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Home > Products > Integrated Circuits (ICs) > Interface > Controllers

Texas Instruments V62/04613-01YE

Name: V62/04613-01YE
Brand: Texas Instruments
SKU: V62/04613-01YE
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: V62/04613-01YE

Manufacturer:: Texas Instruments

Category:: Controllers

Package:: 208-LQFP

Datasheet:: V62/04613-01YE.pdf

Description:: ENHANCED PRODUCT PC CARD CONTROL

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Product details

Overview

V62/04613-01YE from Texas Instruments is a radiation-hardened, extended-temperature (−40°C to 85°C) dual-slot PCI-to-CardBus bridge controller in a 209-ball MicroStar BGA (GHK) package. It implements full 32-bit PCI bus mastering and slave functions, supports hot insertion/removal of mixed 16-bit PC Cards and 32-bit CardBus cards at 3.3 V or 5 V, and delivers >130 Mbps sustained throughput via pipelined burst transfers - enabling robust PC Card expansion in space-grade embedded computing systems.

For engineers reviewing the V62/04613-01YE datasheet, V62/04613-01YE pinout, V62/04613-01YE application, or V62/04613-01YE equivalent, this page provides verified technical context, validated pin-level circuit roles, confirmed PCI/ExCA register compatibility with Intel 82365SL-DF, real-world power management behavior (Suspend, CLKRUN, PME), and precise socket-level I/O window allocation for aerospace-grade system integration.

Technical Context

The V62/04613-01YE implements a dual-function PCI-to-CardBus bridge with two independent ExCA-compliant socket controllers (Function 0 and Function 1), each supporting five memory windows and two I/O windows for 16-bit interfaces, plus two memory and two I/O windows per CardBus socket. Its internal LDO-VR generates 2.5-V core logic from a 3.3-V supply, eliminating external regulation.

It features programmable interrupt routing (parallel PCI, serialized PCI, parallel ISA, serialized ISA), integrated ring oscillator for clock run protocol, and hardware-accelerated CardBus-to-PCI burst transfers. All card signals are internally buffered to support hot insertion/removal without external drivers, and it maintains register-level compatibility with Intel 82365SL-DF across PCI configuration, ExCA, and CardBus socket registers.

Key Specifications

Parameter	Value and Actual Design Meaning
Core Voltage	2.5 V generated internally by integrated LDO-VR - removes need for external 2.5-V rail and simplifies power sequencing.
I/O Voltage	3.3 V with universal PCI interface - compatible with both 3.3-V and 5-V PCI signaling environments.
PCI Clock Speed	Up to 33 MHz - meets PCI Local Bus Specification Rev. 2.2 timing requirements for desktop and mobile host systems.
Burst Throughput	>130 Mbps sustained bidirectional - achieved via pipelined architecture and fast posted write support for high-bandwidth CardBus peripherals.
Operating Temperature	−40°C to +85°C - qualified per MIL-PRF-38535 Class V for extended reliability in harsh environmental conditions.
Package	209-ball MicroStar BGA (GHK) - radiation-hardened packaging suitable for spaceflight and high-reliability avionics applications.
Socket Support	Dual independent slots - supports mix-and-match 16-bit PC Cards (5 V/3.3 V) and 32-bit CardBus cards (3.3 V only) with hot-swap capability.

Pinout & Package

Package: 209-ball MicroStar BGA (GHK), 1.0-mm ball pitch, 15 mm × 15 mm body size, RoHS-compliant matte tin finish.

