STMicroelectronics VNH3ASP30-E

Overview

VNH3ASP30-E from STMicroelectronics is an AEC-Q100 qualified automotive H-bridge motor driver integrating dual high-side VIPower™ M0 drivers and two vertical EHD low-side MOSFETs in a single MultiPowerSO-30 package. It delivers 30 A continuous output current, supports PWM up to 20 kHz, and provides real-time current sensing via CS pin with 4.7 kA/A typical gain (R_SENSE = 700 Ω). It is used in electric power steering (EPS), HVAC blower control, and seat actuation systems.

For engineers reviewing the VNH3ASP30-E datasheet, VNH3ASP30-E pinout, VNH3ASP30-E application, or VNH3ASP30-E equivalent, key selection criteria include its 42 mΩ max R_DS(on) per leg, integrated cross-conduction protection, thermal shutdown at 150 °C, and diagnostic open-drain ENA/DIAGA & ENB/DIAGB pins with fault pull-down behavior.

Technical Context

The device implements a fully integrated half-bridge pair - each comprising one monolithic high-side driver (VIPower™ M0) and one discrete low-side EHD MOSFET - assembled on electrically isolated lead frames within the MultiPowerSO-30 package. Its logic interface accepts 5 V CMOS-compatible inputs (INA/INB/PWM) with hysteresis and supports bidirectional open-drain enable/diagnostic pins (ENA/DIAGA and ENB/DIAGB) that double as fault indicators and input enables.

Protection architecture includes undervoltage lockout (5.5 V), overvoltage clamp (up to 48 V total clamp voltage), linear current limiting (30–70 A threshold), and thermal shutdown with 15 °C hysteresis. The CS pin delivers a proportional analog current (K₁ = 4700 A/A typ. @ 30 A) referenced to GNDA/GNDB, enabling closed-loop motor current monitoring without external shunt amplifiers.

Key Specifications

Pinout & Package

Package: MultiPowerSO-30™ - thermally enhanced 30-pin power SO package with three electrically isolated copper heat slugs (Heat Slug1 = VCC, Heat Slug2 = OUTB, Heat Slug3 = OUTA) for optimized PCB-level heat dissipation in automotive under-hood environments.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar H-bridge motor driver applications.

Compared with DRV3205-Q1 and MPQ6532-AEC1, the VNH3ASP30-E uniquely combines AEC-Q100 Grade 0 qualification, integrated current sense with ±8% drift over temperature, and dual open-drain diagnostic pins - making it the only option qualified for safety-critical, high-current automotive motion control where functional safety and real-time fault visibility are mandatory.

Availability

VNH3ASP30-E is available at Aetrix Electronics and suitable for electric power steering (EPS), HVAC blower control, and power seat actuation requiring stable component supply across automotive production lifecycles.

Supply support for VNH3ASP30-E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive-grade power ICs, microcontrollers, and sensors.

The VNH3ASP30-E belongs to ST's VIPower™ automotive motor driver family, designed specifically for robust, high-current DC motor control in harsh vehicle environments with integrated protection and diagnostics.

FAQ

What is the maximum allowable V_CC voltage before overvoltage shutdown activates?

The VNH3ASP30-E triggers overvoltage shutdown at 16 V minimum, with typical activation at 19 V and absolute maximum clamping at 48 V (V_CLP). This protects internal VIPower™ transistors from transients such as load dump (ISO 7637-2 Pulse 5a), ensuring survival in 24 V commercial vehicle systems with 12 V nominal rails.

How does the current-sense output (CS pin) interface with a microcontroller ADC?

The CS pin sources a current (I_SENSE) proportional to motor current (I_OUT), typically 21 mA at 30 A with a 700 Ω external resistor. This generates ~14.7 V across the resistor, so a voltage divider (e.g., 10 kΩ + 4.7 kΩ) is required to scale it to 0–3.3 V for standard MCU ADCs. Leakage remains below 70 µA over temperature, preserving accuracy.

Can ENA/DIAGA and ENB/DIAGB be used simultaneously as both enable inputs and fault indicators?

Yes - each pin operates in bidirectional mode: when externally pulled high (via ≥10 kΩ resistor), it enables its half-bridge; when pulled low by the device, it signals a fault (e.g., thermal shutdown or overcurrent). No external logic is needed to distinguish modes - the microcontroller reads the pin state and controls pull-up accordingly per operational phase.

What PCB layout practices are critical for thermal performance in MultiPowerSO-30?

Maximize copper area under all three heat slugs (VCC, OUTA, OUTB) with ≥6 oz copper and multiple thermal vias (≥12 per slug) connecting to inner-layer ground/power planes. Avoid splitting GNDA/GNDB pours - they must be shorted externally with ≥3 mm wide traces. ST recommends ≥2000 mm² total heatsink area to maintain T_J < 125 °C at 30 A continuous.