX integrates a Media Access Controller (MAC) but requires an external PHY chip. It connects via the standard MII interface using dedicated pins: P1MDIO (management data I/O), P1MDC (management clock), P1COL (collision detect), P1CRS (carrier sense), and the eight-bit receive/transmit data bus (P1RXD0–P1RXD3, P1TXD0–P1TXD3).

What power-saving modes are available on the UPD70F3826GB(R)-GAH-AX?

The UPD70F3826GB(R)-GAH-AX supports six power-save modes: HALT (CPU stopped, peripherals active), IDLE1/IDLE2 (reduced clock to CPU/peripherals), STOP (all clocks halted except subclock), subclock (RTC running on 32.768 kHz), and sub-IDLE (subclock + selected peripherals). In STOP mode, current consumption drops below 1 μA, enabling battery-backed operation for extended periods.

UPD70F3826GB(R)-GAH-AX Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
64-LQFP
Series:
V850ES/Jx3-E
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
CANbus, CSI, Ethernet, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
26
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

UPD70F3826GB(R)-GAH-AX FAQ

1.How can I place an order for UPD70F3826GB(R)-GAH-AX through Aetrix?

Please submit a Request for Quotation (RFQ) for UPD70F3826GB(R)-GAH-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UPD70F3826GB(R)-GAH-AX reliable?

The price and inventory of UPD70F3826GB(R)-GAH-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3826GB(R)-GAH-AX is usually 5 days.

3.What payment methods are accepted for UPD70F3826GB(R)-GAH-AX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3826GB(R)-GAH-AX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UPD70F3826GB(R)-GAH-AX?

UPD70F3826GB(R)-GAH-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UPD70F3826GB(R)-GAH-AX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UPD70F3826GB(R)-GAH-AX?

For technical support, including UPD70F3826GB(R)-GAH-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3826GB(R)-GAH-AX requirements.

6.How does Aetrix verify that UPD70F3826GB(R)-GAH-AX is sourced from the original manufacturer or authorized distributors?

All UPD70F3826GB(R)-GAH-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3826GB(R)-GAH-AX meets industry standards.

7.What is the process for return or replacement of UPD70F3826GB(R)-GAH-AX?

All UPD70F3826GB(R)-GAH-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3826GB(R)-GAH-AX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UPD70F3826GB(R)-GAH-AX part is unused and in its original packaging.

Return procedure for UPD70F3826GB(R)-GAH-AX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

UPD70F3826GB(R)-GAH-AX Tags

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