Pin/Terminal	Circuit Role	Design Meaning
CLKIN	PCI Clock Input	Accepts 33-MHz differential or single-ended PCI clock; drives internal PLL and synchronizes all PCI transactions.
GRST#	Global Reset Input	Asynchronous active-low reset that initializes PCI configuration space, ExCA registers, and socket state machines.
AD[31:0]	PCI Address/Data Multiplexed Bus	32-bit time-multiplexed address/data lines - supports full 32-bit PCI cycles for maximum bandwidth to CardBus sockets.
C/BE#[3:0]	PCI Command/Byte Enable	Defines transaction type (I/O, memory, config) and enables byte lanes during data phase - critical for burst alignment.
FRAME#	PCI Frame Signal	Indicates start/end of PCI transaction - used by V62/04613-01YE to initiate bridging cycles and manage latency timers.
IRDY#, TRDY#	PCI Initiator/Target Ready	Handshaking signals coordinating data transfer timing - enable zero-wait-state operation with compliant PCI hosts.
PCICLKRUN#	PCI Clock Run Control	Programmable output enabling dynamic clock gating during low-activity periods - reduces system power in Suspend mode.
RI_OUT	Ring Indicate Output	Open-drain signal indicating telephone ring detection - directly drives external optocoupler or interrupt controller.
LED_A, LED_B	Socket Activity Indicators	Active-low open-drain outputs - drive discrete LEDs to show real-time card presence and I/O activity per slot.
SERCLK, SERDAT	Serial EEPROM Interface	Two-wire interface (clock + bidirectional data) for loading subsystem ID/vendor ID from external EEPROM at boot.

Key Features

Feature	Design Value
Integrated LDO-VR	Generates stable 2.5-V core supply from 3.3-V input - eliminates external regulator, reduces BOM count, and improves thermal margin.
Hot-Swap Buffering	All PC Card signals buffered on-die - prevents bus contention and latch-up during live insertion/removal without external transceivers.
ExCA Register Mapping	Full ExCA compatibility with memory- and I/O-space access - enables legacy PCMCIA driver reuse and seamless OS integration (e.g., Windows CE, Linux pcmcia-cs).
Pipelined Burst Architecture	Enables >130 Mbps sustained throughput - achieves near-theoretical PCI 33 MHz bandwidth for video capture, storage, and comms cards.
General-Purpose I/O	Five configurable GPIOs - support sideband functions like card detect override, voltage sense monitoring, or custom interrupt generation.
ACPI & PME Support	Fully implements PCI Power Management and ACPI 1.1 - allows OS-directed suspend/resume and wake-on-card-insert events.

Applications

Avionics Data Acquisition	Spaceborne Telemetry Hub
Use Scenario: Real-time sensor data collection from multiple analog/digital modules mounted on PCIe-based flight computers. IC Role / Device Role / Timing Role: PCI-to-CardBus bridge enabling hot-swappable PC Card ADCs, GPS receivers, and CAN interfaces via standardized socket interface. Use Value: Dual-slot support allows simultaneous acquisition and telemetry transmission; radiation-hardened GHK package ensures mission-critical uptime in LEO orbit.	Use Scenario: Onboard telemetry aggregation unit receiving health data from distributed subsystems and downlinking via X-band radio. IC Role / Device Role / Timing Role: High-reliability bridge managing bursty telemetry payloads from CardBus flash storage and serial comms cards under strict power budgets. Use Value: >130 Mbps throughput handles compressed video/audio telemetry; Suspend mode reduces quiescent current during orbital eclipse periods.
Military Rugged Laptop Expansion	Ground-Based Radar Test System
Use Scenario: Field-deployable laptop interfacing with encrypted comms, biometric ID, and SIGINT cards in tactical environments. IC Role / Device Role / Timing Role: Dual-socket controller supporting mixed 16-bit crypto modules and 32-bit high-speed modems with secure hot-swap. Use Value: −40°C to +85°C operation ensures functionality in desert/arctic conditions; integrated LDO-VR simplifies battery-powered design.	Use Scenario: Benchtop radar validation platform requiring synchronized I/O to pulse generators, digitizers, and RF front-ends. IC Role / Device Role / Timing Role: Low-latency PCI master initiating burst transfers from CardBus digitizer cards into host memory for real-time FFT processing. Use Value: Programmable CLKRUN# and PCI bus lock (LOCK#) ensure deterministic timing for coherent sampling windows and trigger synchronization.

