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Texas Instruments V62/18606-01XF

Part No.:
V62/18606-01XF
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
337-LFBGA
Datasheet:
AetrixV62/18606-01XF.pdf
Description:
IC MCU 32BIT 4MB FLASH 337LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,429

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Product details

Overview

V62/18606-01XF from Texas Instruments is a radiation-tolerant, high-integrity automotive-grade ARM® Cortex®-R5F dual-core microcontroller designed for safety-critical aerospace and defense systems. It integrates 4MB ECC-protected flash, 512KB ECC-protected RAM, dual-lockstep CPUs operating up to 300 MHz, and supports ISO 26262 ASIL-D and IEC 61508 SIL-3 compliance. It is deployed in flight control computers and satellite power management units requiring fault detection, self-test, and error signaling.

For engineers reviewing the V62/18606-01XF datasheet, V62/18606-01XF pinout, V62/18606-01XF application, or V62/18606-01XF equivalent, key selection criteria include lockstep CPU architecture, ECC coverage across memory and peripherals, extended temperature range (–55°C to 125°C), EMIF support for external memory expansion, and integrated safety modules including ESM, BIST, and FMPLL with slip detection.

Technical Context

The V62/18606-01XF implements two ARM Cortex-R5F cores executing in hardware-enforced lockstep with 32KB I-cache and 32KB D-cache, both protected by ECC. Its safety architecture includes dedicated Error Signaling Module (ESM) with nERROR output, Built-In Self-Test (BIST) for CPU and N2HET coprocessors, and voltage/clock monitoring circuits.

Peripherals are safety-architected: dual VIM interrupt controllers operate in lockstep mode with ECC-protected vector tables; two CRC modules verify data integrity; DMA controller features ECC-protected control RAM and MPU protection; and all four DCAN modules comply with CAN 2.0B at up to 1 Mbps with 64 ECC-protected mailboxes.

Key Specifications

Parameter Value and Actual Design Meaning
CPU CoreARM Cortex-R5F dual-core, lockstep execution, 1.66 DMIPS/MHz, up to 300 MHz (498 DMIPS total)
Memory4MB program flash + 128KB data flash (emulated EEPROM), all with ECC; 512KB SRAM with ECC
Operating Range–55°C to +125°C ambient, controlled baseline with extended product lifecycle for defense/aerospace use
Safety FeaturesDual-lockstep CPUs, ECC on caches/flash/RAM, BIST for CPU/N2HET/SRAM, ESM with nERROR pin, voltage/clock monitors
Communication4× DCAN (CAN 2.0B, 1 Mbps), 5× MibSPI, 4× UART/SCI (2 with LIN 2.1), 2× I²C, 1× EMAC (MII/RMII/MDIO), 1× FlexRay (2-channel, 10 Mbps/channel)
Timers & ADC2× N2HET (32 channels each), 7× ePWM, 6× eCAP, 2× eQEP, 2× 12-bit MibADC (41 total channels, 64-word parity-protected buffers)
Package337-ball NFBGA (GWT), 16.00 mm × 16.00 mm, green RoHS-compliant

Pinout & Package

Package: 337-ball NFBGA (GWT), 16.00 mm × 16.00 mm body size, 0.8 mm ball pitch, green RoHS-compliant construction per TI SPNS253A.

Pin/Terminal Circuit Role Design Meaning
nERRORError signaling outputActive-low open-drain fault indicator asserted by ESM on detected internal error (e.g., ECC double-bit fault, clock failure)
nPORRSTPower-on reset inputAsynchronous reset input that initializes device state; holds I/Os in high-impedance with default pulls until release
VCC, VCCIO, VCCAD, VCCPLLPower domainsSeparate supplies: core (1.14–1.32 V), I/O (3.0–3.6 V), analog (3.3 V), PLL (1.1 V); enable domain-specific power sequencing and isolation
AD1IN[0]–AD1IN[31], AD2IN[0]–AD2IN[24]Analog inputs41 total single-ended ADC channels across two MibADC modules; 16 shared; supports temperature sensing via on-die sensors
N2HET1[0]–N2HET1[31], N2HET2[0]–N2HET2[31]High-end timer I/O64 programmable N2HET pins supporting PWM generation, capture, GPIO, or angle generation; each with dedicated instruction RAM and HTU DMA

