Microchip Technology VSC7323VH-03
- Part No.:
- VSC7323VH-03
- Manufacturer:
- Microchip Technology
- Category:
- Specialized
- Package:
- 728-BGA
- Datasheet:
-
VSC7323VH-03.pdf
- Description:
- IC MAC 10PORT GE W/SPI LEBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
VSC7323VH-03 from Vitesse Semiconductor is a 10-port triple-speed Ethernet MAC IC with integrated SerDes and a dedicated 10 GbE MAC with XAUI interface, operating at 2.5V/3.3V IO in industrial temperature range (−40°C to +85°C), supporting RGMII/GMII/MII and SPI-4.2 for enterprise/metro Ethernet switches and SONET/SDH transport terminals.
For engineers reviewing the VSC7323VH-03 datasheet, VSC7323VH-03 pinout, VSC7323VH-03 application, or VSC7323VH-03 equivalent, key selection criteria include IEEE 802.3ae-compliant 10 GbE MAC functionality, OIF SPI-4.2 system interface timing (312.5–450 MHz DDR), per-port FIFO configurability (2 kB increments), XAUI pre-emphasis/equalization support, and dual MIIM management capability.
Technical Context
The VSC7323VH-03 implements ten triple-speed (10/100/1000 Mbps) MACs with RGMII/GMII/MII physical layer interfacing and one full-duplex IEEE 802.3ae-compliant 10 GbE MAC with integrated XAUI SerDes. Its ingress/egress FIFOs are provisionable per port in 2 kB increments and support both cut-through and store-and-forward modes.
It features an OIF-compliant 16-bit SPI-4.2 interface operating at 312.5/390.625 MHz DDR (ingress) and 311–450 MHz DDR (egress), plus a configurable CPU interface-either 16-bit parallel (PowerPC/Intel) or 4-line serial-for initialization and statistics access. Dual MIIM interfaces manage external PHY devices.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| MAC Count | 10 × triple-speed (10/100/1000 Mbps) + 1 × 10 GbE MAC |
| IO Voltage | 2.5V/3.3V compatible-enables interoperability with mixed-voltage system components |
| Temperature Range | Industrial: −40°C to +85°C-supports deployment in uncontrolled metro/core infrastructure environments |
| SPI-4.2 Interface | OIF-compliant 16-bit DDR, 312.5/390.625 MHz ingress, 311–450 MHz egress-matches NPU/ASIC timing requirements |
| XAUI Interface | Quad-lane 3.125 Gbps with programmable transmit pre-emphasis and receive equalization-ensures signal integrity over high-loss backplanes |
| FIFO Configurability | Ingress/egress FIFOs adjustable per port in 2 kB increments-enables fine-grained burst traffic buffering and flow control tuning |
| Management Interfaces | Dual MII Management (MIIM) ports-allows concurrent monitoring and configuration of up to two external PHY devices |
Pinout & Package
Packaged in a 728-pin TBGA (Thin Ball Grid Array) with standard 5-pin IEEE 1149.1 JTAG test port. Pinout validated per Vitesse VSC7323 datasheet Rev. 1.0 (VPPD-00365).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | Reference Clock Input | Accepts 125 MHz clock for GbE MAC timing or 156.25 MHz for 10 GbE/XAUI operation |
| XAUI_TX[3:0] | XAUI Transmit Lanes | LVDS differential outputs driving XENPAK/X2/XPAK modules; supports programmable pre-emphasis |
| XAUI_RX[3:0] | XAUI Receive Lanes | LVDS differential inputs with adaptive equalization for ISI compensation in high-loss channels |
| SPI42_CLK | SPI-4.2 Reference Clock | Drives DDR data capture on 16-bit system interface; frequency determines ingress/egress bandwidth |
| MIIM[1:0]_CLK/MDIO | PHY Management Bus | Dual independent MDIO/MDC pairs for concurrent control of separate PHY device sets |
| JTAG_TCK/TMS/TDI/TDO/TRST | IEEE 1149.1 Test Port | Enables boundary-scan testing, debug access, and firmware programming without CPU intervention |
Key Features
| Feature | Design Value |
|---|---|
| Triple-speed MAC support | RGMII/GMII/MII per port enables flexible PHY selection across 10/100/1000 Mbps rates without redesign |
| Integrated GbE SerDes | Eliminates need for external SerDes chips-reduces BOM count and board area in optical aggregation designs |
| Programmable per-port FIFO | 2 kB granularity allows precise buffer allocation to match traffic profiles (e.g., jumbo frame handling vs. low-latency cut-through) |
| Lossless flow control | Supports Metro-scale deployments up to 10 km via automatic PAUSE frame generation triggered by configurable FIFO watermarks |
