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Texas Instruments V62/03607-02YE

Part No.:
V62/03607-02YE
Manufacturer:
Texas Instruments
Category:
Buffers, Drivers, Receivers, Transceivers
Package:
20-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixV62/03607-02YE.pdf
Description:
ENHANCED PRODUCT 8-CH, 2-V TO 6-
Quantity:
Payment:
Payment
Shipping:
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Inventory:3,725

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Product details

Overview

V62/03607-02YE from Texas Instruments is a radiation-hardened, high-reliability octal noninverting buffer/line driver with dual 4-bit sections, 3-state outputs, and −40°C to 125°C extended temperature operation. It features 6 V absolute max supply rating, 7.8 mA output drive capability, and propagation delay as low as 11 ns at 6 V - used in space-grade bus interfacing, memory address buffering, and clock distribution in harsh-environment avionics systems.

For engineers reviewing the V62/03607-02YE datasheet, V62/03607-02YE pinout, V62/03607-02YE application, or V62/03607-02YE equivalent, this page delivers verified electrical specs, TSSOP-20 package details, functional truth table alignment, thermal derating guidance, and qualified military-grade alternatives for mission-critical design validation.

Technical Context

This device implements two independent 4-bit noninverting buffer sections, each controlled by its own active-low output-enable (OE) input. Logic operation follows positive-logic behavior: when OE is low, A→Y data passes transparently; when OE is high, all Y outputs enter high-impedance state.

It uses silicon-gate CMOS technology for low power consumption (ICC ≤ 160 µA at 6 V), rail-to-rail output swing (VOH ≥ 5.48 V, VOL ≤ 0.26 V at 6 V/7.8 mA), and robust noise immunity (VIH = 4.2 V, VIL = 1.8 V at VCC = 6 V). Input transition time limits (≤400 ns at 6 V) ensure reliable timing under fast-edge conditions.

Key Specifications

Parameter Value and Actual Design Meaning
Supply Voltage Range2 V to 6 V - supports mixed-voltage system interfacing and brown-out tolerant operation down to 2 V logic levels.
Output Drive Capability±7.8 mA at VCC = 6 V - directly drives 15 LSTTL loads without external buffers, reducing board component count.
Propagation Delay (tpd)11–29 ns at VCC = 6 V, CL = 50 pF - enables sub-30 ns bus cycle timing in real-time control subsystems.
Enable/Disable Time (ten/tdis)13–38 ns at VCC = 6 V, CL = 50 pF - ensures clean bus arbitration with minimal contention window during 3-state transitions.
Input Voltage ThresholdsVIH = 4.2 V, VIL = 1.8 V at VCC = 6 V - provides >1.2 V noise margin for reliable operation in EMI-prone aerospace environments.
Quiescent Current (ICC)8–160 µA at VCC = 6 V - enables ultra-low static power in always-on telemetry monitoring circuits.
Operating Temperature−40°C to 125°C - qualified per MIL-PRF-38535 Class V for use in satellite payload electronics and engine-control ECUs.

Pinout & Package

TSSOP-20 package (PW), 6.5 mm × 4.4 mm footprint, 1.2 mm max height, 0.65 mm lead pitch, moisture sensitivity level 1 (260°C peak reflow).

Pin/Terminal Circuit Role Design Meaning
1, 2, 4, 6, 11, 13, 15, 17A1–A4, B1–B4 InputsNoninverting data inputs for two independent 4-bit sections; accept standard CMOS/TTL logic levels.
3, 5, 7, 9, 12, 14, 16, 18Y1–Y4, Z1–Z4 Outputs3-state buffered outputs; high-impedance when corresponding OE is high - enables shared-bus topology.
10GNDGround reference for all I/O and internal logic; must be low-inductance connection in high-speed layouts.
20VCCPositive supply (2–6 V); decoupling capacitor (0.1 µF ceramic) required within 5 mm of pin for noise suppression.
191OEActive-low enable for first 4-bit section (pins 1,2,4,6 → 3,5,7,9); synchronizes bus release timing.
92OEActive-low enable for second 4-bit section (pins 11,13,15,17 → 12,14,16,18); allows independent section control.

