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Home > Products > Integrated Circuits (ICs) > Logic > Buffers, Drivers, Receivers, Transceivers

Texas Instruments V62/04684-01XE

Name: V62/04684-01XE
Brand: Texas Instruments
SKU: V62/04684-01XE
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: V62/04684-01XE

Manufacturer:: Texas Instruments

Category:: Buffers, Drivers, Receivers, Transceivers

Package:: 14-SOIC (0.154", 3.90mm Width)

Datasheet:: V62/04684-01XE.pdf

Description:: ENHANCED PRODUCT 4-CH, 4.5-V TO

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Product details

Overview

V62/04684-01XE from Texas Instruments is a radiation-hardened, high-reliability quadruple 3-state bus buffer IC with TTL-compatible inputs and CMOS outputs. It features four independent noninverting buffers, each with dedicated output-enable (OE) control, operates from 4.5 V to 5.5 V, supports −40°C to 125°C extended temperature range, and is qualified per MIL-PRF-38535 Class V for space and defense applications.

For engineers reviewing the V62/04684-01XE datasheet, V62/04684-01XE pinout, V62/04684-01XE application, or V62/04684-01XE equivalent, this device is selected for high-integrity data bus isolation in avionics backplanes, satellite command/data handling units, and radiation-tolerant FPGA I/O interfacing where latch-up immunity and guaranteed 3-state behavior during power sequencing are critical.

Technical Context

The V62/04684-01XE implements four identical noninverting buffer stages, each with separate OE control enabling independent bus segment gating. Its logic function follows standard positive-logic 3-state behavior: OE = low forces Y into high-impedance; OE = high passes A → Y. Input thresholds are TTL-compatible (VIL ≤ 0.8 V, VIH ≥ 2 V), ensuring interoperability with legacy 5-V logic families.

Designed for harsh environments, it incorporates controlled baseline manufacturing, enhanced DMS support, and qualification pedigree including HAST, temperature cycling, and electromigration testing. The SOIC (D) package meets MIL-STD-883 requirements for mechanical and thermal robustness, with θJA = 86°C/W and MSL Level-1 rating.

Key Specifications

Parameter	Value and Actual Design Meaning
Supply Voltage	4.5 V to 5.5 V - Ensures stable operation across wide input rail tolerances in regulated 5-V systems.
Operating Temperature	−40°C to 125°C - Validated for deployment in engine bays, payload modules, and unheated spacecraft compartments.
Output Drive	±8 mA - Sufficient to drive standard 50-pF loads with <8.5 ns propagation delay, supporting 20-MHz bus rates.
Input Compatibility	TTL-voltage compatible - Interfaces directly with 74LS, 74F, and other legacy 5-V TTL without level-shifting.
ESD Protection	2000 V HBM, 200 V MM - Meets MIL-STD-883 Method 3015, reducing risk of field-induced latch-up or gate oxide damage.
Quiescent Current	2 µA typical, 20 µA max - Enables low-power standby modes in always-on telemetry subsystems.
Propagation Delay	3.8 ns min / 6.5 ns max (CL = 15 pF) - Guarantees timing margin for synchronous bus arbitration in real-time control loops.

Pinout & Package

Package: SOIC (D), 14-pin, 1.75 mm maximum height, JEDEC MS-012 AB compliant, RoHS-compliant NiPdAu lead finish, MSL Level-1.

Pin/Terminal	Circuit Role	Design Meaning
1, 4, 10, 13	Output Enable (OE)	Active-high control per buffer; tie to GND via pulldown resistor to ensure defined high-Z at power-up.
2, 5, 11, 14	Data Input (A)	TTL-compatible input; must be held at VCC or GND if unused to prevent floating-node oscillation.
3, 6, 12, 9	3-State Output (Y)	CMOS output capable of sourcing/sinking ±8 mA; high-impedance when corresponding OE = low.
7	GND	Signal and power reference plane; requires low-inductance connection to minimize ground bounce.
14	VCC	5-V supply rail; bypass with 0.1 µF ceramic capacitor near pin to suppress switching noise.

Key Features

Feature	Design Value
Extended Temperature Range	Qualified from −40°C to 125°C per MIL-PRF-38535 Class V - eliminates derating calculations for high-ambient military platforms.
Controlled Baseline	Single assembly/test site and single fabrication site - ensures consistent parametric performance across production lots and long-term supply continuity.
Enhanced DMS Support	Diminishing Manufacturing Sources mitigation - includes proactive obsolescence monitoring and last-time-buy coordination for mission-critical programs.
High-Reliability Qualification	JEDEC-compliant HAST, temperature cycle, and electromigration testing - validates lifetime reliability under sustained thermal stress and voltage bias.
TTL-Compatible Inputs	VIL ≤ 0.8 V, VIH ≥ 2 V - enables direct interface with legacy 5-V microcontrollers and FPGAs without external translators.