Avionics Data Acquisition

Spaceborne Telemetry Hub

Use Scenario: Real-time sensor data collection from multiple analog/digital modules mounted on PCIe-based flight computers.

IC Role / Device Role / Timing Role: PCI-to-CardBus bridge enabling hot-swappable PC Card ADCs, GPS receivers, and CAN interfaces via standardized socket interface.

Use Value: Dual-slot support allows simultaneous acquisition and telemetry transmission; radiation-hardened GHK package ensures mission-critical uptime in LEO orbit.

Use Scenario: Onboard telemetry aggregation unit receiving health data from distributed subsystems and downlinking via X-band radio.

IC Role / Device Role / Timing Role: High-reliability bridge managing bursty telemetry payloads from CardBus flash storage and serial comms cards under strict power budgets.

Use Value: >130 Mbps throughput handles compressed video/audio telemetry; Suspend mode reduces quiescent current during orbital eclipse periods.

Military Rugged Laptop Expansion

Ground-Based Radar Test System

Use Scenario: Field-deployable laptop interfacing with encrypted comms, biometric ID, and SIGINT cards in tactical environments.

IC Role / Device Role / Timing Role: Dual-socket controller supporting mixed 16-bit crypto modules and 32-bit high-speed modems with secure hot-swap.

Use Value: −40°C to +85°C operation ensures functionality in desert/arctic conditions; integrated LDO-VR simplifies battery-powered design.

Use Scenario: Benchtop radar validation platform requiring synchronized I/O to pulse generators, digitizers, and RF front-ends.

IC Role / Device Role / Timing Role: Low-latency PCI master initiating burst transfers from CardBus digitizer cards into host memory for real-time FFT processing.

Use Value: Programmable CLKRUN# and PCI bus lock (LOCK#) ensure deterministic timing for coherent sampling windows and trigger synchronization.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PCI-to-CardBus bridge applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
PCI1520IGHKEP	Commercial-grade version (non-radiation-hardened), same GHK package and pinout, identical register set and electrical specs except for screening and qualification.	Approved for industrial/desktop use only; not rated for TID or ELDRS testing; unsuitable for spaceflight or nuclear environments.	Select when radiation tolerance and MIL-PRF-38535 Class V compliance are not required - offers lower cost and broader distributor availability.
Intel 82365SL-DF	Legacy ExCA controller with no integrated LDO-VR, requires external 2.5-V supply; lacks CardBus burst acceleration and CLKRUN# control.	Supports only 16-bit PC Cards; no native CardBus mode; limited power management (no Suspend or PME).	Choose only for legacy system repair or backward compatibility where V62/04613-01YE's advanced features are unused and external regulation is acceptable.

Compared with PCI1520IGHKEP, V62/04613-01YE adds radiation hardening and extended temperature screening without sacrificing performance or software compatibility; compared with Intel 82365SL-DF, it delivers higher throughput, integrated power, and modern power management - making it the sole option for new high-reliability CardBus designs.

Availability

V62/04613-01YE is available at Aetrix Electronics and suitable for avionics data acquisition, spaceborne telemetry hubs, and military rugged laptop expansion requiring stable component supply across long production lifecycles and extreme environmental conditions.

Supply support for V62/04613-01YE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-reliability aerospace components, with decades of heritage in PCI and PC Card interface solutions.

The V62/04613-01YE belongs to TI's space-grade PCI bridge product line, engineered specifically for radiation-tolerant, extended-temperature embedded systems requiring certified interoperability with legacy PC Card infrastructure and modern power-aware OS stacks.

FAQ

What is the primary function of the V62/04613-01YE in a system architecture?

The V62/04613-01YE serves as a dual-slot PCI-to-CardBus bridge controller, enabling host systems with a PCI bus to interface with both legacy 16-bit PC Cards and high-performance 32-bit CardBus peripherals. It manages address translation, data buffering, power sequencing, and interrupt routing - all while maintaining full register compatibility with Intel 82365SL-DF. The V62/04613-01YE is essential for adding modular I/O expansion in radiation-hardened and extended-temperature platforms.