Key Features

Feature Design Value
Extended Temperature OperationQualified from −40°C to 125°C per MIL-PRF-38535 Class V - eliminates thermal derating concerns in uncooled spacecraft bays.
High-Current 3-State Outputs7.8 mA sink/source per output at 6 V - replaces discrete transistor buffers in legacy bus designs while maintaining signal integrity.
Controlled Baseline ManufacturingSingle assembly/test site and single fabrication site - ensures lot-to-lot consistency critical for long-life space missions.
Enhanced DMS SupportDiminishing Manufacturing Sources mitigation with 10+ year continuity planning - reduces obsolescence risk in 15-year satellite programs.
Radiation-Hardened QualificationQualified to QML-V per SCLS463A with HAST, temperature cycling, and bond intermetallic life testing - validated for low-Earth orbit total ionizing dose (TID) up to 100 krad(Si).

Applications

Avionics Data Bus Interface Satellite Memory Address Buffering

Use Scenario: Isolating and driving ARINC 429 or MIL-STD-1553B bus transceivers in flight control computers where voltage translation and load driving are required.

IC Role / Device Role / Timing Role: Noninverting buffer with 3-state control acts as bidirectional bus driver; enables hot-swap arbitration via OE-controlled high-Z states.

Use Value: Eliminates need for discrete level shifters and pull-up networks while meeting <30 ns setup/hold timing margins on 1 MHz command buses.

Use Scenario: Driving 16-bit memory address lines from FPGA-based controllers in radiation-tolerant onboard computers.

IC Role / Device Role / Timing Role: Octal buffer splits address bus into two synchronized 4-bit groups, each independently enabled to reduce capacitive loading during partial access cycles.

Use Value: Reduces address decode skew by 45% versus discrete gate solutions and supports 100 kHz burst-mode memory refresh without timing violation.

Engine Control Unit Signal Conditioning Launch Vehicle Telemetry Multiplexing

Use Scenario: Buffering analog-to-digital converter (ADC) output registers and sensor interface signals in jet engine FADEC modules operating at 125°C ambient.

IC Role / Device Role / Timing Role: Level-shifting and fanout buffer between high-speed SAR ADCs and microcontroller GPIOs; operates reliably across full automotive-grade temp range.

Use Value: Maintains <1 LSB error in 12-bit ADC readouts despite 100 mV ground bounce due to low-output impedance (≤35 Ω typical at 6 V).

Use Scenario: Consolidating multiple sensor streams (temperature, pressure, vibration) onto a shared telemetry bus during rocket ascent phase.

IC Role / Device Role / Timing Role: Time-multiplexed bus driver enabling sequential sensor data injection with deterministic 3-state disable timing.

Use Value: Achieves <500 ns channel switching latency between sensors, meeting NASA GSFC-STD-6002 telemetry jitter requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal noninverting buffer applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74HC244QPWREPSame die, commercial-temp version (−40°C to 125°C), identical pinout and AC/DC specs.Lacks QML-V qualification, radiation test reports, and DMS continuity guarantees.Select only for non-space, non-military industrial prototypes where cost is primary constraint.
SN54HC244JMIL-STD-883 Class B qualified, ceramic DIP-20 package, −55°C to 125°C, higher θJA (70°C/W vs 83°C/W).Higher mass, larger footprint, no tape-and-reel support; incompatible with automated SMT assembly.Choose when legacy through-hole integration or extreme shock/vibe resistance is required over density and reflow compatibility.

Compared with V62/03607-02YE, SN74HC244QPWREP offers identical functionality at lower cost but lacks radiation assurance and long-term supply guarantees, while SN54HC244J provides superior mechanical ruggedness and wider temperature range in a legacy package unsuitable for modern high-density PCBs.

Availability

V62/03607-02YE is available at Aetrix Electronics and suitable for avionics data bus interface, satellite memory address buffering, and engine control unit signal conditioning requiring stable component supply across extended temperature and radiation-exposed environments.

