Renesas UPD70F3827GB(R)-GAH-AX

Overview

UPD70F3827GB(R)-GAH-AX from Renesas is a 32-bit V850ES/JE3-E single-chip microcontroller with 128 KB on-chip Flash, 32 KB RAM (including 16 KB data RAM), 26 I/O lines, 10-bit A/D converter (10 channels), Ethernet controller, USB function controller, and 58 internal interrupt sources. It operates at up to 50 MHz (20 ns instruction cycle) and targets embedded networking applications requiring real-time Ethernet connectivity.

For engineers reviewing the UPD70F3827GB(R)-GAH-AX datasheet, UPD70F3827GB(R)-GAH-AX pinout, UPD70F3827GB(R)-GAH-AX application, or UPD70F3827GB(R)-GAH-AX equivalent, key selection criteria include its 64-pin LQFP package, 2.85–3.6 V supply, integrated Ethernet PHY interface (MII), CAN support (in JE3-E family variants), and V850ES architecture compatibility for legacy code migration.

Technical Context

The UPD70F3827GB(R)-GAH-AX implements the V850ES/JE3-E CPU core with 32-bit barrel shifter, hardware 16×16→32 multiplier, saturation arithmetic, and bit manipulation instructions. Its memory map spans 64 MB linear address space, supporting in-system programming via FLMD0/FLMD1 pins.

It integrates a full Ethernet MAC layer with MII interface (P1MDIO/P1MDC/P1COL/P1CRS/P1RXCLK/P1RXD0–3/P1RXDV/P1RXER/P1TXCLK/P1TXD0–3/P1TXEN/P1TXER), USB 2.0 function controller (UDMF/UDPF/UVDD), and dual serial interfaces: UARTC (3 channels) and CSIF (2 channels), plus I²C (2 channels).

Key Specifications

Pinout & Package

Package: 64-pin plastic LQFP (fine pitch, 10 × 10 mm), RoHS-compliant lead-free construction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit Ethernet-capable microcontroller applications.

Compared with RX63N and UPD70F3829GB(R)-GAH-AX, the UPD70F3827GB(R)-GAH-AX offers optimal balance of proven V850ES toolchain support, sufficient memory for mid-tier Ethernet applications, and lowest BOM cost in the JE3-E family-without requiring layout changes or PHY redesign.

Availability

UPD70F3827GB(R)-GAH-AX is available at Aetrix Electronics and suitable for home audio networking, industrial print controllers, and networked scanner systems requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant manufacturing.

Supply support for UPD70F3827GB(R)-GAH-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and SoC products for automotive, industrial, and IoT markets.

The V850ES/JE3-E product line was designed for cost-sensitive, real-time embedded applications requiring Ethernet connectivity, deterministic interrupt response, and legacy V850 software compatibility-targeting industrial control and networked peripherals.

FAQ

What is the maximum operating frequency of the UPD70F3827GB(R)-GAH-AX?

The UPD70F3827GB(R)-GAH-AX supports a maximum system clock frequency of 50 MHz, achieving a minimum instruction execution time of 20 ns when operating in PLL mode with main clock (fXX) at 50 MHz. This is confirmed in the preliminary datasheet R01DS0029EJ0001 Rev.0.01, Page 2, under "Clocks" and "Minimum instruction execution time." The core achieves one-clock-pitch instruction execution for most operations.

Does the UPD70F3827GB(R)-GAH-AX include an integrated Ethernet PHY?

No, the UPD70F3827GB(R)-GAH-AX integrates only the Ethernet MAC layer and requires an external PHY chip. It provides a full MII interface (P1MDIO, P1MDC, P1COL, P1CRS, P1RXCLK, P1RXD0–3, P1RXDV, P1RXER, P1TXCLK, P1TXD0–3, P1TXEN, P1TXER) as documented in the pin configuration diagram (Page 6) and internal block diagram (Page 11). The device does not include physical layer circuitry such as transformers or differential drivers.

What is the Flash and RAM capacity of the UPD70F3827GB(R)-GAH-AX?

The UPD70F3827GB(R)-GAH-AX contains 128 KB of on-chip Flash memory and 32 KB of on-chip RAM, of which 16 KB is designated as data RAM. This is explicitly stated in the V850ES/JE3-E function list (Page 2, Table) and confirmed in the internal block diagram notes (Page 11, Note 1 and 2). The Flash supports in-system programming via FLMD0/FLMD1 pins.

Is the UPD70F3827GB(R)-GAH-AX pin-compatible with other V850ES/JE3-E devices?

Yes, the UPD70F3827GB(R)-GAH-AX shares the same 64-pin LQFP package and identical pinout with UPD70F3826GB-GAH-AX, UPD70F3828GB-GAH-AX, and UPD70F3829GB-GAH-AX, as verified in the ordering information (Page 5) and pin configuration diagrams (Pages 6–7). All JE3-E LQFP variants use identical pin numbering and signal assignments, enabling direct substitution within the same Flash/RAM tier or upward migration.

Does the UPD70F3827GB(R)-GAH-AX support CAN communication?

No, the UPD70F3827GB(R)-GAH-AX does not support CAN. While the V850ES/JE3-E family includes CAN in the μPD70F3829 variant only (Page 1, Description; Page 11, Note 3), the UPD70F3827GB(R)-GAH-AX is not listed among the CAN-enabled models. Its serial interface resources are limited to UARTC (3 channels), CSIF (2 channels), and I²C (2 channels), with no CRXD0/CTXD0 pins assigned or enabled per the JE3-E function table (Page 2).