Key Features

Feature Design Value
Dual-lockstep Cortex-R5F CPUsHardware-synchronized execution with automatic fault detection and fail-safe response-enables ASIL-D system certification without external checker
ECC across all memory domainsSingle-bit correction/double-bit detection on L1 caches, 4MB flash, 512KB RAM, and peripheral memories eliminates silent data corruption in radiation environments
Integrated safety monitoringBuilt-in BIST for CPU/N2HET/SRAM, voltage/clock monitors, and ESM with nERROR output provide autonomous fault detection without host software intervention
Flexible real-time peripheralsTwo N2HET coprocessors (64 I/Os), seven ePWMs with trip-zone protection, six eCAPs, and two eQEPs enable deterministic motor control and sensor interfacing
Robust communication suiteFour CAN 2.0B controllers (64 ECC mailboxes), FlexRay dual-channel, EMAC with MII/RMII, and five MibSPIs support redundant, high-integrity vehicle/avionics networks

Applications

Flight Control Systems Satellite Power Management

Use Scenario: Real-time actuator command and sensor fusion in fly-by-wire aircraft control units.

IC Role / Device Role / Timing Role: Primary safety controller executing certified flight control algorithms with lockstep verification and time-triggered scheduling.

Use Value: Dual-core lockstep + ECC memory + ESM nERROR enables deterministic fault containment and safe degradation per DO-254/DO-178C requirements.

Use Scenario: Autonomous regulation of solar array charging, battery balancing, and telemetry in LEO satellites.

IC Role / Device Role / Timing Role: Radiation-tolerant system-on-chip managing power conversion, thermal monitoring, and command execution under single-event effects.

Use Value: –55°C to 125°C operation, controlled baseline fabrication, and BIST/ECC ensure reliability in extended mission profiles without ground intervention.

Railway Signaling Units Aerospace Actuator Controllers

Use Scenario: Vital interlocking logic and track occupancy detection in ERTMS/ETCS Level 2 signaling cabinets.

IC Role / Device Role / Timing Role: SIL-4-certifiable controller processing inputs from axle counters and balises, driving signal aspects and point machines.

Use Value: Dual VIM lockstep, CRC modules, and EMIF-connected watchdog memory enable end-to-end diagnostic coverage exceeding EN 50128 requirements.

Use Scenario: Closed-loop control of electro-hydraulic actuators in UAV wing surface positioning systems.

IC Role / Device Role / Timing Role: Real-time motion controller using eQEP feedback, ePWM drive outputs, and N2HET-based dead-time compensation.

Use Value: Integrated eQEP + ePWM + N2HET eliminates external timing ICs; ECC-protected MibADC ensures accurate current/voltage sensing despite EMI.

Equivalent & Alternatives

The following parts are listed as comparable options for similar safety-critical microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
TMS570LS3137ZWTCommercial-grade variant; same core/peripherals but rated for –40°C to 105°C, no extended lifecycle controls or radiation toleranceSuitable for industrial automation or non-space automotive ECUs where cost and volume outweigh extreme environmental demandsSelect when full EP qualification (controlled baseline, extended temp, traceability) is not required and budget constraints apply.
SPC574SADPT1AKLQ1STMicroelectronics SPC574S family; Power Architecture core, ASIL-D certified, 3MB flash, 384KB RAM, but lacks FlexRay and N2HET coprocessorPreferred in legacy automotive powertrain designs requiring CAN FD and ISO 26262 toolchain continuity, not aerospace or FlexRay-dependent systemsChoose only if existing SPC574S software stack, CAN FD support, or ST's AUTOSAR ecosystem are mandatory design constraints.