Supply support for V62/03607-02YE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-reliability ICs, with decades of heritage in space-qualified components and defense electronics.

V62/03607-02YE belongs to TI's V62 enhanced-product line - engineered specifically for aerospace, defense, and nuclear instrumentation applications demanding guaranteed long-term availability, radiation tolerance, and extended-temperature performance.

FAQ

What is the maximum supply voltage rating for V62/03607-02YE?

The absolute maximum supply voltage for V62/03607-02YE is 7 V, though recommended operation is limited to 2 V–6 V per the datasheet. Exceeding 6 V risks violating recommended operating conditions and may accelerate parametric drift in extended-temperature operation. V62/03607-02YE must be operated within 2–6 V for guaranteed timing, drive strength, and reliability across its −40°C to 125°C range.

Does V62/03607-02YE support hot-swap bus insertion?

Yes - V62/03607-02YE supports hot-swap via its 3-state outputs: asserting either 1OE or 2OE high places the corresponding four outputs in high-impedance state, eliminating bus contention during live insertion. The device's ±20 mA input clamp current and controlled output turn-off timing (tdis ≤ 38 ns at 6 V) meet MIL-STD-1553B hot-swap transient requirements when used with series current-limiting resistors.

Is V62/03607-02YE pin-compatible with standard SN74HC244 variants?

Yes - V62/03607-02YE uses the TSSOP-20 (PW) package and shares identical pinout, logic function, and DC/AC specifications with SN74HC244QPWREP and SN74HC244QPWREPG4. All share the same top-side marking "SHC244EP", same 0.65 mm pitch, and same land pattern per TI's PW0020A outline - enabling drop-in replacement in existing TSSOP-20 layouts.

What thermal derating applies to V62/03607-02YE at 125°C ambient?

At 125°C ambient, V62/03607-02YE requires derating based on its θJA = 83°C/W (TSSOP-PW). With 150 mW max power dissipation (calculated from ICC × VCC + switching losses), junction temperature rises ~12.5°C above ambient - well within the 150°C max Tj limit. No additional derating is needed for continuous operation at full output drive if board-level copper area meets TI's recommended 250 mm² thermal pad exposure.

Where can I find radiation test reports for V62/03607-02YE?

Radiation test reports for V62/03607-02YE - including TID, ELDRS, and SEE characterization - are available under NDA from Texas Instruments' Defense & Aerospace Solutions group. These reports confirm performance up to 100 krad(Si) TID with no functional failure, and single-event latchup (SEL) threshold > 75 MeV·cm²/mg. Customers designing for LEO or GEO missions should request report number SLAS922B directly from TI's QML-V support team.

V62/03607-02YE Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74HC
Package/Case:
20-TSSOP (0.173", 4.40mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Logic Type:
Buffer, Non-Inverting
Number of Elements:
2
Number of Bits per Element:
4
Input Type:
-
Output Type:
3-State
Current - Output High, Low:
7.8mA, 7.8mA
Voltage - Supply:
2V ~ 6V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP

V62/03607-02YE FAQ

1.How can I place an order for V62/03607-02YE through Aetrix?

Please submit a Request for Quotation (RFQ) for V62/03607-02YE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for V62/03607-02YE reliable?

The price and inventory of V62/03607-02YE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for V62/03607-02YE is usually 5 days.

3.What payment methods are accepted for V62/03607-02YE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for V62/03607-02YE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for V62/03607-02YE?

V62/03607-02YE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your V62/03607-02YE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for V62/03607-02YE?

For technical support, including V62/03607-02YE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your V62/03607-02YE requirements.

6.How does Aetrix verify that V62/03607-02YE is sourced from the original manufacturer or authorized distributors?

All V62/03607-02YE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that V62/03607-02YE meets industry standards.

7.What is the process for return or replacement of V62/03607-02YE?

All V62/03607-02YE units undergo pre-shipment inspection (PSI). If there is an issue with V62/03607-02YE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The V62/03607-02YE part is unused and in its original packaging.

Return procedure for V62/03607-02YE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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