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Vishay General Semiconductor - Diodes Division VS-20ETF04STRR-M3
- Part No.:
- VS-20ETF04STRR-M3
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Category:
- Single Diodes
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
VS-20ETF04STRR-M3.pdf
- Description:
- DIODE GEN PURP 400V 20A TO263AB
- Quantity:
- Payment:
- Shipping:
Inventory:7,200
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Product details
Overview
VS-20ETF04STRR-M3 from Vishay Semiconductors is a surface-mount fast soft recovery rectifier diode rated for 20 A average forward current, 400 V peak reverse voltage (VRRM), and 60 ns typical reverse recovery time (trr) at 1 A/100 A/μs. It features glass-passivated junction, D2PAK (TO-263AB) package, and is optimized for high-efficiency output rectification in DC-DC converters.
For engineers reviewing the VS-20ETF04STRR-M3 datasheet, VS-20ETF04STRR-M3 pinout, VS-20ETF04STRR-M3 application, or VS-20ETF04STRR-M3 equivalent, key selection criteria include soft recovery behavior (snap factor = 0.6), low forward voltage drop (1.30 V at 20 A, TJ = 25 °C), thermal resistance (RthJC = 0.9 °C/W), and compliance with JEDEC JESD47 and J-STD-020 MSL level 1.
Technical Context
This diode employs a soft-recovery silicon structure engineered to minimize EMI generation during commutation by suppressing current snap-off. Its trr of 60 ns (at 1 A, 100 A/μs) and Qrr of 1.25 μC (TJ = 25 °C) reflect controlled minority-carrier recombination dynamics.
The D2PAK package enables high-power dissipation with low thermal resistance: RthJC = 0.9 °C/W under DC operation and RthJA = 40 °C/W on 1"² FR-4 PCB. The device operates across -40 °C to +150 °C junction temperature range and supports surge currents up to 300 A (10 ms, no voltage reapplied).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 400 V - Maximum repetitive peak reverse voltage; defines safe blocking capability in 400 V bus applications. |
| IF(AV) | 20 A - Average forward current at TC = 97 °C; determines continuous power handling with heatsinking. |
| VF | 1.30 V at 20 A, TJ = 25 °C - Forward voltage drop directly impacts conduction loss and thermal design margin. |
| trr | 60 ns at 1 A, 100 A/μs - Reverse recovery time governs switching loss and EMI in hard-switched topologies. |
| RthJC | 0.9 °C/W - Junction-to-case thermal resistance; enables precise heatsink sizing for thermal management. |
| Qrr | 1.25 μC at TJ = 25 °C - Reverse recovery charge influences snubber sizing and cross-conduction risk in bridge circuits. |
| Snap factor | 0.6 - Ratio of peak reverse recovery current to di/dt-induced current; quantifies softness for EMI-sensitive designs. |
Pinout & Package
D2PAK (TO-263AB) package with exposed thermal pad (pin 2), anode (pin 1), and cathode (pin 3). Mounting requires soldering the thermal pad to a large copper area for optimal heat transfer.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Anode | Forward current entry point; connects to high-side switch node or AC input in bridge configurations. |
| 2 | Thermal Pad / Cathode Tie | Electrically connected to cathode; primary heat path to PCB; must be soldered to thermal plane. |
| 3 | Cathode | Forward current exit point; ties to output rail or ground reference in freewheeling paths. |
Key Features
| Feature | Design Value |
|---|---|
| Glass passivated chip junction | Ensures long-term reliability under severe thermal cycling and humidity exposure per JESD47 qualification. |
| Soft recovery profile (snap factor = 0.6) | Reduces high-frequency ringing and conducted EMI in inverters and choppers without requiring external snubbers. |
| MSL level 1 (245 °C peak) | Enables standard lead-free reflow assembly without moisture sensitivity concerns or baking requirements. |
| RthJC = 0.9 °C/W | Supports >20 W power dissipation with modest heatsinking-critical for compact industrial converter designs. |
| Halogen-free, RoHS-compliant, Pb-free terminations (-M3) | Meets global environmental compliance mandates while maintaining solderability and intermetallic integrity. |