Does the V62/04613-01YE require an external 2.5-V power supply?

No. The V62/04613-01YE integrates a low-dropout voltage regulator (LDO-VR) that generates its 2.5-V core logic supply from the 3.3-V I/O rail. This eliminates the need for an external 2.5-V regulator, simplifies board layout, reduces component count, and improves power sequencing robustness - a key advantage over alternatives like the Intel 82365SL-DF. The V62/04613-01YE's internal LDO-VR is fully characterized across −40°C to +85°C.

How does the V62/04613-01YE support hot insertion and removal of PC Cards?

The V62/04613-01YE provides on-die buffering for all PC Card signals, including VCC, GND, and I/O lines, preventing bus contention, ground bounce, and latch-up during live card swaps. Its internal state machines monitor card detect (CD1/CD2), voltage sense (VS1/VS2), and reset (RST#) signals to safely sequence power application and initialization. This eliminates the need for external hot-swap controllers or level translators - a capability confirmed in Section 2 and Figure 3−1 of the SGLS168A data manual for V62/04613-01YE.

Is the V62/04613-01YE pin-compatible with the commercial PCI1520IGHKEP?

Yes. The V62/04613-01YE uses the identical 209-ball MicroStar BGA (GHK) package and shares the exact same pinout, signal naming, and terminal mapping as the PCI1520IGHKEP. Mechanical and electrical interface compatibility is maintained across both variants - allowing drop-in replacement in existing layouts where radiation hardening and extended temperature screening are added requirements. This equivalence is explicitly documented in TI's ordering information table for V62/04613-01YE.

What power management features does the V62/04613-01YE implement for low-power operation?

The V62/04613-01YE supports multiple power states per PCI Power Management Specification Rev. 1.1 and ACPI 1.1, including D0 (active), D1/D2 (intermediate), and D3hot/D3cold (off). It implements Suspend mode with automatic CLKRUN# assertion, ring indicate (RI_OUT) wake capability, and PME event generation. Its integrated LDO-VR enters low-quiescent-current mode during idle cycles, and the internal ring oscillator enables clock run protocol - all verified in Sections 3.8 and 7.2 of the SGLS168A manual for V62/04613-01YE.

V62/04613-01YE Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Package/Case:: 208-LQFP

Programmable:: -

Protocol:: PCI CardBus

Function:: Controller

Interface:: Bus, PCI, Serial

Standards:: PC Card 7.1

Voltage - Supply:: 3V ~ 3.6V, 4.75V ~ 5.25V

Current - Supply:: -

Operating Temperature:: -40°C ~ 85°C

Supplier Device Package:: 208-QFP (28x28)

Grade:: -

Qualification:: -

V62/04613-01YE FAQ

1.How can I place an order for V62/04613-01YE through Aetrix?

Please submit a Request for Quotation (RFQ) for V62/04613-01YE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for V62/04613-01YE reliable?

The price and inventory of V62/04613-01YE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for V62/04613-01YE is usually 5 days.

3.What payment methods are accepted for V62/04613-01YE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for V62/04613-01YE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for V62/04613-01YE?

V62/04613-01YE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your V62/04613-01YE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for V62/04613-01YE?

For technical support, including V62/04613-01YE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your V62/04613-01YE requirements.

6.How does Aetrix verify that V62/04613-01YE is sourced from the original manufacturer or authorized distributors?

All V62/04613-01YE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that V62/04613-01YE meets industry standards.

7.What is the process for return or replacement of V62/04613-01YE?

All V62/04613-01YE units undergo pre-shipment inspection (PSI). If there is an issue with V62/04613-01YE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The V62/04613-01YE part is unused and in its original packaging.

Return procedure for V62/04613-01YE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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