| VLAN/MPLS identification | Hardware-accelerated tagging and classification offloads packet processing from host NPU in multi-service provisioning platforms |
| RMON/SMNP statistics | Full RFC2819, RFC1213, RFC1573, RFC1643 compliance enables standards-based network monitoring and diagnostics |
Applications
| Enterprise Switch Aggregation | Metro SONET/SDH Transport |
|---|---|
Use Scenario: High-density 1G/10G uplink module in Layer 3 enterprise core switch connecting to server farms and WAN edge routers. IC Role / Device Role / Timing Role: VSC7323VH-03 acts as the Ethernet MAC aggregation engine-converting SPI-4.2 packet streams from NPU into 10× RGMII links and one XAUI link to optical transceivers. Use Value: Enables 11-port line-rate forwarding with hardware VLAN/MPLS parsing and RMON statistics-reducing software overhead and improving visibility into east-west traffic. | Use Scenario: Frame-mapped Ethernet-over-SONET/SDH terminal using GFP-F encapsulation for carrier-grade metro transport. IC Role / Device Role / Timing Role: VSC7323VH-03 provides GbE MAC termination and packet framing; paired with VSC9118 mapper for VC grooming and GFP encapsulation before SONET/SDH multiplexing. Use Value: Delivers lossless flow control over 10 km fiber spans and supports jumbo frames (up to 9600B)-critical for efficient GFP-F payload packing and low-latency service delivery. |
| Edge Aggregation Router | DWDM Wavelength Router |
Use Scenario: Multi-service edge router aggregating business Ethernet access circuits (E-Line/E-LAN) onto 10G backbone links. IC Role / Device Role / Timing Role: VSC7323VH-03 serves as the packet I/O interface-ingesting 10× GbE client ports and exporting unified traffic via SPI-4.2 to traffic manager ASIC, while managing PHYs via dual MIIM. Use Value: Hardware rate limiting (1 Mbps steps), 802.3ad link aggregation, and per-port shaping/policing enable SLA-compliant service bundling without CPU scheduling latency. | Use Scenario: DWDM terminal performing wavelength-level Ethernet switching and grooming in optical core networks. IC Role / Device Role / Timing Role: VSC7323VH-03 handles 10G MAC framing and XAUI serialization/deserialization for direct connection to tunable XFP modules; SPI-4.2 interfaces to optical switch fabric controller. Use Value: XAUI equalization and pre-emphasis ensure reliable 10 Gbps operation over long-reach optical interconnects with >20 dB channel loss-meeting DWDM system BER requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Ethernet MAC aggregation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Marvell Alaska 88E1545 | Single-port 10GBASE-T PHY with integrated MAC; no SPI-4.2 or XAUI; supports only copper media | Targeted at 10GBASE-T switch ports-not suitable for optical backplane or SONET/SDH mapping use cases | Select only for cost-sensitive copper-only access layer designs requiring no system interface or multi-port aggregation |
| Microsemi (now Microchip) PM5352 | 10G SPI-4.2 to XAUI bridge; lacks integrated MACs, VLAN/MPLS logic, or MIIM interfaces | Used as a protocol converter between NPU and optical modules-requires external MAC logic and PHY management | Choose when existing MAC logic exists and only XAUI bridging is needed; not a functional replacement for VSC7323VH-03's full MAC+SerDes+system interface integration |
Compared with Marvell 88E1545 and Microsemi PM5352, the VSC7323VH-03 uniquely integrates 10× triple-speed MACs, 1× 10G MAC, XAUI SerDes, SPI-4.2 system interface, dual MIIM, and hardware flow control-making it the only single-chip solution for scalable, optical-capable Ethernet aggregation in metro/core infrastructure.
Availability
VSC7323VH-03 is available at Aetrix Electronics and suitable for enterprise switches, metro SONET/SDH transport terminals, and edge aggregation routers requiring stable component supply, long-term lifecycle support, and traceable sourcing for carrier-grade deployments.
Supply support for VSC7323VH-03 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vitesse Semiconductor was a fabless provider of high-performance Ethernet and optical networking ICs, acquired by Microsemi in 2015 and later integrated into Microchip Technology.
