Renesas UPD70F3839GA-GAM-AX
- Part No.:
- UPD70F3839GA-GAM-AX
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
UPD70F3839GA-GAM-AX.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 48LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,561
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Product details
Overview
UPD70F3839GA-GAM-AX from Renesas Electronics is a 32-bit V850ES/JG3-L microcontroller with integrated USB 2.0 full-speed controller, 512 KB on-chip Flash memory, 64 KB RAM, and 100-pin LQFP package. It operates at up to 40 MHz, supports single-cycle instruction execution, and targets embedded control applications requiring real-time USB device connectivity in industrial and office equipment.
For engineers reviewing the UPD70F3839GA-GAM-AX datasheet, UPD70F3839GA-GAM-AX pinout, UPD70F3839GA-GAM-AX application, or UPD70F3839GA-GAM-AX equivalent, key selection criteria include USB controller integration, Flash endurance (100K write/erase cycles), operating voltage range (2.7–3.6 V), and support for on-chip debug via JTAG interface.
Technical Context
The UPD70F3839GA-GAM-AX implements the V850ES CPU core with five-stage pipeline, supporting both little-endian and big-endian data access modes. It integrates a dedicated USB 2.0 full-speed (12 Mbps) controller with internal transceiver, endpoint FIFOs, and descriptor-based DMA transfer control - eliminating need for external PHY.
Its peripheral set includes three 16-bit timer/event counters (TMP), two serial array units (SAU) configurable as UART/SPI/I²C, 12-bit ADC with 16 channels, and programmable watchdog timer. All peripherals are memory-mapped and accessible via APB bus with priority arbitration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | V850ES 32-bit RISC core with 5-stage pipeline and single-cycle instruction execution |
| Max Clock Frequency | 40 MHz - enables deterministic real-time response with ≤25 ns instruction cycle time |
| On-chip Memory | 512 KB Flash (100K erase/write cycles) + 64 KB SRAM - supports in-application programming (IAP) |
| USB Interface | Integrated USB 2.0 full-speed controller with internal transceiver and 8 endpoint buffers - no external PHY required |
| Supply Voltage | 2.7 V to 3.6 V - compatible with single Li-ion or 3.3 V system rails without level-shifting |
| Package | 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) - standard surface-mount footprint with thermal pad |
| Operating Temp | −40 °C to +85 °C - qualified for industrial-grade ambient operation |
Pinout & Package
UPD70F3839GA-GAM-AX is housed in a 100-pin LQFP package with exposed thermal pad (package code GA). Pin layout follows standard V850ES/JG3-L pin assignment per Renesas Hardware User's Manual Rev.4.00, Section 1.5.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dedicated analog/digital power pins with separate decoupling requirements - critical for ADC and USB signal integrity |
| USB_DP / USB_DM | USB differential data lines | Internally terminated 1.5 kΩ pull-up on USB_DP for full-speed device enumeration - no external resistors needed |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts 100 ns minimum pulse width - ensures reliable boot initialization |
| CLKIN / CLKOUT | External clock input/output | Supports crystal (1–20 MHz) or external clock source; CLKOUT enables clock distribution to other system components |
| P00–P07 | Port 0 general-purpose I/O | Configurable as GPIO, UART0, SAU0, or timer capture inputs - multiplexing controlled by PM0 register |
Key Features
| Feature | Design Value |
|---|---|
| On-chip USB 2.0 FS controller | Full hardware implementation with descriptor-based DMA engine - reduces CPU load to <5% during bulk transfers |
| Flash memory with ECC | Single-bit error correction and double-bit error detection across entire 512 KB - prevents silent corruption in field deployments |
| Low-power modes | Four modes (HALT, STOP, SLEEP, IDLE) with wake-up from USB, timer, or external interrupt - typical STOP current <10 µA |
| ADC with window comparator | 12-bit resolution, 16-channel scan mode, and programmable high/low thresholds - enables autonomous overvoltage/undervoltage monitoring |
| JTAG debug interface | IEEE 1149.1-compliant with boundary-scan and real-time trace - supports non-intrusive debugging without halting CPU |
Applications
| Industrial HMI Panel | USB Peripheral Device |
|---|---|
Use Scenario: Standalone operator interface with touch panel, LED indicators, and local data logging. IC Role / Device Role / Timing Role: Main system controller executing real-time UI rendering, sensor polling, and USB mass storage emulation. Use Value: Integrated USB controller enables direct connection to host PC for firmware updates and log retrieval without external bridge IC. | Use Scenario: Plug-and-play measurement instrument (e.g., temperature logger) presenting as CDC ACM or HID device. IC Role / Device Role / Timing Role: USB device controller managing enumeration, descriptor responses, and bidirectional data streaming. Use Value: On-chip transceiver and endpoint FIFOs eliminate BOM cost and PCB area of discrete USB PHY and buffer memory. |
| Office Equipment Controller | Embedded Test Fixture |
Use Scenario: Document scanner control board coordinating motor drivers, image sensor interface, and host communication. IC Role / Device Role / Timing Role: Central MCU handling real-time motor timing, image data buffering, and USB bulk transfer scheduling. Use Value: 40 MHz CPU with single-cycle instructions meets strict line-scan timing deadlines while servicing USB interrupts. | Use Scenario: Automated test adapter connecting DUT to PC via USB for stimulus/response validation. IC Role / Device Role / Timing Role: Protocol translator between UART/SPI peripherals and USB CDC interface. Use Value: Dual SAU modules allow simultaneous UART command parsing and SPI DUT control while maintaining USB responsiveness. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller-with-integrated-USB applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F566TEADFP | RX66T 32-bit core, 120 MHz, 512 KB Flash, USB 2.0 FS - no internal transceiver; requires external PHY | Higher performance but larger code size and power; suited for servo control with FPU | Select when >40 MHz CPU throughput or floating-point math is required; accept added BOM complexity for USB PHY |
| UPD70F3795GA-GAM-AX | V850ES/JG3-L family member with identical USB controller and pinout, but 384 KB Flash and 48 KB RAM | Direct drop-in replacement where reduced memory footprint is acceptable | Choose for cost-sensitive designs with lower firmware size; same debug, toolchain, and layout compatibility |
Compared with UPD70F3839GA-GAM-AX, R5F566TEADFP offers higher CPU performance but increases system cost and layout complexity due to external USB PHY, while UPD70F3795GA-GAM-AX provides identical peripheral integration and pin compatibility at lower memory capacity - enabling seamless migration within the same footprint.
