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Microchip Technology VSC7454YIH-02
- Part No.:
- VSC7454YIH-02
- Manufacturer:
- Microchip Technology
- Category:
- Telecom
- Package:
- -
- Datasheet:
-
VSC7454YIH-02.pdf
- Description:
- IC TELECOM INTERFACE
- Quantity:
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- Shipping:
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Product details
Overview
VSC7454YIH-02 from Microsemi is a 44 Gbps managed Layer 2/Layer 3 stackable Ethernet switch IC supporting up to 26 × 1G, 16 × 2.5G, or 2 × 10G ports with SFI/XAUI/RXAUI interfaces; features integrated 500 MHz MIPS 24KEc CPU, DDR3/DDR3L memory controller, and VCAP-II TCAM-based classification for enterprise switching in rack-mounted networking equipment.
For engineers reviewing the VSC7454YIH-02 datasheet, VSC7454YIH-02 pinout, VSC7454YIH-02 application, or VSC7454YIH-02 equivalent, key selection criteria include stacking protocol support (VStaX™), L2/L3 forwarding capability, 10G port configurability as uplinks or stacking links, thermal rating (0°C to 110°C), and FCBGA-576 package compatibility.
Technical Context
The VSC7454YIH-02 implements multistage Versatile TCAM (VCAP-II) for hardware-accelerated VLAN, ACL, QoS, and frame editing - enabling per-port policing, three-tag VLAN translation, and egress remarking. It supports independent and shared VLAN learning (IVL/SVL) with 32K MAC address table capacity and 4K VLAN ID support.
Its integrated 500 MHz MIPS 24KEc CPU with MMU and DDR3/DDR3L SDRAM controller enables full L2/L3 management stack execution; PCIe 1.x interface provides host CPU offload, while QSGMII, SGMII, and 2.5G SGMII SerDes support flexible PHY interfacing without external retimers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Switch Throughput | 44 Gbps total non-blocking switching capacity - supports full line-rate forwarding across all port combinations including mixed 1G/2.5G/10G configurations. |
| Port Configuration | Up to 26 × 1G SGMII, 16 × 2.5G SGMII, or 24 × 1G + 2 × 10G SFI/XAUI/RXAUI - 10G ports configurable as stacking or uplink links. |
| CPU Core | Integrated 500 MHz MIPS 24KEc with MMU - runs full L2/L3 management software stack and supports real-time control plane processing. |
| Memory Interface | DDR3/DDR3L SDRAM controller - enables local high-bandwidth packet buffering and control-plane data storage without external memory bottleneck. |
| TCAM Engine | VCAP-II multistage TCAM - delivers hardware-based classification, ACL enforcement, QoS marking, and VLAN tag manipulation at wire speed. |
| Operating Temperature | 0°C to 110°C junction temperature - qualified for industrial and carrier-grade chassis environments with forced-air cooling. |
| Package | 27 mm × 27 mm FCBGA-576 - requires controlled impedance PCB layout with thermal vias under die for thermal dissipation compliance. |
Pinout & Package
Package: 27 mm × 27 mm Fine-Pitch Chip Array Ball Grid Array (FCBGA) with 576 I/O balls, RoHS-compliant, lead-free, moisture sensitivity level (MSL) 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core power supply | 1.0V ±3% supply for logic core and TCAM - requires low-noise regulation and local decoupling. |
| VDD_IO | I/O power supply | 1.8V or 2.5V selectable supply for SerDes and GPIO banks - supports mixed-voltage interface design. |
| CLK_IN | Reference clock input | 25 MHz or 125 MHz differential clock input for system timing and SerDes PLL lock - critical for jitter-sensitive 10G operation. |
| MDIO/MDC | PHY management interface | IEEE 802.3 clause 22/45 compliant bus for configuring external PHYs - enables centralized PHY control from switch CPU. |
| PCIe_RST_N | PCIe reset signal | Active-low reset for PCIe interface - synchronizes link initialization with host system boot sequence. |
| GPIO[7:0] | General-purpose I/O | Configurable as interrupt sources, status indicators, or board-level control signals - supports hot-swap and fan monitoring functions. |
Key Features
| Feature | Design Value |
|---|---|
| VStaX™ stacking protocol | Hardware-accelerated ring/chain stacking of up to 16 switches with shortest-path forwarding and consistent QoS across stack members. |
| VCAP-II TCAM architecture | Enables concurrent 32K MAC lookup, 4K VLAN ID assignment, and multi-field packet classification without software intervention. |
| Integrated DDR3/DDR3L controller | Eliminates need for external memory controller IC - reduces BOM count and simplifies PCB routing for control-plane memory access. |
| 2.5G SGMII SerDes lanes | Supports IEEE 802.3bz 2.5GBASE-T PHY interfacing - extends reach beyond 1G without requiring 10G infrastructure cost. |
| Hardware multicast replication | Performs Layer 2 and IPv4/IPv6 multicast replication in silicon - avoids CPU overhead and ensures deterministic latency for IPTV and surveillance traffic. |
Applications
| Enterprise Stackable Switch | Data Center Top-of-Rack |
|---|---|
Use Scenario: 24-port Gigabit access switch stacked with up to 15 peers in campus wiring closet to aggregate endpoint traffic. IC Role / Device Role / Timing Role: Primary L2/L3 switching fabric with VStaX™ stacking control and hardware-based QoS scheduling. Use Value: Delivers deterministic latency and bandwidth allocation across stack using shared queue system and DWRR scheduler - essential for VoIP and video conferencing QoS. | Use Scenario: 16 × 2.5G + 2 × 10G top-of-rack switch connecting servers with multi-gigabit NICs in cloud infrastructure. IC Role / Device Role / Timing Role: High-density L2 forwarding engine with hardware multicast replication and IGMP/MLD snooping. Use Value: Enables lossless 2.5G server connectivity and efficient IPv4/IPv6 multicast distribution without CPU load - improves VM migration and container orchestration performance. |
