Texas Instruments V62/04739-01YE
- Part No.:
- V62/04739-01YE
- Manufacturer:
- Texas Instruments
- Category:
- Flip Flops
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
V62/04739-01YE.pdf
- Description:
- ENHANCED PRODUCT HIGH SPEED CMOS
- Quantity:
- Payment:

- Shipping:

Inventory:3,540
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
V62/04739-01YE from Texas Instruments is a radiation-hardened, high-reliability octal D-type flip-flop with 3-state outputs, designed for aerospace and defense systems requiring extended temperature operation (−40°C to 125°C), bus-line driving capability (15 LSTTL loads), and precise edge-triggered data latching on the CP rising edge. It features buffered inputs, common 3-state output-enable control (OE), and CMOS/TTL input compatibility.
For engineers reviewing the V62/04739-01YE datasheet, V62/04739-01YE pinout, V62/04739-01YE application, or V62/04739-01YE equivalent, this device serves as a space-grade register for digital signal buffering, data acquisition synchronization, and high-integrity bus interface in mission-critical avionics and satellite subsystems.
Technical Context
The V62/04739-01YE implements eight independent positive-edge-triggered D flip-flops with synchronous parallel loading and asynchronous 3-state output control via OE. Its logic architecture supports direct LSTTL input compatibility (VIL ≤ 0.8 V, VIH ≥ 2 V) and CMOS-level input leakage (±1 µA at 5.5 V).
Timing behavior is characterized by 15 ns typical propagation delay (CP to Q, VCC = 5 V, CL = 15 pF), 12–18 ns setup time, and 5 ns hold time. Output enable/disable transitions exhibit 11 ns disable time (tdis) and 12 ns enable time (ten) under identical conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 4.5 V to 5.5 V - Ensures stable operation across industrial power rail tolerances and mitigates brownout risk in harsh environments. |
| Operating Temperature | −40°C to 125°C - Qualified per JEDEC extended-temperature standards including HAST, temperature cycling, and bond intermetallic life testing. |
| Propagation Delay (tpd) | 15 ns typ. (CP→Q, VCC = 5 V, CL = 15 pF) - Enables reliable 60 MHz clock operation in high-speed digital control loops. |
| Bus Drive Strength | 15 LSTTL loads - Supports direct interfacing to legacy TTL buses without external buffers in mixed-logic systems. |
| Input Compatibility | LSTTL and CMOS - Eliminates level-shifting requirements when connecting to both 5 V TTL and CMOS microcontrollers or FPGAs. |
| 3-State Enable Control | Common OE pin - Allows single-wire bus arbitration across multiple V62/04739-01YE devices on shared data paths. |
| Power Dissipation | 47 pF Cpd (typ., VCC = 5 V) - Reduces dynamic power vs. standard LSTTL equivalents, critical for thermally constrained payloads. |
Pinout & Package
TSSOP-20 (PW) package: 6.5 mm × 4.4 mm body, 1.2 mm max height, 0.65 mm lead pitch, RoHS-compliant NiPdAu finish, MSL Level-1 (260°C peak reflow).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (OE) | Output Enable (active-low) | Asserting low enables all eight Q outputs; high places them in high-impedance state - essential for bus contention avoidance. |
| 2–9 (D0–D7) | Data inputs | Asynchronous parallel data inputs latched on CP rising edge - supports byte-wide data capture from ADCs or sensors. |
| 10 (GND) | Ground reference | Primary return path for all internal logic and output drivers - requires low-inductance PCB connection for noise immunity. |
| 11 (VCC) | Supply voltage | 5 V nominal supply with 4.5–5.5 V operating range - decoupling capacitor placement near Pin 11 is mandatory for signal integrity. |
| 12–19 (Q0–Q7) | 3-state registered outputs | Edge-triggered, buffered outputs reflecting Dn state at prior CP↑ - drive capability matches 15 LSTTL loads directly. |
| 20 (CP) | Clock input | Positive-edge-sensitive clock - synchronizes all eight registers simultaneously; requires clean, monotonic transition per JEDEC timing specs. |
Key Features
| Feature | Design Value |
|---|---|
| Controlled Baseline Manufacturing | Single assembly/test site and single fabrication site - ensures consistent parametric performance and traceability for flight hardware. |
| Enhanced DMS Support | Diminishing Manufacturing Sources mitigation - extends long-term supply continuity for programs with >15-year lifecycle requirements. |
| Balanced Propagation & Transition Times | Minimizes skew between Q outputs and reduces EMI generation during simultaneous switching - critical for EMC compliance in avionics. |
| Significant Power Reduction vs. LSTTL | Lower ICC (8–160 µA) and Cpd (47 pF) reduce thermal load in sealed enclosures and extend battery life in remote telemetry nodes. |