Applications

Avionics Data Bus Isolation	Satellite Command & Telemetry Interface
Use Scenario: Isolating ARINC 429 or MIL-STD-1553B bus segments between flight computers and sensor modules in UAVs and manned aircraft. IC Role / Device Role / Timing Role: Bidirectional 3-state buffer providing controlled signal routing and fault containment between redundant processing channels. Use Value: Prevents bus contention during processor resets and ensures deterministic high-Z state during power sequencing - critical for DO-254 compliance.	Use Scenario: Interfacing radiation-hardened FPGAs to telemetry encoders in LEO satellite payloads operating beyond 10 krad(Si). IC Role / Device Role / Timing Role: Level-translating and bus-driving interface between FPGA I/O banks and serial telemetry transmitters. Use Value: Guaranteed 3-state behavior under single-event transients eliminates spurious bus writes during cosmic ray strikes.
Spacecraft Power Management Control	Ground-Based Radar Signal Conditioning
Use Scenario: Enabling/disabling analog-to-digital converter (ADC) data lanes in radiation-hardened power distribution units on deep-space probes. IC Role / Device Role / Timing Role: Digital enable gate controlling ADC parallel output bus visibility to downstream processors. Use Value: Low quiescent current (2 µA typ.) and latch-up immunity reduce system-level power budget and eliminate need for power-cycle recovery.	Use Scenario: Buffering pulse-width modulated (PWM) timing signals between radar waveform generators and high-voltage gate drivers in phased-array antenna systems. IC Role / Device Role / Timing Role: High-speed, low-skew buffer isolating sensitive timing circuitry from noisy power-switching domains. Use Value: 3.8 ns minimum tPLH/tPHL ensures sub-10 ns timing jitter control for <100 MHz RF modulation accuracy.

Avionics Data Bus Isolation

Satellite Command & Telemetry Interface

Use Scenario: Isolating ARINC 429 or MIL-STD-1553B bus segments between flight computers and sensor modules in UAVs and manned aircraft.

IC Role / Device Role / Timing Role: Bidirectional 3-state buffer providing controlled signal routing and fault containment between redundant processing channels.

Use Value: Prevents bus contention during processor resets and ensures deterministic high-Z state during power sequencing - critical for DO-254 compliance.

Use Scenario: Interfacing radiation-hardened FPGAs to telemetry encoders in LEO satellite payloads operating beyond 10 krad(Si).

IC Role / Device Role / Timing Role: Level-translating and bus-driving interface between FPGA I/O banks and serial telemetry transmitters.

Use Value: Guaranteed 3-state behavior under single-event transients eliminates spurious bus writes during cosmic ray strikes.

Spacecraft Power Management Control

Ground-Based Radar Signal Conditioning

Use Scenario: Enabling/disabling analog-to-digital converter (ADC) data lanes in radiation-hardened power distribution units on deep-space probes.

IC Role / Device Role / Timing Role: Digital enable gate controlling ADC parallel output bus visibility to downstream processors.

Use Value: Low quiescent current (2 µA typ.) and latch-up immunity reduce system-level power budget and eliminate need for power-cycle recovery.

Use Scenario: Buffering pulse-width modulated (PWM) timing signals between radar waveform generators and high-voltage gate drivers in phased-array antenna systems.

IC Role / Device Role / Timing Role: High-speed, low-skew buffer isolating sensitive timing circuitry from noisy power-switching domains.

Use Value: 3.8 ns minimum tPLH/tPHL ensures sub-10 ns timing jitter control for <100 MHz RF modulation accuracy.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus buffer applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74AHCT126QDREP	Commercial-grade version; same SOIC-14 package, identical pinout and logic function, but rated only for −40°C to 125°C without MIL-PRF-38535 Class V qualification.	Approved for industrial and automotive use; not certified for spaceflight or military hardware-in-the-loop test environments.	Select when radiation tolerance, latch-up immunity, and full MIL-STD-883 testing are not required.
SN54AHCT126	Military QML-38535 Class B qualified; same electrical specs, but uses ceramic flatpack (FK) or hermetic DIP (J) packages - no SOIC option available.	Used in legacy missile guidance systems and ground-based defense electronics requiring hermetic sealing and higher thermal shock resistance.	Choose only when hermetic packaging and QML-B certification are mandated by program specifications.

