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Vishay General Semiconductor - Diodes Division VS-8EWF06SPBF
- Part No.:
- VS-8EWF06SPBF
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Category:
- Single Diodes
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
VS-8EWF06SPBF.pdf
- Description:
- DIODE GEN PURP 600V 8A TO252
- Quantity:
- Payment:
- Shipping:
Inventory:6,975
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Product details
Overview
VS-8EWF06SPBF from Vishay Semiconductors is a surface-mount fast soft recovery rectifier diode optimized for high-efficiency power conversion, featuring 600 V maximum peak reverse voltage (VRRM), 8 A average forward current (IF(AV)), 1.2 V forward voltage drop at 8 A and 25 °C, 55 ns reverse recovery time (trr), and TO-252AA (D-PAK) package. It serves as an output rectifier or freewheeling diode in industrial DC/DC converters requiring low EMI and stable thermal cycling performance.
For engineers reviewing the VS-8EWF06SPBF datasheet, VS-8EWF06SPBF pinout, VS-8EWF06SPBF application, or VS-8EWF06SPBF equivalent, key selection criteria include its soft recovery behavior (snap factor = 0.5), 150 A non-repetitive surge rating, 2.5 °C/W junction-to-case thermal resistance, and compliance with J-STD-020 MSL Level 1 for lead-free reflow.
Technical Context
This diode employs a glass-passivated silicon junction engineered for simultaneous optimization of trr, VF, and IR, enabling reduced switching losses and lower conducted EMI in hard-switched topologies. Its soft recovery profile minimizes voltage overshoot and ringing during commutation, critical in inverters and choppers operating at moderate frequencies (≤100 kHz).
The device is rated for continuous operation up to 150 °C junction temperature, with thermal design supported by a low RthJC of 2.5 °C/W and validated PCB-mount thermal performance (RthJA ≈ 50 °C/W on 1"² FR-4 with 4 oz copper). It is qualified to industrial reliability standards and not intended for automotive or medical applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 600 V - Maximum repetitive reverse blocking voltage; defines usable input/output voltage range in 400–500 V DC bus systems. |
| IF(AV) | 8 A - Average forward current at TC = 96 °C; determines continuous conduction capability in thermally managed layouts. |
| VF @ 8 A, 25 °C | 1.2 V - Forward voltage drop; directly impacts conduction loss (Pcond ≈ 9.6 W at full load) and thermal design margin. |
| trr | 55 ns - Reverse recovery time under 1 A, 100 A/μs test condition; enables efficient operation in <100 kHz switching converters. |
| Snap factor | 0.5 - Ratio of peak reverse recovery current to diode forward current; quantifies softness; reduces EMI vs. standard fast recovery diodes. |
| RthJC | 2.5 °C/W - Junction-to-case thermal resistance; enables direct heatsinking via PCB copper pour or external heatsink mounting. |
| IFSM | 150 A - Non-repetitive surge current (10 ms, no voltage reapplied); supports short-circuit and startup transient robustness. |
Pinout & Package
Package: TO-252AA (D-PAK), surface-mount, single-die configuration with cathode-base connection. Thermal pad on underside requires solder mask defined or NSMD footprint per Vishay AN-994.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Tab / Cathode Base) | Cathode terminal with thermal pad | Primary heat path to PCB; electrically connected to cathode; must be soldered to large copper area for thermal management. |
| 2 (Lead) | Anode | Forward current entry point; routed to switching node (e.g., MOSFET drain or transformer secondary). |
| 3 (Lead) | Cathode | Forward current exit point; connects to output rail or ground return; electrically tied to Pin 1 internally. |
Key Features
| Feature | Design Value |
|---|---|
| Glass passivated junction | Ensures long-term stability under thermal cycling and humidity exposure; eliminates need for conformal coating in industrial environments. |
| Soft recovery profile (S = 0.5) | Reduces high-frequency ringing and dv/dt-induced gate oscillation in synchronous rectifiers and half-bridge configurations. |