Applications
| Motor Drive Inverter Output | Industrial DC-DC Converter Rectification |
|---|---|
Use Scenario: Freewheeling path in 400 V three-phase motor drives using IGBTs or SiC MOSFETs. IC Role / Device Role / Timing Role: Fast soft-recovery freewheeling diode absorbing inductive energy during switch turn-off. Use Value: Low Qrr (1.25 μC) and soft snap factor (0.6) suppress voltage overshoot and reduce EMI filter size. |
Use Scenario: Secondary-side synchronous rectification replacement in isolated 400 V input telecom or server PSUs. IC Role / Device Role / Timing Role: High-current unidirectional power path with minimal conduction loss and controlled recovery. Use Value: 1.30 V VF at 20 A lowers conduction loss vs. standard fast rectifiers; D2PAK thermal pad enables direct PCB heatsinking. |
| Solar Microinverter Input Stage | UPS Battery Charger Rectification |
Use Scenario: MPPT-stage input rectification in transformerless solar microinverters operating at 400 V DC link. IC Role / Device Role / Timing Role: High-voltage, high-reliability AC-to-DC interface with low leakage at elevated temperature. Use Value: IRRM ≤ 5 mA at 150 °C ensures minimal standby loss; glass passivation prevents degradation under UV/thermal stress. |
Use Scenario: Bulk rectification in 400 V battery charging circuits for industrial UPS systems. IC Role / Device Role / Timing Role: Main power conversion element handling continuous 20 A load with surge tolerance. Use Value: 300 A non-repetitive surge rating (10 ms, no voltage reapplied) withstands battery inrush and fault transients. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fast soft recovery rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STTH2004D | Same VRRM (400 V), higher trr (75 ns), higher VF (1.45 V @ 20 A), TO-220AC package. | Larger footprint, lower thermal performance (RthJC ≈ 2.5 °C/W), less suitable for high-density SMT layouts. | Select when legacy through-hole assembly or lower-cost procurement outweighs thermal and EMI advantages of VS-20ETF04STRR-M3. |
| IXYS MBR2045CT | Higher VRRM (450 V), Schottky architecture (no recovery), but limited to 150 °C max TJ, higher leakage. | Zero trr eliminates recovery loss, but IRRM rises sharply above 125 °C-unsuitable for high-temp freewheeling. | Select only in low-temperature, low-leakage-critical applications where zero recovery loss justifies reduced thermal margin. |
Compared with STTH2004D and MBR2045CT, VS-20ETF04STRR-M3 delivers superior EMI control via soft recovery (snap factor 0.6), better thermal management (RthJC = 0.9 °C/W), and SMT compatibility-making it optimal for space-constrained, high-efficiency 400 V industrial power stages.
Availability
VS-20ETF04STRR-M3 is available at Aetrix Electronics and suitable for industrial motor drives, solar microinverters, UPS battery chargers, and high-density DC-DC converters requiring stable component supply and long-lifecycle support.
Supply support for VS-20ETF04STRR-M3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Intertechnology is a global semiconductor manufacturer specializing in discrete components, sensors, and passive elements, with leadership in power rectification and high-reliability packaging.
The VS-20ETF..S-M3 series was designed specifically for high-efficiency, EMI-sensitive power conversion in industrial and renewable energy systems-emphasizing soft recovery, thermal robustness, and JEDEC-qualified reliability.
FAQ
What is the maximum junction temperature rating for VS-20ETF04STRR-M3?
The VS-20ETF04STRR-M3 has a maximum junction temperature (TJ) of +150 °C and a storage temperature range of -40 °C to +150 °C. This rating is validated per JEDEC JESD47 qualification and supports operation in demanding industrial environments where ambient temperatures exceed 85 °C. Derating curves in the datasheet (Fig. 1–2) define allowable current versus case temperature, with full 20 A IF(AV) permitted at TC = 97 °C.