Compared with TMS570LS3137ZWT and SPC574SADPT1AKLQ1, V62/18606-01XF uniquely delivers radiation-hardened operation, extended temperature range, and FlexRay+N2HET co-processing-making it irreplaceable for space-qualified and high-reliability avionics where single-point fault resilience is non-negotiable.

Availability

V62/18606-01XF is available at Aetrix Electronics and suitable for flight control systems, satellite power management, railway signaling units, and aerospace actuator controllers requiring stable component supply across extended product lifecycles.

Supply support for V62/18606-01XF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and digital signal processing technologies with leadership in automotive, industrial, and aerospace markets.

V62/18606-01XF belongs to the Hercules TMS570 family-designed specifically for functional safety applications demanding ASIL-D and SIL-3 certification through integrated lockstep cores, ECC memory, and hardware self-test capabilities.

FAQ

What is the qualified temperature range for V62/18606-01XF?

V62/18606-01XF is qualified for operation from –55°C to +125°C ambient temperature. This extended range is achieved through controlled baseline manufacturing, single assembly/test site, and rigorous screening-making it suitable for defense, aerospace, and downhole industrial applications where commercial-grade MCUs would fail.

Does V62/18606-01XF support JTAG debugging and trace?

Yes, V62/18606-01XF includes IEEE 1149.1 JTAG boundary scan, ARM CoreSight debug infrastructure, ETM instruction/data trace, RTP for RAM/peripheral access tracing, and DMM for external memory writes-all accessible via standard debug probes. These capabilities are fully supported in TI's Code Composer Studio and third-party tools for safety-critical validation.

How does the Error Signaling Module (ESM) function in V62/18606-01XF?

The ESM in V62/18606-01XF continuously monitors internal fault conditions-including ECC double-bit errors, clock failures, and voltage monitor violations-and asserts the dedicated nERROR pin to signal external systems. It operates independently of CPU firmware, enabling fail-safe shutdown or safe state entry even if software is compromised.

Can V62/18606-01XF interface with external SDRAM or NOR flash?

Yes, V62/18606-01XF includes a 16-bit External Memory Interface (EMIF) supporting asynchronous and synchronous memories including SDRAM, SRAM, and NOR flash. The EMIF provides configurable wait states, address/data multiplexing, and dedicated control signals (nRAS, nCAS, nWE) for direct connection without glue logic.

What safety certifications apply to V62/18606-01XF?

V62/18606-01XF is designed to support ISO 26262 ASIL-D and IEC 61508 SIL-3 system-level certification. TI provides functional safety documentation-including FMEDA reports, safety manuals, and diagnostic coverage analysis-to accelerate customer certification efforts for automotive, rail, and industrial safety applications.

V62/18606-01XF Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
337-LFBGA
Series:
Hercules™
Packaging:
Bulk
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit
Speed:
300MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
168
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage - Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 41x12b
Oscillator Type:
Internal
Operating Temperature:
-55°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

V62/18606-01XF FAQ

1.How can I place an order for V62/18606-01XF through Aetrix?

Please submit a Request for Quotation (RFQ) for V62/18606-01XF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for V62/18606-01XF reliable?

The price and inventory of V62/18606-01XF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for V62/18606-01XF is usually 5 days.

3.What payment methods are accepted for V62/18606-01XF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for V62/18606-01XF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for V62/18606-01XF?

V62/18606-01XF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your V62/18606-01XF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for V62/18606-01XF?

For technical support, including V62/18606-01XF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your V62/18606-01XF requirements.

6.How does Aetrix verify that V62/18606-01XF is sourced from the original manufacturer or authorized distributors?

All V62/18606-01XF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that V62/18606-01XF meets industry standards.

7.What is the process for return or replacement of V62/18606-01XF?

All V62/18606-01XF units undergo pre-shipment inspection (PSI). If there is an issue with V62/18606-01XF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The V62/18606-01XF part is unused and in its original packaging.

Return procedure for V62/18606-01XF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

V62/18606-01XF Tags

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