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Texas Instruments V62/12622-01XE
- Part No.:
- V62/12622-01XE
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
V62/12622-01XE.pdf
- Description:
- IC MCU 16/32BIT 2MB FLSH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,747
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Product details
Overview
V62/12622-01XE from Texas Instruments is a radiation-hardened, military-grade 16/32-bit RISC Flash microcontroller based on the ARM® Cortex™-R4F CPU, featuring dual-lockstep CPUs, 2MB Flash with ECC, 160KB SRAM with ECC, and operation from –55°C to 125°C in a 144-pin LQFP (PGE) package. It delivers >224 DMIPS at 140 MHz for safety-critical aerospace and defense real-time control.
For engineers reviewing the V62/12622-01XE datasheet, V62/12622-01XE pinout, V62/12622-01XE application, or V62/12622-01XE equivalent, key selection criteria include its GEIA-STD-00021-1 qualification, dual-CPU lockstep architecture, FlexRay/CAN/LIN interface support, NHET timer channels, and 25-channel 12-bit ADC capability.
Technical Context
The V62/12622-01XE implements a dual-core ARM Cortex-R4F CPU executing in lockstep with built-in BIST, ECC on Flash/SRAM, and parity on peripheral memories - all required for IEC 61508 SIL3 and GEIA-STD-00021-1 compliance. Its FMzPLL clock module provides frequency-modulated PLL-based clock generation with oscillator and PLL monitoring.
It integrates three MibSPI interfaces (each with 128 buffers and parity), two LIN/UART (SCI) controllers supporting LIN 2.0, two DCAN controllers (64 mailboxes each, CAN 2.0B), and a 25-channel High-End Timer (NHET) with dedicated transfer unit and MPU-protected RAM - optimized for deterministic timing in flight control and engine management systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-R4F dual-core in lockstep, 1.6 DMIPS/MHz, 140 MHz max - enables real-time fault detection via hardware comparison. |
| Memory | 2MB Flash with SECDED ECC + 160KB SRAM with SECDED ECC - ensures data integrity across full military temperature range. |
| ADC | Two 12-bit MibADCs, 20 total input channels, 64-word parity-protected buffer per ADC - supports sensor acquisition in harsh environments. |
| Communication | 2× LIN/UART (SCI), 2× DCAN (CAN 2.0B), 3× MibSPI, no FlexRay - matches vehicle subsystems requiring dual CAN + LIN coexistence. |
| Timer | 25-channel NHET with 128-word parity RAM and MPU-protected transfer unit - delivers precise PWM, capture, and actuator timing without CPU overhead. |
| Package | 144-pin LQFP (PGE), 20 mm × 20 mm, 0.5 mm pitch - compatible with standard high-reliability PCB assembly and thermal cycling requirements. |
| Supply | VCC = 1.5 V (core), VCCIO = 3.3 V (I/O) - separates power domains to reduce noise coupling between logic and interface circuits. |
| Temp Range | –55°C to +125°C - qualified per MIL-PRF-38535 and GEIA-STD-00021-1 for extended-life aerospace deployments. |
Pinout & Package
144-pin Lidded Quad Flat Pack (PGE) package with 0.5 mm pitch, 20 mm × 20 mm body, exposed thermal pad, and RoHS-compliant finish. Pinout validated per TI SPNS209A Rev. August 2012, Table 2-5 and Figure 2-17 (Pin Assignments).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GIOA[7:0]/INT[7:0] | Dedicated General-Purpose I/O with interrupt capability | 8 pins support edge-triggered interrupts for external event handling (e.g., sensor fault signals) without polling overhead. |
| GIOB[7:0] | Dedicated General-Purpose I/O | 8 additional GPIOs for status LEDs, enable controls, or discrete actuator drives in safety-critical subsystems. |
| MIBSPI1SIMO / SOMI / CLK / SCS[3:0] / ENA | Primary MibSPI master interface | Full-duplex SPI with 4 chip selects and enable pin - supports daisy-chained sensors or flash memory expansion with parity-checked transfers. |
| LIN1RX / LIN1TX | LIN 2.0 physical layer interface | Direct connection to LIN bus transceivers; supports both LIN slave node communication and UART emulation in NRZ format. |
| CAN1RX / CAN1TX | DCAN1 physical interface | Compliant with ISO 11898-1; supports up to 1 Mbps CAN 2.0B messaging with 64 mailbox RAM (parity protected) for priority-based message handling. |
| NHET[24:0] | High-End Timer I/O channels | 25 programmable NHET pins for PWM output, input capture, or general-purpose timing - each mapped to dedicated timer resources with autonomous DMA transfer. |