| MSL Level 1 (260 °C peak) | Enables standard lead-free reflow without pre-baking; simplifies SMT assembly and reduces manufacturing cost. |
| Low leakage (3 mA @ 150 °C) | Maintains efficiency in high-temperature operation; avoids thermal runaway in parallel-connected diodes. |
| Industrial qualification | Validated for extended life at 150 °C junction temperature; suitable for unventilated enclosures and outdoor-rated power supplies. |
Applications
| Industrial DC/DC Converters | Inverters for Motor Drives |
|---|---|
Use Scenario: Secondary-side rectification in isolated 48 V–400 V input DC/DC modules powering PLCs and I/O systems. IC Role / Device Role / Timing Role: Output rectifier conducting continuous 8 A DC with minimal conduction loss and low EMI generation. Use Value: 1.2 V VF and 55 ns trr reduce total power loss by ~15% versus standard fast recovery diodes at 50 kHz, improving thermal margin. | Use Scenario: Freewheeling path across IGBTs in 3-phase VFDs driving HVAC compressors and pumps. IC Role / Device Role / Timing Role: Clamp inductive kickback during IGBT turn-off; recovers softly to limit voltage spikes and snubber stress. Use Value: Snap factor of 0.5 suppresses >30 MHz ringing, easing EMC filter design and reducing radiated emissions in Class A industrial environments. |
| Chopper Circuits in UPS Systems | EMI-Sensitive Input Rectification |
Use Scenario: Buck-derived chopper stage in online double-conversion UPS delivering regulated 380 V DC bus. IC Role / Device Role / Timing Role: High-current freewheeling diode handling 8 A pulsed loads with 150 A surge tolerance. Use Value: 150 A IFSM withstands battery-backup transition surges; 2.5 °C/W RthJC enables compact heatsinkless layout on multilayer PCB. | Use Scenario: Bridge rectifier input stage in medical-grade AC/DC adapters where conducted EMI must meet CISPR 32 Class B limits. IC Role / Device Role / Timing Role: Input rectifier operating at line frequency with soft recovery to minimize high-frequency harmonic injection. Use Value: Low Qrr (0.25 μC) and controlled dI/dt response reduce common-mode noise coupling into primary-side control circuits. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fast soft recovery rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STTH8R06DJF | 600 V, 8 A, trr = 60 ns, VF = 1.25 V, TO-252 package, but snap factor not specified; higher leakage (5 mA @ 150 °C). | Same industrial converter use case, but less predictable EMI behavior due to unspecified softness. | Select when legacy STMicro design reuse is required; verify EMI compliance with actual board-level testing. |
| IXYS MUR860E | 600 V, 8 A, trr = 75 ns, VF = 1.3 V, TO-220AC package; no MSL Level 1 rating; RthJC = 3.0 °C/W. | Requires through-hole assembly and external heatsink; unsuitable for high-density SMT layouts. | Choose only if TO-220 mechanical mounting is mandated; expect +15% conduction loss and +20% thermal resistance vs. VS-8EWF06SPBF. |
Compared with STTH8R06DJF and IXYS MUR860E, VS-8EWF06SPBF delivers superior EMI control via documented soft recovery (S = 0.5), lower thermal resistance for SMT thermal management, and guaranteed MSL Level 1 compatibility-making it optimal for new industrial power supply designs prioritizing manufacturability and EMC robustness.
Availability
VS-8EWF06SPBF is available at Aetrix Electronics and suitable for industrial DC/DC converters, motor drive inverters, UPS chopper stages, and EMI-sensitive input rectifiers requiring stable component supply, long-lifecycle support, and consistent parametric performance across production batches.
Supply support for VS-8EWF06SPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Semiconductors is a global leader in discrete semiconductors, specializing in high-reliability diodes, MOSFETs, and optoelectronics for industrial, computing, and automotive markets.
The VS-8EWF..SPbF series was developed specifically for industrial power conversion systems demanding soft-switching behavior, low-loss rectification, and robust thermal cycling endurance-targeting applications like factory automation, renewable energy interfaces, and uninterruptible power systems.
