STMicroelectronics VNQ860SP-E

Overview

VNQ860SP-E from STMicroelectronics is a quad-channel high-side driver IC realized in VIPower M0-3 technology, designed to drive resistive, capacitive, and inductive loads with one side grounded. It features 41 V maximum supply voltage, ≤0.270 Ω R_DS(on) per channel at 25 °C, fast demagnetization (V_DEMAG = V_CC − 52 V), per-channel thermal shutdown, and ground-loss detection-making it suitable for IEC 61131-compliant industrial control systems.

For engineers reviewing the VNQ860SP-E datasheet, VNQ860SP-E pinout, VNQ860SP-E application, or VNQ860SP-E equivalent, key selection criteria include channel-wise current limiting (0.35 A typ.), undervoltage/overvoltage protection thresholds (4 V / 42 V), CMOS-compatible inputs, status pin diagnostics, and PowerSO-10™ thermal performance under industrial ambient conditions.

Technical Context

This device integrates four independent high-side power switches with active current limiting, thermal sensing, and fault reporting via a shared open-drain status pin. Each channel implements autonomous protection: overcurrent clamping at 0.35–1.1 A, thermal shutdown at 150–200 °C, and automatic restart after fault clearance.

The architecture supports reverse-polarity resilience via external RGND resistor design, enables fast inductive load demagnetization through internal clamp diodes (V_DEMAG ≈ V_CC − 52 V), and delivers precise logic-level compatibility with VIH = 3.25 V and VIL = 1.25 V-ensuring robust interfacing with microcontrollers and PLC I/O modules.

Key Specifications

Pinout & Package

Package: PowerSO-10™ - Exposed pad thermally enhanced SO-style package with 10 terminals, optimized for high-power density and PCB heat spreading (R_th(j-c) = 1.4 °C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side driver applications.

Compared with IPS2050H and TPS27082L, the VNQ860SP-E uniquely combines quad-channel integration, V_CC−52 V demagnetization, and ground-loss shutdown-enabling compact, safety-certifiable designs without external protection components.

Availability

VNQ860SP-E is available at Aetrix Electronics and suitable for industrial PC peripheral I/O, numerical control machines, and drivers for resistive/capacitive/inductive loads requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for VNQ860SP-E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power management solutions with vertical manufacturing and broad IP portfolio.

The VNQ860SP-E belongs to ST's VIPower high-voltage intelligent power IC family, engineered specifically for ruggedized industrial control applications demanding integrated protection, diagnostics, and IEC 61131 compliance.

FAQ

What is the maximum continuous output current per channel?

The VNQ860SP-E supports up to 0.35 A typical continuous output current per channel at 25 °C, with current limiting activating between 0.35 A and 1.1 A depending on junction temperature and load conditions. Derating is required above 25 °C per the thermal data in DS4107 Rev 9, Table 2.

Does the STATUS pin indicate which specific channel has failed?

No-the STATUS pin is a single open-drain output that goes low whenever any channel experiences overcurrent, overtemperature, undervoltage, overvoltage, or ground-loss fault. Channel-specific diagnosis requires external monitoring of individual IN/OUT states or use of companion controllers with status decoding logic.

Can VNQ860SP-E drive inductive loads without external flyback diodes?

Yes-the device integrates an internal clamp diode that activates during turn-off to limit V_DEMAG to V_CC − 52 V (typ.), safely dissipating inductive energy. This eliminates the need for external freewheeling diodes in most 24 V industrial applications with moderate inductance.

What is the recommended PCB layout for thermal performance?

Mount the PowerSO-10™ package on FR4 with ≥6 cm² of 35 μm-thick copper connected to all V_CC pins to achieve R_th(j-a) = 37 °C/W. The exposed pad must be soldered to a large thermal plane; thermal vias under the pad improve heat transfer to inner layers or backside copper.