| Qualified Pedigree | JEDEC-qualified for extended temperature with HAST, autoclave, electromigration, and mold compound life testing - meets MIL-PRF-38535 Class V requirements. |
Applications
| Avionics Data Acquisition | Satellite Command & Telemetry Interface |
|---|---|
|
Use Scenario: Capturing synchronized analog-to-digital converter (ADC) outputs in flight control computers under vibration and thermal cycling. IC Role / Device Role / Timing Role: Octal register latching 8-bit sensor data on each CP rising edge, isolating ADC core from noisy processor bus during conversion. Use Value: Ensures deterministic sampling alignment across multiple channels while enabling 3-state bus sharing with other peripherals - eliminates metastability in safety-critical feedback loops. |
Use Scenario: Buffering uplink command words and downlink telemetry packets in LEO satellite onboard computers. IC Role / Device Role / Timing Role: Parallel data latch and bus driver for UART/FPGA interface, with OE-controlled tristate enabling bidirectional packet routing. Use Value: Provides radiation-tolerant, temperature-stable data staging with 15-LSTTL drive strength - avoids need for discrete buffer arrays and reduces PCB area in constrained modules. |
| Military Vehicle Mission Computers | Spacecraft Power Management Unit |
|
Use Scenario: Isolating I/O expansion modules from main processor bus in armored vehicle computing systems exposed to −40°C cold starts and 125°C engine-bay ambient. IC Role / Device Role / Timing Role: High-reliability bus interface register with edge-triggered capture and common OE control for modular I/O card hot-swap support. Use Value: Maintains functional integrity across full military temperature range without derating - qualified per extended-temperature JEDEC protocols including biased 85/85 and temperature cycle testing. |
Use Scenario: Staging voltage/current monitor readings from isolated DC-DC converters before transmission to central health management unit. IC Role / Device Role / Timing Role: Radiation-hardened data latch synchronizing analog monitor digitization with system clock domain, with 3-state isolation during fault recovery. Use Value: Delivers single-event latchup (SEL)-immune operation and guaranteed timing margins at 125°C - enables real-time power diagnostics without software intervention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal D-type flip-flop applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CD74HCT574QPWREP | Commercial-grade TSSOP-20 variant; same pinout and logic function but rated only for −40°C to 85°C and lacks radiation-hardening and extended-temperature qualification. | Approved for non-mission-critical industrial automation, not certified for space or defense use. | Select only for cost-sensitive terrestrial applications where extended temperature and radiation tolerance are unnecessary. |
| V62/04739-01XE | Same die and functionality as V62/04739-01YE but in SOIC-20 (DW) package; 2.65 mm height vs. 1.2 mm TSSOP; higher θJA (58°C/W vs. 69°C/W). | Preferred where board-level rework accessibility or legacy SOIC footprint compatibility is required over space-constrained layouts. | Choose V62/04739-01XE for through-hole-compatible rework or higher thermal mass needs; V62/04739-01YE for ultra-thin, high-density assemblies. |
Compared with CD74HCT574QPWREP, V62/04739-01YE adds extended-temperature qualification, radiation hardening, and controlled baseline manufacturing - making it suitable for flight hardware where CD74HCT574QPWREP is limited to ground-based systems. Against V62/04739-01XE, it trades slightly higher thermal resistance for 52% lower profile and improved high-frequency layout stability.
Availability
V62/04739-01YE is available at Aetrix Electronics and suitable for avionics data acquisition, satellite telemetry interfaces, and military vehicle mission computers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for V62/04739-01YE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-reliability components, with over 50 years of heritage in space-grade IC development.
The V62/04739-01YE belongs to TI's enhanced-product (EP) family - engineered specifically for aerospace, defense, and industrial applications demanding extended temperature operation, long-term supply assurance, and rigorous process pedigree.
FAQ
What is the maximum clock frequency supported by V62/04739-01YE?