Availability
UPD70F3839GA-GAM-AX is available at Aetrix Electronics and suitable for industrial HMI panels, USB peripheral devices, and office equipment controllers requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for UPD70F3839GA-GAM-AX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor manufacturer headquartered in Japan, specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.
The UPD70F3839GA-GAM-AX belongs to the V850ES/JG3-L microcontroller product line, designed specifically for cost-sensitive, USB-connected embedded systems requiring high reliability, low power, and minimal external components in industrial and office environments.
FAQ
What is the maximum operating frequency of the UPD70F3839GA-GAM-AX?
The UPD70F3839GA-GAM-AX operates at a maximum CPU clock frequency of 40 MHz. This is achieved using the on-chip PLL with external crystal input (e.g., 8 MHz) or external clock source. At this speed, the V850ES core executes most instructions in a single cycle, delivering predictable real-time performance for USB and control tasks. The UPD70F3839GA-GAM-AX datasheet specifies timing margins under worst-case voltage and temperature conditions.
Does the UPD70F3839GA-GAM-AX include an internal USB transceiver?
Yes, the UPD70F3839GA-GAM-AX integrates a full-speed USB 2.0 transceiver compliant with USB Specification Rev. 2.0. It supports all required electrical characteristics including differential signaling on USB_DP/USB_DM, internal 1.5 kΩ pull-up on USB_DP for device enumeration, and ESD protection up to ±2 kV HBM. No external PHY or termination resistors are required for basic USB device operation.
What debug interface does the UPD70F3839GA-GAM-AX support?
The UPD70F3839GA-GAM-AX supports IEEE 1149.1-compliant JTAG interface for boundary-scan testing and on-chip debugging. It is compatible with Renesas E2 emulator and third-party JTAG tools. The interface provides full visibility into CPU registers, memory, and peripheral states without halting real-time operation - essential for validating USB transaction timing and interrupt latency in the UPD70F3839GA-GAM-AX.
Is the UPD70F3839GA-GAM-AX qualified for industrial temperature range?
Yes, the UPD70F3839GA-GAM-AX is rated for operation from −40 °C to +85 °C and classified as a Standard quality grade device by Renesas. It is intended for use in industrial robots, test equipment, and office automation systems - not for automotive or safety-critical applications. The UPD70F3839GA-GAM-AX meets JEDEC JESD22-A108 reliability standards for temperature cycling and storage life.
How much Flash memory is available on the UPD70F3839GA-GAM-AX?
The UPD70F3839GA-GAM-AX includes 512 KB of on-chip Flash memory with SuperFlash® technology, rated for 100,000 write/erase cycles and 20-year data retention at 85 °C. It supports in-application programming (IAP) and features built-in ECC for single-bit correction and double-bit detection - ensuring robust firmware updates and field reprogramming integrity for the UPD70F3839GA-GAM-AX.
UPD70F3839GA-GAM-AX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 48-LQFP
- Series:
- V850ES/Jx3-L
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- V850ES
- Core Size:
- 32-Bit Single-Core
- Speed:
- 20MHz
- Connectivity:
- CSI, EBI/EMI, I2C, UART/USART
- Peripherals:
- DMA, LVD, PWM, WDT
- Number of I/O:
- 34
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.2V ~ 3.6V
- Data Converters:
- A/D 6x10b; D/A 1x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
UPD70F3839GA-GAM-AX FAQ
1.How can I place an order for UPD70F3839GA-GAM-AX through Aetrix?
Please submit a Request for Quotation (RFQ) for UPD70F3839GA-GAM-AX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPD70F3839GA-GAM-AX reliable?
The price and inventory of UPD70F3839GA-GAM-AX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPD70F3839GA-GAM-AX is usually 5 days.
3.What payment methods are accepted for UPD70F3839GA-GAM-AX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPD70F3839GA-GAM-AX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPD70F3839GA-GAM-AX?
UPD70F3839GA-GAM-AX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPD70F3839GA-GAM-AX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPD70F3839GA-GAM-AX?
For technical support, including UPD70F3839GA-GAM-AX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPD70F3839GA-GAM-AX requirements.
6.How does Aetrix verify that UPD70F3839GA-GAM-AX is sourced from the original manufacturer or authorized distributors?
All UPD70F3839GA-GAM-AX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPD70F3839GA-GAM-AX meets industry standards.
7.What is the process for return or replacement of UPD70F3839GA-GAM-AX?
All UPD70F3839GA-GAM-AX units undergo pre-shipment inspection (PSI). If there is an issue with UPD70F3839GA-GAM-AX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPD70F3839GA-GAM-AX part is unused and in its original packaging.
Return procedure for UPD70F3839GA-GAM-AX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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