Texas Instruments V62/13604-01XE-T

Overview

TPS54010-EP (V62/13604-01XE-T) from Texas Instruments is a radiation-hardened, synchronous buck PWM switcher with integrated 8-mΩ high- and low-side MOSFETs, delivering up to 14-A continuous output current from a 2.2-V to 4-V input range, adjustable down to 0.9-V output voltage, and operating across –55°C to 125°C for defense/aerospace systems requiring point-of-load regulation for FPGAs and DSPs.

For engineers reviewing the V62/13604-01XE-T datasheet, V62/13604-01XE-T pinout, V62/13604-01XE-T application, or V62/13604-01XE-T equivalent, key selection criteria include its military-grade thermal performance (θJCbot = 0.9°C/W), externally compensated control loop, 280–700 kHz adjustable switching frequency, and PowerPAD™ TSSOP-28 package optimized for high-density, high-reliability power delivery in harsh environments.

Technical Context

The V62/13604-01XE-T implements a voltage-mode PWM controller with a true high-performance error amplifier (90–110 dB open-loop gain, 3–5 MHz unity-gain bandwidth) and adaptive dead-time logic. It integrates undervoltage lockout (UVLO start at 2.95 V), internal/external slow-start (3.35 ms typical), and peak-current limiting with 100-ns leading-edge blanking.

Its dual-input architecture separates PVIN (2.2–4 V, power FET bias) from VIN (3–4 V, control circuitry), enabling efficient 2.5-V/3.3-V distributed power bus operation. The device supports synchronization (SYNC pin, 300–700 kHz), external frequency setting via RT resistor, and power-good signaling with 93% Vref threshold and 3% hysteresis.

Key Specifications

Pinout & Package

The V62/13604-01XE-T is housed in a thermally enhanced 28-pin HTSSOP (PWP) PowerPAD™ package with an exposed copper thermal pad on the underside, requiring solder connection to a dedicated PCB ground plane for optimal thermal performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous buck regulator applications.

Compared with TPS54020-EP and LMZ12012TZE/NOPB, the V62/13604-01XE-T uniquely balances military-grade reliability, 14-A output, adjustable voltage, and external loop control-making it optimal for FPGA/DSP point-of-load designs where thermal density, precision regulation, and design flexibility are jointly critical.

Availability

V62/13604-01XE-T is available at Aetrix Electronics and suitable for defense avionics, satellite power systems, and ruggedized industrial controllers requiring stable component supply across extended temperature and long product lifecycles.

Supply support for V62/13604-01XE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-reliability ICs, with decades of heritage in space-qualified and military-grade power management solutions.

The TPS54010-EP belongs to TI's SWIFT™ family of radiation-tolerant dc/dc regulators, designed specifically for high-density, high-reliability point-of-load conversion in defense, aerospace, and medical systems operating across extreme temperatures.

FAQ

What is the maximum continuous output current supported by the V62/13604-01XE-T?

The V62/13604-01XE-T supports 14-A continuous output current under recommended operating conditions (PVIN = 2.2–4 V, TJ ≤ 125°C). This rating is enabled by its integrated 8-mΩ MOSFETs and thermally optimized PowerPAD™ HTSSOP-28 package, which achieves θJCbot = 0.9°C/W for efficient heat transfer to the PCB ground plane. Derating applies above 125°C junction temperature.

Does the V62/13604-01XE-T require external compensation components?

Yes, the V62/13604-01XE-T is externally compensated: users must implement a Type-III compensation network between COMP and VSENSE pins using resistors and capacitors. This design choice provides full control over loop stability, crossover frequency, and transient response-critical for meeting stringent regulation requirements in FPGA and DSP applications where output filter L/C values vary.

What is the purpose of the separate PVIN and VIN pins on the V62/13604-01XE-T?

The V62/13604-01XE-T uses separate PVIN (2.2–4 V) and VIN (3–4 V) inputs to independently power the power MOSFET stage and control circuitry. This separation allows system designers to optimize efficiency-for example, using a 2.5-V distributed bus for PVIN while supplying 3.3-V control logic from a cleaner, lower-noise rail-reducing cross-coupling and improving overall power integrity in multi-rail systems.

Can the V62/13604-01XE-T be synchronized to an external clock source?

Yes, the V62/13604-01XE-T supports external synchronization via its SYNC pin, accepting TTL/CMOS-compatible signals from 300 kHz to 700 kHz. When used, the internal oscillator is disabled and the device locks to the external frequency, enabling EMI reduction through clock harmonization in multi-converter systems-such as those found in phased-array radar or high-speed networking equipment.

What thermal management practices are required for reliable operation of the V62/13604-01XE-T at full 14-A load?

Reliable 14-A operation requires soldering the V62/13604-01XE-T's exposed PowerPAD to a dedicated PCB ground plane using ≥12 thermal vias (8 in pad, 4 under package), minimum 3-inch × 3-inch 1-oz copper area, and proper separation of analog (AGND) and power (PGND) grounds. TI recommends routing PH traces with minimal loop area and placing input/output capacitors adjacent to PVIN/PGND pins to maintain θJA ≤ 30.5°C/W and prevent thermal shutdown.