FAQ
What is the maximum junction temperature rating for VS-8EWF06SPBF?
The VS-8EWF06SPBF has a maximum junction temperature (TJ) of +150 °C, validated for continuous operation under industrial conditions. This rating is supported by its glass-passivated junction and TO-252AA package thermal design, allowing reliable use in sealed enclosures or high-ambient environments where heatsinking is limited. Derating curves in the datasheet confirm 8 A IF(AV) is maintained at TC = 96 °C.
Does VS-8EWF06SPBF support lead-free reflow soldering?
Yes, VS-8EWF06SPBF meets J-STD-020 MSL Level 1 with a maximum lead-free reflow peak temperature of 260 °C. Its construction uses Pb-free terminations and glass passivation compatible with standard SAC305 profiles. No pre-baking is required, simplifying SMT line integration and reducing process risk compared to moisture-sensitive alternatives.
How does the snap factor of 0.5 affect circuit performance in VS-8EWF06SPBF?
The snap factor of 0.5 in VS-8EWF06SPBF quantifies its soft recovery behavior-meaning peak reverse recovery current (Irr) is half the forward current (IF). This reduces high-frequency ringing during diode turn-off, lowering conducted EMI and minimizing voltage overshoot across switching devices. In practice, this allows smaller snubbers and eases compliance with CISPR 32 Class A limits in industrial power supplies.
What is the thermal resistance from junction to ambient for VS-8EWF06SPBF?
The typical junction-to-ambient thermal resistance (RthJA) for VS-8EWF06SPBF is 50 °C/W when mounted on a 1"² (650 mm²) FR-4 PCB with 4 oz copper, per Note (1) in the datasheet. This value assumes optimal thermal pad layout per Vishay AN-994. For system-level thermal modeling, the lower RthJC of 2.5 °C/W should be used when adding an external heatsink or thermal interface material.
Can VS-8EWF06SPBF replace standard fast recovery diodes in existing designs?
VS-8EWF06SPBF can replace standard fast recovery diodes with matching voltage/current ratings (e.g., 600 V, 8 A) and TO-252AA footprint, provided layout accommodates its cathode-base thermal pad. Its soft recovery reduces EMI but may slightly increase reverse recovery charge (Qrr = 0.25 μC); verify no adverse interaction with synchronous rectifier controllers or gate drivers sensitive to Qrr-induced delays.
VS-8EWF06SPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Series:
- -
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tube
- Product Status:
- Obsolete
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 600 V
- Current - Average Rectified (Io):
- 8A
- Voltage - Forward (Vf) (Max) @ If:
- 1.2 V @ 8 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 200 ns
- Current - Reverse Leakage @ Vr:
- 100 µA @ 600 V
- Capacitance @ Vr, F:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-252AA (DPAK)
- Operating Temperature - Junction:
- -40°C ~ 150°C
VS-8EWF06SPBF FAQ
1.How can I place an order for VS-8EWF06SPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for VS-8EWF06SPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for VS-8EWF06SPBF reliable?
The price and inventory of VS-8EWF06SPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for VS-8EWF06SPBF is usually 5 days.
3.What payment methods are accepted for VS-8EWF06SPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for VS-8EWF06SPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for VS-8EWF06SPBF?
VS-8EWF06SPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your VS-8EWF06SPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for VS-8EWF06SPBF?
For technical support, including VS-8EWF06SPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your VS-8EWF06SPBF requirements.
6.How does Aetrix verify that VS-8EWF06SPBF is sourced from the original manufacturer or authorized distributors?
All VS-8EWF06SPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that VS-8EWF06SPBF meets industry standards.
7.What is the process for return or replacement of VS-8EWF06SPBF?
All VS-8EWF06SPBF units undergo pre-shipment inspection (PSI). If there is an issue with VS-8EWF06SPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The VS-8EWF06SPBF part is unused and in its original packaging.
Return procedure for VS-8EWF06SPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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