STMicroelectronics VND05BSP-E

Overview

VND05BSP from STMicroelectronics is a dual-channel ISO-compliant high-side smart power solid-state relay built with VIPower technology, designed for automotive and industrial load switching where one side of the load is grounded. It delivers 1.6 A nominal continuous output per channel (9 A at Tc = 85 °C), features 0.2 Ω on-state resistance, 40 V drain-source breakdown voltage, and integrated open-load/overtemperature diagnostics - used in body control modules for driving lamps, solenoids, and valves.

For engineers reviewing the VND05BSP datasheet, VND05BSP pinout, VND05BSP application, or VND05BSP equivalent, key selection criteria include thermal shutdown threshold (140–180 °C), diagnostic delay differentiation (tpovl = 5–10 µs vs. tpol = 50–2500 µs), inductive demagnetization capability (−18 V), 5 V logic compatibility, and PowerSO-10 package thermal resistance (R_thj-case = 2.1 °C/W).

Technical Context

The VND05BSP integrates two independent high-side power switches with shared diagnostic output, each featuring internal MOSFETs controlled by TTL/CMOS-compatible inputs. Its protection architecture includes under-voltage lockout (V_USD = 3.5–6 V), thermal shutdown with 50 °C hysteresis (T_SD = 140–180 °C), and fast inductive demagnetization (V_demag ≈ −18 V) to limit energy dissipation during turn-off.

Diagnostic functionality distinguishes fault types via timing: open-load-in-on-state triggers status low-to-high transition after tpol (50–2500 µs), while overtemperature recovery uses shorter tpovl (5–10 µs). The device operates across −40 to +150 °C junction temperature and supports reverse-battery protection via external Schottky diode or signal-ground reconfiguration.

Key Specifications

Pinout & Package

Package: PowerSO-10™ - thermally enhanced surface-mount package with exposed die pad for direct heatsinking to PCB copper; 10-pin layout optimized for automotive EMI and thermal performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side smart power switch applications.

Compared with VND05BSP, IPS2050H offers smaller footprint but sacrifices dual-channel coordination and diagnostic timing resolution, while VND5E025AK provides higher current capacity but lacks off-state open-load detection and fault-type discrimination - making VND05BSP optimal for ISO-compliant dual-load monitoring in automotive ECUs.

Availability

VND05BSP is available at Aetrix Electronics and suitable for automotive body control modules, industrial PLC output stages, electric power steering auxiliary loads, and commercial vehicle HVAC actuators requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for VND05BSP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power management ICs with vertical manufacturing capabilities and AEC-Q100 qualified product lines.

The VND05BSP belongs to ST's VIPower M0-7 family of high-side drivers, engineered specifically for ISO 16750-compliant automotive load switching with integrated diagnostics, thermal resilience, and robust reverse-battery tolerance.

FAQ

What is the maximum continuous output current per channel at T_c = 85 °C?

The VND05BSP delivers 9 A continuous output current per channel when case temperature is maintained at 85 °C, verified under standard test conditions with adequate PCB copper area and thermal vias. This rating assumes V_CC = 13 V and accounts for internal R_DS(on) self-heating and thermal shutdown margin.

How does the diagnostic output differentiate open-load faults from thermal shutdown events?

The STAT pin uses ISO-defined timing windows: an open-load condition in on-state triggers a low-to-high transition after tpol (50–2500 µs), while thermal recovery produces the same transition after shorter tpovl (5–10 µs). Firmware reads this delay to classify the fault without additional hardware.

Can VND05BSP drive inductive loads without external flyback diodes?

Yes - the device integrates active demagnetization that clamps inductive kickback to −18 V, eliminating need for external freewheeling diodes in most applications. This reduces component count and PCB area, though external TVS may still be recommended for extreme transients beyond −18 V.

What is the minimum recommended PCB pad size for thermal performance in PowerSO-10 package?

STMicroelectronics specifies minimum pad dimensions for FR-4 boards to achieve R_thj-amb = 50 °C/W: 7.4 × 7.2 mm² for the exposed die pad (pins 7–10), with ≥4 thermal vias (0.3 mm diameter) connecting to inner ground planes. Larger copper areas further improve R_thj-case below 2.1 °C/W.