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Vishay General Semiconductor - Diodes Division V20PWM63-M3/I

Part No.:
V20PWM63-M3/I
Manufacturer:
Vishay General Semiconductor - Diodes Division
Category:
Single Diodes
Package:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Datasheet:
AetrixV20PWM63-M3/I.pdf
Description:
DIODE SCHOTTKY 60V 20A SLIMDPAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,465

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Product details

Overview

V20PWM63-M3/I from Vishay General Semiconductor is a high-current-density Trench MOS Barrier Schottky (TMBS®) rectifier in SlimDPAK (TO-252AE) package, rated for 60 V reverse voltage and 20 A average forward current, with ultra-low 0.39 V forward voltage at 5 A and 125 °C junction temperature - ideal for low-voltage, high-frequency DC/DC converters in automotive and industrial power supplies.

For engineers reviewing the V20PWM63-M3/I datasheet, V20PWM63-M3/I pinout, V20PWM63-M3/I application, or V20PWM63-M3/I equivalent, key selection criteria include its 0.55 V VF at 20 A/125 °C, 200 A surge rating, AEC-Q101 qualification (via HM3 variant), MSL Level 1 moisture sensitivity, and thermal resistance of 1.8 °C/W junction-to-mount under infinite heatsink conditions.

Technical Context

This TMBS® rectifier uses trench MOS Schottky technology to achieve lower forward voltage and higher current density than planar Schottky diodes, enabling reduced conduction losses in compact power stages. Its single-diode configuration and cathode-anode terminal layout support unidirectional freewheeling and polarity protection without external biasing.

The device operates across -40 °C to +175 °C junction temperature range and features 3000 pF typical junction capacitance at 4.0 V/1 MHz, making it suitable for switching frequencies up to several hundred kHz where low stored charge and fast recovery are critical. Thermal design relies on copper pad area optimization per Fig. 7, with RθJA = 65 °C/W in free air and RθJM = 1.8 °C/W when mounted on an infinite heatsink.

Key Specifications

Parameter Value and Actual Design Meaning
VRRM 60 V - maximum repetitive reverse blocking voltage; defines safe operating limit in buck converter freewheel paths or reverse-polarity protection circuits
IF(AV) 20 A - average forward current with derating above 25 °C ambient; supports continuous output currents in 12 V/24 V DC/DC modules
VF @ 20 A / 125 °C 0.55 V - measured forward voltage under worst-case thermal condition; determines conduction loss of 11 W at full load
IFSM 200 A - non-repetitive peak surge current for 8.3 ms half-sine; withstands inrush and short-circuit transients in automotive ECUs
TJ max. +175 °C - maximum junction temperature; enables operation in under-hood environments without forced cooling
RθJM 1.8 °C/W - junction-to-mount thermal resistance with infinite heatsink; guides heatsink interface material selection and mounting pressure
CJ 3000 pF @ 4 V / 1 MHz - junction capacitance; impacts switching loss and EMI in high-frequency synchronous rectification

Pinout & Package

SlimDPAK (TO-252AE) package with exposed metal die pad serving as cathode (Pin 1), anode (Pin 2), and heatsink tab (Pin 3). Matte tin-plated leads meet J-STD-002 solderability and JESD 22-B102 whisker test Class 2.

Pin/Terminal Circuit Role Design Meaning
Pin 1 (K) Cathode Main current return path; electrically and thermally connected to exposed metal tab - must be soldered to large copper pour for thermal management
Pin 2 (A) Anode Forward current entry point; routed to switch node in buck converters or input rail in polarity protection circuits
Pin 3 (Heatsink) Thermal Pad / Cathode Extension Not electrically isolated; provides primary thermal path to PCB; requires minimum 6.1 mm × 5.97 mm copper pad per datasheet Fig. 7

Key Features

Feature Design Value
Ultra-low VF 0.39 V at 5 A / 125 °C - reduces conduction loss by ≥25% vs. standard Schottky diodes in 5–12 V output rails
Trench MOS Barrier Technology Enables 20 A current rating in SlimDPAK footprint - achieves >30% higher current density than planar Schottky equivalents
MSL Level 1 Rated for peak reflow at 260 °C - compatible with standard lead-free SMT assembly without baking or special handling
AEC-Q101 qualified option HM3 suffix variant available - validated for automotive powertrain and body electronics per stress test requirements
Halogen-free & RoHS-compliant M3 suffix meets JEDEC J-STD-609 Category 1 and EU Directive 2011/65/EU - supports green manufacturing compliance

Applications

Automotive DC/DC Converters Industrial 24 V Power Supplies

Use Scenario: Step-down conversion from 48 V battery to 12 V auxiliary rail in ADAS domain controllers.