Compared with V62/04684-01XE, SN74AHCT126QDREP offers identical functionality at lower cost but lacks radiation hardness and full MIL-PRF-38535 Class V pedigree; SN54AHCT126 provides equivalent reliability in hermetic packages but requires PCB redesign due to incompatible footprint and thermal mass.

Availability

V62/04684-01XE is available at Aetrix Electronics and suitable for avionics backplane design, satellite telemetry subsystems, and radiation-tolerant FPGA I/O interfacing requiring stable component supply across multi-year production cycles.

Supply support for V62/04684-01XE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-reliability components for aerospace, defense, and industrial markets.

The V62/04684-01XE belongs to TI's space-grade logic portfolio, engineered specifically for mission-critical systems where failure is not an option - emphasizing radiation tolerance, extended temperature resilience, and long-term supply assurance.

FAQ

What is the qualification standard for V62/04684-01XE?

V62/04684-01XE is qualified per MIL-PRF-38535 Class V, including full JEDEC-compliant reliability testing such as HAST, temperature cycling, and electromigration. This qualification ensures suitability for spaceflight and high-reliability defense applications where component failure carries catastrophic risk. The V62/04684-01XE datasheet confirms its compliance with these standards under the "Controlled Baseline" and "Qualification Pedigree" sections.

Does V62/04684-01XE support hot-swap or live-insertion?

V62/04684-01XE does not include built-in hot-swap protection circuitry. However, its 3-state outputs and guaranteed high-impedance behavior during power-up - when OE is tied to GND via a pulldown resistor - enable safe insertion into powered backplanes. The V62/04684-01XE absolute maximum ratings specify VI and VO limits up to 7 V, allowing limited overvoltage tolerance during transient insertion events, provided current is externally limited.

Can V62/04684-01XE drive 50-pF loads reliably at 5 V?

Yes, V62/04684-01XE is characterized to drive 50-pF loads with tPLH/tPHL ≤ 8.5 ns and tPZH/tPHZ ≤ 10 ns at VCC = 5 V. Its ±8 mA output drive capability ensures clean signal edges and adequate noise margin under these conditions. The V62/04684-01XE switching characteristics table explicitly lists CL = 50 pF performance, confirming its suitability for standard PCB trace loading in avionics and radar systems.

Is V62/04684-01XE pin-compatible with commercial SN74AHCT126 variants?

Yes, V62/04684-01XE uses the SOIC (D) package with identical 14-pin layout and pin functions as SN74AHCT126QDREP and SN74AHCT126. Pin mapping - including OE, A, Y, VCC, and GND positions - matches exactly per the D-package top-view diagram in the V62/04684-01XE datasheet. No PCB layout changes are needed when upgrading from commercial to radiation-hardened versions within the same package type.

What is the recommended power-up sequence for V62/04684-01XE?

The recommended power-up sequence for V62/04684-01XE is to assert OE low before or simultaneously with VCC application, using a pulldown resistor (value determined by driver sourcing capability) to ensure all outputs remain in high-impedance until system initialization completes. This prevents bus contention during power ramp. The V62/04684-01XE datasheet states this explicitly in the "description" section to guarantee safe 3-state behavior at power-up.

V62/04684-01XE Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: 74AHCT

Package/Case:: 14-SOIC (0.154", 3.90mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Logic Type:: Buffer, Non-Inverting

Number of Elements:: 4

Number of Bits per Element:: 1

Input Type:: -

Output Type:: 3-State

Current - Output High, Low:: 8mA, 8mA

Voltage - Supply:: 4.5V ~ 5.5V

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 14-SOIC

V62/04684-01XE FAQ

1.How can I place an order for V62/04684-01XE through Aetrix?

Please submit a Request for Quotation (RFQ) for V62/04684-01XE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for V62/04684-01XE reliable?

The price and inventory of V62/04684-01XE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for V62/04684-01XE is usually 5 days.

3.What payment methods are accepted for V62/04684-01XE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for V62/04684-01XE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for V62/04684-01XE?

V62/04684-01XE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your V62/04684-01XE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for V62/04684-01XE?

For technical support, including V62/04684-01XE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your V62/04684-01XE requirements.

6.How does Aetrix verify that V62/04684-01XE is sourced from the original manufacturer or authorized distributors?

All V62/04684-01XE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that V62/04684-01XE meets industry standards.

7.What is the process for return or replacement of V62/04684-01XE?

All V62/04684-01XE units undergo pre-shipment inspection (PSI). If there is an issue with V62/04684-01XE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The V62/04684-01XE part is unused and in its original packaging.

Return procedure for V62/04684-01XE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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