STMicroelectronics VND830ASPTR-E

Overview

VND830ASPTR-E from STMicroelectronics is a double-channel high-side smart power switch in PowerSO-10 package, designed for automotive and industrial load control with ground-referenced loads. It delivers 6 A per channel, features 60 mΩ R_DS(on) at 25 °C, integrated proportional current sense (K = 1300 typ.), thermal shutdown, overvoltage clamp (41–55 V), and undervoltage lockout (4 V typ.). Used in body control modules for driving lamps, solenoids, and actuators.

For engineers reviewing the VND830ASPTR-E datasheet, VND830ASPTR-E pinout, VND830ASPTR-E application, or VND830ASPTR-E equivalent, key selection criteria include per-channel current limiting (6–15 A), analog current sense ratio accuracy (±6% drift), ISO 7637-2 transient immunity (Class C up to Pulse 5), and AEC-Q100 Grade 0 qualification (-40 °C to +150 °C).

Technical Context

The device integrates two independent VIPower™ M0-3 high-side drivers with CMOS-compatible inputs, each featuring dedicated current sense outputs (ISENSE1/2) with programmable gain via external resistor. Sensing is proportional (K = 600–2000) across -40 °C to +150 °C and supports real-time load monitoring without shunt resistors.

Protection architecture includes thermal shutdown (150–200 °C trip), overvoltage clamp (V_CLAMP = V_OV − 5 V), undervoltage lockout (V_USD = 4 V typ.), and short-circuit detection with automatic turn-off. Ground-disconnection detection ensures fail-safe behavior when GND is lost.

Key Specifications

Pinout & Package

Package: PowerSO-10 - thermally enhanced surface-mount package with exposed die pad for low R_thj-case (1.3 °C/W), rated for 74 W dissipation at T_c = 25 °C.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side smart switch applications.

Compared with VND830ASPTR-E, BTS724G trades dual-channel integration and built-in sensing for lower R_DS(on), while NCV8460A offers similar channel count but sacrifices overvoltage protection and sensing accuracy-making VND830ASPTR-E optimal for AEC-Q100-compliant, diagnostic-rich automotive systems.

Availability

VND830ASPTR-E is available at Aetrix Electronics and suitable for automotive body control modules, industrial PLC output stages, electric power steering auxiliary loads, and commercial vehicle HVAC actuators requiring stable component supply across extended temperature and transient environments.

Supply support for VND830ASPTR-E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power management ICs with vertical manufacturing and AEC-Q100 validation expertise.

The VND830ASPTR-E belongs to ST's VIPower™ high-side driver family, engineered specifically for robust, diagnostic-capable load control in automotive electrical architectures where reliability, integration, and functional safety are critical.

FAQ

What is the maximum continuous current per channel under real-world PCB thermal conditions?

At T_c = 100 °C (typical under-hood case temperature), the device sustains 4.5 A per channel continuously, based on R_DS(on) = 120 mΩ max at 150 °C junction and R_thj-case = 1.3 °C/W. Derating curves in Figure 14 confirm 6 A is valid only at T_c ≤ 25 °C; design margin requires thermal simulation using the PowerSO-10 thermal model in Figure 24.

How does the current sense output behave during thermal shutdown?

During thermal shutdown (T_j ≥ 150 °C), the sense output transitions to V_SENSEH = 5.5 V (with R_SENSE = 3.9 kΩ), signaling overtemperature via fixed high-level voltage-not proportional current. This distinct level allows firmware to differentiate overtemperature faults from normal operation or short circuits, which drive I_SENSE to zero.

Can the VND830ASPTR-E drive inductive loads without external flyback diodes?

No. While the internal V_CC clamp handles low-energy transients (ISO 7637 Pulse 1/2), it does not replace external flyback diodes for inductive kickback suppression. For solenoids or motors, a Schottky diode (e.g., STPS30L45CG) must be placed from OUTPUT to V_CC to limit demagnetization energy per Figure 20 and avoid exceeding the 100 mJ maximum specified in Table 2.

Is the N.C. pin (Pin 3) required to be grounded for EMC performance?

Yes. ST recommends tying Pin 3 (N.C.) directly to GND via shortest possible trace, as confirmed in Section 5.2 of the datasheet and Figure 26's pad layout. Leaving it floating increases radiated emissions due to parasitic coupling; grounding reduces common-mode noise by stabilizing internal guard ring potential and improves transient immunity during ISO 7637 testing.