V62/04739-01YE supports a maximum clock frequency of 20 MHz over its full operating temperature range (−40°C to 125°C) and 30 MHz at 25°C. This is verified by timing parameter fmax in the datasheet under recommended operating conditions with VCC = 4.5 V. The device achieves this using optimized CMOS HCT logic with balanced propagation delays, ensuring reliable edge-triggered operation in real-time control systems.
Does V62/04739-01YE require external pull-up or pull-down resistors on unused inputs?
Yes, V62/04739-01YE requires all unused inputs (D0–D7, CP, OE) to be held at either VCC or GND to prevent floating nodes that could cause excessive current draw or erratic behavior. This requirement is explicitly stated in Note 3 of the datasheet and applies across the full −40°C to 125°C range. Leaving inputs unconnected violates recommended operating conditions and may compromise reliability in mission-critical deployments.
Is V62/04739-01YE pin-compatible with standard CD74HCT574 variants?
V62/04739-01YE is pin-compatible with CD74HCT574QPWREP and other TSSOP-20 versions of the CD74HCT574 family, sharing identical pin assignments, electrical interface, and logic function. However, it is not pin-compatible with SOIC-20 variants like V62/04739-01XE due to differing package footprints - though both share the same die and functional behavior.
What does the "V62" prefix indicate in V62/04739-01YE?
The "V62" prefix identifies V62/04739-01YE as a Texas Instruments military/aerospace-grade product compliant with MIL-PRF-38535 Class V requirements. It denotes full qualification for extended temperature operation, enhanced reliability testing (including HAST and temperature cycling), controlled baseline manufacturing, and diminished manufacturing sources (DMS) support - distinguishing it from commercial or automotive-grade equivalents.
Can V62/04739-01YE drive standard TTL loads directly?
Yes, V62/04739-01YE can directly drive up to 15 LSTTL loads per output, as confirmed by its fanout specification in the datasheet. This capability is enabled by its bus-driver output stage and is valid across the full −40°C to 125°C operating range. No external buffer circuitry is needed when interfacing with legacy TTL logic, reducing BOM count and improving system-level reliability.
V62/04739-01YE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74HCT
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Standard
- Type:
- D-Type
- Output Type:
- Tri-State, Non-Inverted
- Number of Elements:
- 1
- Number of Bits per Element:
- 8
- Clock Frequency:
- 60 MHz
- Max Propagation Delay @ V, Max CL:
- 33ns @ 4.5V, 50pF
- Trigger Type:
- Positive Edge
- Current - Output High, Low:
- 6mA, 6mA
- Voltage - Supply:
- 4.5V ~ 5.5V
- Current - Quiescent (Iq):
- 8 µA
- Input Capacitance:
- 10 pF
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-TSSOP
V62/04739-01YE FAQ
1.How can I place an order for V62/04739-01YE through Aetrix?
Please submit a Request for Quotation (RFQ) for V62/04739-01YE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for V62/04739-01YE reliable?
The price and inventory of V62/04739-01YE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for V62/04739-01YE is usually 5 days.
3.What payment methods are accepted for V62/04739-01YE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for V62/04739-01YE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for V62/04739-01YE?
V62/04739-01YE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your V62/04739-01YE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for V62/04739-01YE?
For technical support, including V62/04739-01YE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your V62/04739-01YE requirements.
6.How does Aetrix verify that V62/04739-01YE is sourced from the original manufacturer or authorized distributors?
All V62/04739-01YE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that V62/04739-01YE meets industry standards.
7.What is the process for return or replacement of V62/04739-01YE?
All V62/04739-01YE units undergo pre-shipment inspection (PSI). If there is an issue with V62/04739-01YE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The V62/04739-01YE part is unused and in its original packaging.
Return procedure for V62/04739-01YE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
V62/04739-01YE Tags
-
SN74HC74DR
Texas Instruments

-
SN74HC74PWR
Texas Instruments

-
74LVC1G74GT,115
Nexperia USA Inc.

-
SN74LVC2G74DCUR
Texas Instruments
-
CD4013BM96
Texas Instruments

-
SN74HCT273PWR
Texas Instruments

-
SN74LVC1G74DCUR
Texas Instruments

-
SN74HC574DWR
Texas Instruments
-
74LVC1G74DC,125
Nexperia USA Inc.

-
SN74HC273DWR
Texas Instruments

-
SN74HCT574DWR
Texas Instruments

-
SN74LVC1G74DCTR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