| ECLK | Programmable external clock output | User-configurable ratio of VCLK; used to synchronize external ADCs, FPGAs, or legacy peripherals without external clock generators. |
| RST / PORRST | Reset assertion inputs | Asynchronous reset with power-on reset circuitry - ensures deterministic initialization under voltage brownout or cold-start conditions. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Lockstep Execution | Hardware-level instruction-by-instruction comparison detects transient faults in real time - mandatory for DO-254/DO-178C Level A avionics certification. |
| FMzPLL Clock Monitoring | Integrated oscillator and PLL clock monitor triggers ESM error signaling if clock drift exceeds ±10% - eliminates need for external watchdog oscillators. |
| Parity-Protected Peripheral RAM | All MibSPI, DCAN, NHET, and MibADC buffers include parity bits - prevents silent data corruption in long-duration missions without ECC overhead. |
| EMIF Interface | 16-bit External Memory Interface with 22-bit address bus and 4 chip selects - enables direct attachment of ASRAM, NOR flash, or FPGA configuration memory without glue logic. |
| On-Chip Debug Support | IEEE 1149.1 JTAG, ARM CoreSight, ETMR4 trace, RTP, and DMM - allows non-intrusive code instrumentation and memory patching during flight software updates. |
Applications
| Flight Control Actuation | Engine Control Unit (ECU) |
|---|---|
Use Scenario: Real-time closed-loop control of hydraulic actuators and servo valves in fly-by-wire aircraft systems. IC Role / Device Role / Timing Role: Primary safety controller executing certified control law firmware with lockstep CPU validation and NHET-driven PWM outputs. Use Value: Dual-lockstep execution and ECC memory ensure <10−9 FIT failure rate over 30-year service life per ARP4761 analysis. | Use Scenario: Managing fuel injection, ignition timing, and exhaust gas recirculation in turbine engine control modules. IC Role / Device Role / Timing Role: Central real-time processor interfacing with pressure/temperature sensors via MibADC and driving solenoids via NHET PWM. Use Value: 20-channel 12-bit ADC with parity buffers enables simultaneous sampling of critical engine parameters with deterministic latency ≤2 µs. |
| Aerospace Power Management | Avionics Data Concentrator |
Use Scenario: Monitoring and regulating DC bus voltages, battery charge states, and load shedding in satellite power distribution units. IC Role / Device Role / Timing Role: Fault-tolerant supervisor using GIO inputs for voltage monitor alerts and CAN for telemetry reporting. Use Value: Dual DCAN controllers with 64-mailbox RAM allow concurrent health reporting on two independent CAN buses per MIL-STD-1553B bridge requirements. | Use Scenario: Aggregating ARINC 429, discrete I/O, and sensor data from multiple line-replaceable units (LRUs) onto a central AFDX backbone. IC Role / Device Role / Timing Role: Protocol gateway with LIN/UART for legacy sensor interfaces and MibSPI for FPGA-based protocol translation engines. Use Value: Three MibSPI interfaces with 128-buffer depth support burst-mode data ingestion from up to 3 sensor clusters without CPU intervention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar safety-critical microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| V62/12622-02XE | Same PGE package but includes FlexRay controller and 32 NHET channels - adds 7 extra NHET pins and dual-channel FlexRay PHY interface. | Required for systems needing FlexRay-based time-triggered networking (e.g., brake-by-wire), not supported by V62/12622-01XE. | Select V62/12622-02XE only when FlexRay compliance is mandated; otherwise V62/12622-01XE reduces BOM cost and layout complexity. |
| TMS570LS20206-EP | Identical silicon die and feature set, but packaged in 337-pin NFBGA (GWT); operates at 160 MHz vs. 140 MHz for V62/12622-01XE. | Suitable for space-constrained, high-density boards where BGA placement and thermal performance outweigh QFP rework advantages. | V62/12622-01XE is preferred for through-hole prototyping, manual rework, and thermal cycling reliability; TMS570LS20206-EP suits high-pin-count production designs. |
Compared with V62/12622-02XE, the V62/12622-01XE omits FlexRay and reduces NHET count - lowering cost and power while retaining full CAN/LIN/MibSPI functionality for non-time-triggered subsystems. Against TMS570LS20206-EP, it trades 20 MHz speed and BGA density for QFP manufacturability and extended thermal cycle endurance.
