STMicroelectronics VND5004DSP30-E

Overview

VND5004DSP30-E from STMicroelectronics is a dual-channel automotive-grade high-side power switch fabricated in VIPower® M0-5 technology, delivering 4 mΩ on-resistance per channel, 100 A typical current limiting, and integrated analog current sense with 7.5–23 kA/A gain range. It drives resistive/inductive/capacitive loads in 12 V/24 V battery systems with active inrush management and load-dump protection.

For engineers reviewing the VND5004DSP30-E datasheet, VND5004DSP30-E pinout, VND5004DSP30-E application, or VND5004DSP30-E equivalent, key selection criteria include AEC-Q100 qualification, thermal shutdown with auto-restart, reverse-battery self-protection, CMOS-compatible 3.0 V inputs, and proportional current sense disable control for diagnostic flexibility.

Technical Context

The device integrates two independent high-side drivers with dedicated INPUT/OUTPUT/SENSE pins per channel and shared CS_DIS, VCC, and GND. Each channel features active power limitation during inrush and overload, with thermal shutdown triggered at 150–200 °C and automatic recovery after cooling to ≥135 °C.

Its analog current sense delivers a proportional output current (ISENSE) referenced to external sense resistor, with gain calibrated across temperature and load current (K₀ = 7.5–16 kA/A at 10 A). CS_DIS enables high-impedance mode on CURRENT SENSE pins, decoupling diagnostics from system timing constraints.

Key Specifications

Pinout & Package

Package: MultiPowerSO-30 - thermally enhanced 30-pin exposed-pad power SO package with R_thj-case = 0.35 °C/W (one channel ON), optimized for PCB copper area ≥58 mm × 58 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side driver applications.

Compared with VND5004DSP30-E, STSPIN32F0B trades analog sensing and AEC-Q100 Grade 0 for embedded processing, while TPS4H160-Q1 sacrifices thermal robustness and reverse-battery resilience for digital configurability - making VND5004DSP30-E optimal for safety-critical, high-current, thermally demanding automotive power stages.

Availability

VND5004DSP30-E is available at Aetrix Electronics and suitable for front fog lamp control, electric power steering precharge, body control module window lift, and automotive HVAC blower motor applications requiring stable component supply across automotive production lifecycles.

Supply support for VND5004DSP30-E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing silicon solutions for automotive, industrial, and consumer markets since 1987.

The VND5004DSP30-E belongs to ST's VIPower® high-side driver family, engineered specifically for automotive power distribution with integrated protection, diagnostics, and AEC-Q100 compliance.

FAQ

What is the maximum continuous output current per channel?

The VND5004DSP30-E does not specify a fixed maximum continuous current; instead, it uses dynamic current limiting and thermal shutdown. At 25 °C ambient with adequate PCB copper (58 mm × 58 mm), each channel sustains ≥25 A continuously. Current is limited to 100 A typ during short circuits, with power dissipation capped until thermal shutdown at 150–200 °C.

How does the reverse battery protection function without external components?

When VCC is reversed (down to −16 V), the internal PowerMOSFET automatically turns on, creating a low-impedance path that clamps reverse current to a safe level. This behavior is intrinsic to the VIPower® M0-5 process and requires no external diodes, MOSFETs, or control logic - verified per AEC-Q100 stress testing.

Can the CURRENT SENSE pins be used simultaneously with CS_DIS asserted high?

No. When CS_DIS is driven high, both CURRENT SENSE1 and CURRENT SENSE2 pins enter high-impedance state (leakage <5 μA), disabling analog current feedback. This is intentional to isolate diagnostics during startup or fault recovery. To use current sensing, CS_DIS must be low or left floating (default enabled).

What PCB layout practices maximize thermal performance in MultiPowerSO-30?

Mount the exposed thermal pad directly to ≥58 mm × 58 mm of 35 μm Cu on inner layer 1 or 2, with ≥6 thermal vias (0.3 mm diameter, 0.8 mm pitch) connecting to internal ground planes. Avoid solder mask over the pad and ensure solder paste coverage ≥85% to achieve R_thj-amb ≤58 °C/W per channel.