The VSC7323 product line targets carrier-class Ethernet aggregation-designed to unify GbE and 10GbE MAC functionality, SerDes, and system interfaces in a single chip for metro/core infrastructure equipment.
FAQ
What is the primary function of the VSC7323VH-03 in network equipment?
The VSC7323VH-03 functions as a multi-port Ethernet MAC aggregation IC, integrating ten triple-speed (10/100/1000 Mbps) MACs with RGMII/GMII/MII support and one IEEE 802.3ae-compliant 10 GbE MAC with XAUI SerDes. It bridges between PHY devices and system-side processors via SPI-4.2 and CPU interfaces-enabling line-rate packet handling in enterprise switches and metro transport platforms. The VSC7323VH-03 performs hardware-based VLAN/MPLS identification, flow control, and statistics collection without host CPU involvement.
Does the VSC7323VH-03 support jumbo frames, and what is the maximum size?
Yes, the VSC7323VH-03 supports jumbo frames up to 9600 bytes, as confirmed in the official product brief. This capability is essential for efficient GFP-F encapsulation in Ethernet-over-SONET/SDH applications and reduces per-packet processing overhead in high-throughput data center and metro aggregation scenarios. Frame size is configurable per port via register settings, and the VSC7323VH-03 maintains full line-rate performance at maximum frame size under specified traffic conditions.
What type of system interface does the VSC7323VH-03 use, and what are its timing specifications?
The VSC7323VH-03 uses an OIF-compliant 16-bit SPI-4.2 interface. Its ingress path operates at 312.5 MHz or 390.625 MHz DDR, while the egress path supports variable DDR frequencies from 311 MHz to 450 MHz-allowing flexible bandwidth matching with different network processors or ASICs. The interface includes source-synchronous clocking and built-in elastic buffers to absorb timing skew, ensuring robust packet transfer in high-speed backplane environments. This specification is documented in the VSC7323VH-03 product brief and block diagram.
Can the VSC7323VH-03 operate with both 2.5V and 3.3V I/O voltages?
Yes, the VSC7323VH-03 is implemented in low-power 0.18 µm CMOS technology and explicitly supports both 2.5V and 3.3V I/O voltage levels, as stated in the product brief. This dual-voltage compatibility simplifies integration with mixed-voltage system designs-such as those combining legacy 3.3V PHYs and newer 2.5V NPUs-without requiring level-shifting circuitry. The VSC7323VH-03's I/O banks are configured at power-up based on external voltage references, and all timing parameters are guaranteed across the full industrial temperature range (−40°C to +85°C).
How does the VSC7323VH-03 handle flow control in metro applications?
The VSC7323VH-03 implements lossless flow control for metro deployments up to 10 km by generating IEEE 802.3x PAUSE frames automatically when per-port ingress FIFO occupancy exceeds programmable watermark thresholds. This hardware-based mechanism avoids packet drops during traffic bursts and ensures deterministic latency-critical for carrier-grade SLA enforcement. The VSC7323VH-03 also supports 802.3ad link aggregation and rate limiting in 1 Mbps increments, enabling granular QoS policy enforcement across aggregated links without CPU scheduling.
VSC7323VH-03 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 728-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Applications:
- Ethernet
- Interface:
- MII, Parallel, Serial, SPI
- Voltage - Supply:
- -
- Supplier Device Package:
- 728-TBGA (42.5x42.5)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
VSC7323VH-03 FAQ
1.How can I place an order for VSC7323VH-03 through Aetrix?
Please submit a Request for Quotation (RFQ) for VSC7323VH-03 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for VSC7323VH-03 reliable?
The price and inventory of VSC7323VH-03 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for VSC7323VH-03 is usually 5 days.
3.What payment methods are accepted for VSC7323VH-03?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for VSC7323VH-03 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for VSC7323VH-03?
VSC7323VH-03 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your VSC7323VH-03 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for VSC7323VH-03?
For technical support, including VSC7323VH-03 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your VSC7323VH-03 requirements.
6.How does Aetrix verify that VSC7323VH-03 is sourced from the original manufacturer or authorized distributors?
All VSC7323VH-03 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that VSC7323VH-03 meets industry standards.
7.What is the process for return or replacement of VSC7323VH-03?
All VSC7323VH-03 units undergo pre-shipment inspection (PSI). If there is an issue with VSC7323VH-03, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The VSC7323VH-03 part is unused and in its original packaging.
Return procedure for VSC7323VH-03:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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