IC Role / Device Role / Timing Role: Freewheeling diode in synchronous buck topology, conducting during low-side FET off-time.

Use Value: 0.55 V VF at 20 A/125 °C minimizes heat generation in confined under-hood space while maintaining >94% efficiency at full load.

Use Scenario: Output rectification in isolated 24 V/10 A industrial SMPS for PLC I/O modules.

IC Role / Device Role / Timing Role: Secondary-side unidirectional rectifier replacing center-tapped transformer + dual diodes.

Use Value: SlimDPAK footprint and 1.3 mm profile enable dense board layouts; 200 A IFSM handles startup surges without derating.

Polarity Protection Circuits Low-Voltage Server VRMs

Use Scenario: Reverse-voltage protection at 5 V/15 A input of telecom baseband processor card.

IC Role / Device Role / Timing Role: Series-connected anode-in cathode-out blocking diode upstream of LDO regulators.

Use Value: 0.39 V VF at 5 A/125 °C limits voltage drop to <2%, preserving margin for downstream 4.5 V min supply requirement.

Use Scenario: High-current freewheeling path in 3.3 V/20 A multiphase VRM for AI accelerator cards.

IC Role / Device Role / Timing Role: Synchronous rectifier replacement in discrete implementation, operating at 300–500 kHz.

Use Value: 3000 pF CJ and low QRR enable clean turn-off with minimal ringing; 175 °C TJ max supports operation near GPU thermal zones.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Alternative Part Technical Difference Application Difference Selection Advice
V20PWM63HM3/I AEC-Q101 qualified; identical electrical specs and SlimDPAK package; differs only in traceability and test reporting for automotive use Required for automotive production programs needing PPAP documentation and stress-test validation Select HM3 for automotive ECUs; M3 suffices for industrial/commercial designs where qualification is not mandated
SS20100CT 20 A dual common-cathode Schottky in TO-220AC; VF = 0.55 V @ 10 A/25 °C; no AEC-Q101; RθJA ≈ 40 °C/W (with heatsink) Requires mechanical heatsink and larger board area; unsuitable for surface-mount-only or space-constrained designs Choose SS20100CT only when TO-220 mounting is acceptable and higher VF at elevated temperature is tolerable

Compared with V20PWM63-M3/I, the HM3 variant adds automotive qualification without electrical trade-offs, while SS20100CT offers higher thermal mass but sacrifices SMT compatibility, profile height, and high-temperature VF performance - making V20PWM63-M3/I optimal for compact, high-efficiency, reflow-compatible power stages.

Availability

V20PWM63-M3/I is available at Aetrix Electronics and suitable for automotive DC/DC converters, industrial 24 V power supplies, and polarity protection circuits requiring stable component supply, halogen-free compliance, and MSL Level 1 SMT readiness.

Supply support for V20PWM63-M3/I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay General Semiconductor is a global leader in discrete semiconductors, specializing in diodes, rectifiers, MOSFETs, and optoelectronics with emphasis on power efficiency and reliability.

The V20PWM63 belongs to Vishay's eSMP® TMBS® Schottky rectifier family, engineered for high-current, low-VF operation in space-constrained power conversion systems - particularly targeting automotive, industrial, and computing applications demanding thermal robustness and AEC-Q101 readiness.

FAQ

What is the maximum junction temperature rating for V20PWM63-M3/I?