Does VS-20ETF04STRR-M3 have a halogen-free and RoHS-compliant construction?
Yes, the "-M3" suffix on VS-20ETF04STRR-M3 explicitly denotes halogen-free, RoHS-compliant materials and lead (Pb)-free terminations. This complies with Directive 2011/65/EU and IPC-1752A material declarations. The device meets Vishay's material categorization standards per doc#99912 and is suitable for environmentally regulated end equipment including industrial automation and renewable energy systems.
What is the reverse leakage current specification for VS-20ETF04STRR-M3 at elevated temperature?
At TJ = 150 °C and rated VRRM = 400 V, the maximum reverse leakage current (IRRM) for VS-20ETF04STRR-M3 is 5.0 mA. At TJ = 25 °C, it is limited to 0.1 mA. This low high-temperature leakage supports reliable operation in thermally stressed applications such as enclosed motor drives or solar inverters, where thermal runaway must be avoided.
How does the soft recovery characteristic of VS-20ETF04STRR-M3 reduce EMI in power converters?
The VS-20ETF04STRR-M3 achieves EMI reduction through its controlled soft recovery profile, quantified by a snap factor of 0.6. This means the peak reverse recovery current (Irr) is only 60% of the theoretical di/dt-induced current, minimizing high-frequency ringing during turn-off. As confirmed in Fig. 8–9 of the datasheet, this behavior reduces spectral content above 30 MHz-lowering conducted emissions and easing compliance with CISPR 11/32 Class A limits without added snubbers.
What PCB layout guidance applies to the thermal pad of VS-20ETF04STRR-M3?
The D2PAK thermal pad (pin 2) of VS-20ETF04STRR-M3 must be soldered to a minimum 1"² (650 mm²) FR-4 PCB copper area with 4 oz. (140 μm) thickness to achieve the specified RthJA = 40 °C/W. Per application note AN-994, recommended footprint includes thermal vias (≥6 × 0.3 mm diameter) connecting the pad to internal ground planes. Avoid solder mask over the pad and ensure stencil aperture matches pad geometry for ≥80% solder fill.
VS-20ETF04STRR-M3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Series:
- -
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 400 V
- Current - Average Rectified (Io):
- 20A
- Voltage - Forward (Vf) (Max) @ If:
- 1.3 V @ 20 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 160 ns
- Current - Reverse Leakage @ Vr:
- 100 µA @ 400 V
- Capacitance @ Vr, F:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-263AB (D2PAK)
- Operating Temperature - Junction:
- -40°C ~ 150°C
VS-20ETF04STRR-M3 FAQ
1.How can I place an order for VS-20ETF04STRR-M3 through Aetrix?
Please submit a Request for Quotation (RFQ) for VS-20ETF04STRR-M3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for VS-20ETF04STRR-M3 reliable?
The price and inventory of VS-20ETF04STRR-M3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for VS-20ETF04STRR-M3 is usually 5 days.
3.What payment methods are accepted for VS-20ETF04STRR-M3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for VS-20ETF04STRR-M3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for VS-20ETF04STRR-M3?
VS-20ETF04STRR-M3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your VS-20ETF04STRR-M3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for VS-20ETF04STRR-M3?
For technical support, including VS-20ETF04STRR-M3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your VS-20ETF04STRR-M3 requirements.
6.How does Aetrix verify that VS-20ETF04STRR-M3 is sourced from the original manufacturer or authorized distributors?
All VS-20ETF04STRR-M3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that VS-20ETF04STRR-M3 meets industry standards.
7.What is the process for return or replacement of VS-20ETF04STRR-M3?
All VS-20ETF04STRR-M3 units undergo pre-shipment inspection (PSI). If there is an issue with VS-20ETF04STRR-M3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The VS-20ETF04STRR-M3 part is unused and in its original packaging.
Return procedure for VS-20ETF04STRR-M3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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