Availability
V62/12622-01XE is available at Aetrix Electronics and suitable for flight control actuation, engine management, and aerospace power distribution requiring stable component supply across extended product lifecycles and extreme environmental conditions.
Supply support for V62/12622-01XE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal processing technologies with over 50 years of aerospace and defense component experience.
The TMS570LS series was designed specifically for IEC 61508 SIL3 and GEIA-STD-00021-1 certified applications in flight control, engine management, and mission-critical avionics - emphasizing lockstep redundancy, memory protection, and extended-temperature reliability.
FAQ
What is the maximum operating frequency of the V62/12622-01XE?
The V62/12622-01XE operates at a maximum system clock frequency of 140 MHz, delivering over 224 DMIPS performance. This is confirmed in TI's SPNS209A datasheet Section 2.2, which specifies 140 MHz for the TMS570LS20206 variant in the PGE package - the exact configuration of the V62/12622-01XE. The device achieves this while maintaining full ECC, parity, and lockstep validation at –55°C to +125°C.
Does the V62/12622-01XE support FlexRay communication?
No, the V62/12622-01XE does not support FlexRay. Per TI SPNS209A Section 2.2, the TMS570LS20206 variant (which maps to V62/12622-01XE) explicitly lists "–" for FlexRay in both BGA and QFP configurations. FlexRay is only available on the TMS570LS20216 variants (V62/12622-02XE/YE). The V62/12622-01XE retains full support for three MibSPI, two LIN/UART, and two DCAN interfaces.
How many ADC input channels does the V62/12622-01XE provide?
The V62/12622-01XE integrates two 12-bit Multi-Buffered ADCs (MibADCs) with a total of 20 input channels - 8 shared between the two ADCs and 12 dedicated (6 per ADC). This is specified in TI SPNS209A Table 2-2 for the TMS570LS20206 in PGE package. Each ADC has 64-word parity-protected buffer RAM, enabling synchronized sampling sequences triggered by NHET or external events.
What package type and pin count does the V62/12622-01XE use?
The V62/12622-01XE uses a 144-pin Lidded Quad Flat Pack (PGE) package with 0.5 mm pitch and 20 mm × 20 mm body size. This is confirmed in TI's SPNS209A Section 1.4 Ordering Information, where V62/12622-01XE is explicitly linked to the "LQFP (PGE)" package option. The PGE package supports manual rework, thermal cycling reliability, and compatibility with legacy aerospace PCB assembly processes.
Is the V62/12622-01XE qualified for extended temperature operation?
Yes, the V62/12622-01XE is rated for operation from –55°C to +125°C and qualified per GEIA-STD-00021-1 for Aerospace Qualified Electronic Components. This is stated in SPNS209A Section 1.2 ("SUPPORTS DEFENSE AND AEROSPACE APPLICATIONS") and verified in the ordering table where V62/12622-01XE is assigned the "–55°C to 125°C" temperature grade. All specifications - including Flash ECC, SRAM ECC, and NHET timing - are guaranteed across this full range.
V62/12622-01XE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 144-LQFP
- Series:
- TMS570LS
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R4F
- Core Size:
- 16/32-Bit
- Speed:
- 140MHz
- Connectivity:
- CANbus, LINbus, SCI, SPI, UART/USART
- Peripherals:
- DMA, POR
- Number of I/O:
- 68
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 160K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.35V ~ 1.65V
- Data Converters:
- A/D 20x12b
- Oscillator Type:
- External
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
V62/12622-01XE FAQ
1.How can I place an order for V62/12622-01XE through Aetrix?
Please submit a Request for Quotation (RFQ) for V62/12622-01XE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for V62/12622-01XE reliable?
The price and inventory of V62/12622-01XE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for V62/12622-01XE is usually 5 days.
3.What payment methods are accepted for V62/12622-01XE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for V62/12622-01XE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for V62/12622-01XE?
V62/12622-01XE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your V62/12622-01XE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for V62/12622-01XE?
For technical support, including V62/12622-01XE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your V62/12622-01XE requirements.
6.How does Aetrix verify that V62/12622-01XE is sourced from the original manufacturer or authorized distributors?
All V62/12622-01XE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that V62/12622-01XE meets industry standards.
7.What is the process for return or replacement of V62/12622-01XE?
All V62/12622-01XE units undergo pre-shipment inspection (PSI). If there is an issue with V62/12622-01XE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The V62/12622-01XE part is unused and in its original packaging.
Return procedure for V62/12622-01XE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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