The V20PWM63-M3/I has a maximum junction temperature (TJ max.) of +175 °C, verified per datasheet Document Number 98257. This rating allows reliable operation in high-ambient environments such as automotive engine compartments or enclosed industrial enclosures. Derating curves in Fig. 1 confirm usable current down to -40 °C ambient, and thermal design must ensure dPD/dTJ < 1/RθJA to avoid thermal runaway. The V20PWM63-M3/I maintains stable VF and leakage performance across this full range.

Is V20PWM63-M3/I suitable for automotive applications?

The V20PWM63-M3/I itself is not AEC-Q101 qualified; however, its automotive-grade variant V20PWM63HM3/I shares identical electrical and mechanical specifications and is fully qualified per AEC-Q101. For production automotive use, specify HM3. The V20PWM63-M3/I remains suitable for non-automotive industrial and computing applications where qualification is not required, offering identical performance, SlimDPAK footprint, and halogen-free compliance.

What is the forward voltage of V20PWM63-M3/I at 20 A and 125 °C?

The forward voltage (VF) of V20PWM63-M3/I is specified as 0.55 V (typical) and 0.60 V (maximum) at IF = 20 A and TJ = 125 °C, per Electrical Characteristics table on page 2 of datasheet 98257. This low VF directly reduces conduction loss to ~11 W at full load, supporting high-efficiency designs in 5–12 V output rails. Measured values remain stable across temperature due to TMBS® trench architecture.

Does V20PWM63-M3/I have moisture sensitivity level (MSL) rating?

Yes, V20PWM63-M3/I meets MSL Level 1 per J-STD-020, with a maximum peak reflow temperature of 260 °C. This means the device can be placed directly into standard lead-free SMT reflow ovens without pre-baking or dry-pack requirements. The SlimDPAK molding compound is UL 94 V-0 rated, and terminals are matte tin plated per J-STD-002, ensuring robust solder joint formation in high-volume manufacturing.

What is the thermal resistance from junction to mount (RθJM) for V20PWM63-M3/I?

The V20PWM63-M3/I has a typical junction-to-mount thermal resistance (RθJM) of 1.8 °C/W when mounted on an infinite heatsink, as stated in the Thermal Characteristics table. This value assumes direct thermal contact between the exposed cathode pad (Pin 1/3) and a large copper plane or heatsink. In real-world PCB layouts, actual RθJM depends on copper area, thickness, and thermal vias - Fig. 7 in the datasheet provides guidance for optimizing pad size to maintain thermal performance.

V20PWM63-M3/I Specifications

Product attributes
Attribute value
Manufacturer:
Vishay General Semiconductor - Diodes Division
Series:
-
Package/Case:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
Schottky
Voltage - DC Reverse (Vr) (Max):
60 V
Current - Average Rectified (Io):
20A
Voltage - Forward (Vf) (Max) @ If:
670 mV @ 20 A
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr):
-
Current - Reverse Leakage @ Vr:
35 µA @ 60 V
Capacitance @ Vr, F:
3000pF @ 4V, 1MHz
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Surface Mount
Supplier Device Package:
SlimDPAK
Operating Temperature - Junction:
-40°C ~ 175°C

V20PWM63-M3/I FAQ

1.How can I place an order for V20PWM63-M3/I through Aetrix?

Please submit a Request for Quotation (RFQ) for V20PWM63-M3/I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for V20PWM63-M3/I reliable?

The price and inventory of V20PWM63-M3/I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for V20PWM63-M3/I is usually 5 days.

3.What payment methods are accepted for V20PWM63-M3/I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for V20PWM63-M3/I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for V20PWM63-M3/I?

V20PWM63-M3/I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your V20PWM63-M3/I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for V20PWM63-M3/I?

For technical support, including V20PWM63-M3/I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your V20PWM63-M3/I requirements.

6.How does Aetrix verify that V20PWM63-M3/I is sourced from the original manufacturer or authorized distributors?

All V20PWM63-M3/I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that V20PWM63-M3/I meets industry standards.

7.What is the process for return or replacement of V20PWM63-M3/I?

All V20PWM63-M3/I units undergo pre-shipment inspection (PSI). If there is an issue with V20PWM63-M3/I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The V20PWM63-M3/I part is unused and in its original packaging.

Return procedure for V20PWM63-M3/I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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