| Industrial Control Network | Managed Campus Aggregation |
Use Scenario: Ruggedized 26-port switch deployed in factory automation cabinet operating at 110°C ambient with forced-air cooling. IC Role / Device Role / Timing Role: Industrial-grade L2/L3 switch with extended temperature support and hardware RSTP/MSTP failover. Use Value: Maintains network resiliency during PLC communication bursts via storm control and hardware-accelerated spanning tree convergence - meets IEC 61850-3 timing requirements. | Use Scenario: 24 × 1G + 2 × 10G aggregation switch linking multiple wiring closets to core router in university campus backbone. IC Role / Device Role / Timing Role: L3 routing node with static and dynamic (OSPF) routing, ACL enforcement, and SyncE timing recovery. Use Value: Provides precise time synchronization (SyncE) and hardware-based ACL filtering at 10G uplink - satisfies IEEE 1588 boundary clock and security policy enforcement needs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar managed L2/L3 Ethernet switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Marvell 88E6393X | Lower throughput (32 Gbps), no integrated DDR3 controller, uses external ARM Cortex-A9 CPU; supports only 1G/10G, no 2.5G SGMII. | Limited to 1G/10G-only deployments; lacks native 2.5G support for emerging multi-gigabit endpoints. | Choose when legacy 1G/10G infrastructure dominates and external CPU architecture is already standardized. |
| Broadcom BCM56270 | Higher throughput (128 Gbps), supports 40G/100G, but requires external PHYs and DDR controller; no integrated MIPS CPU. | Targeted at high-end data center spine/leaf - over-specified for edge switching with higher power and cost. | Choose only for future-proof 40G-capable designs where scalability outweighs BOM and thermal constraints. |
Compared with Marvell 88E6393X and Broadcom BCM56270, the VSC7454YIH-02 uniquely balances integrated compute (MIPS+DDR3), 2.5G support, and industrial temperature range - making it optimal for cost-sensitive, thermally constrained, and multi-gigabit-ready edge switching.
Availability
VSC7454YIH-02 is available at Aetrix Electronics and suitable for enterprise stackable switches, industrial control networks, and managed campus aggregation systems requiring stable component supply, long-term lifecycle assurance, and qualified industrial temperature operation.
Supply support for VSC7454YIH-02 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microsemi Corporation (now part of Microchip Technology) designs high-reliability semiconductor solutions for communications, defense, aerospace, and industrial markets, with expertise in timing, power management, and Ethernet infrastructure ICs.
The VSC7454YIH-02 belongs to the E-StaX-IV™ family of managed Ethernet switches, engineered specifically for stackable enterprise and industrial edge switching with integrated CPU, memory controller, and hardware-accelerated L2/L3 features.
FAQ
What is the maximum number of switches that can be stacked using VSC7454YIH-02?
The VSC7454YIH-02 supports stacking up to 16 switches using the hardware-accelerated VStaX™ protocol in ring or chain topology. This enables scalable bandwidth aggregation and redundancy without requiring external stacking controllers. Each VSC7454YIH-02 contributes two 10 Gbps links for stacking, delivering up to 20 Gbps bidirectional inter-switch bandwidth per unit.
Does VSC7454YIH-02 support 2.5GBASE-T Ethernet directly?
The VSC7454YIH-02 does not integrate 2.5GBASE-T PHY circuitry but provides 2.5G SGMII SerDes lanes compatible with external IEEE 802.3bz-compliant PHYs such as the VSC8522. These lanes enable direct connection to 2.5GBASE-T copper transceivers, allowing full 2.5G operation over Cat5e/Cat6 cabling when paired with appropriate PHY devices.
What memory types are supported by the integrated controller in VSC7454YIH-02?
The VSC7454YIH-02 integrates a DDR3/DDR3L SDRAM controller supporting 16-bit or 32-bit wide memory interfaces with speeds up to 800 MT/s. It is designed to interface with standard JEDEC-compliant DDR3 or DDR3L modules, enabling local control-plane memory storage and packet buffer extension without external memory controller ICs.
Is VSC7454YIH-02 pin-compatible with other devices in the E-StaX-IV™ family?
The VSC7454YIH-02 is not pin-compatible with earlier E-StaX-III or SparX-IV devices due to differences in SerDes lane count, power domain partitioning, and ball map layout. Its FCBGA-576 footprint is unique to the E-StaX-IV-44™ generation and requires dedicated PCB layout - no mechanical or electrical drop-in replacement exists within Microsemi's portfolio.
What software development tools are available for VSC7454YIH-02?
Microsemi provides the Unified API software development kit (SDK) for VSC7454YIH-02, including WebStaX™ web management framework and SMBStaX™ CLI tools. The SDK supports integration with third-party NMS platforms and includes drivers, sample applications, and documentation for L2/L3 feature enablement, VStaX™ stack configuration, and TCAM rule programming.
VSC7454YIH-02 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Function:
- Ethernet Switch
- Interface:
- PCI
- Number of Circuits:
- 26
- Voltage - Supply:
- -
- Current - Supply:
- -
- Power (Watts):
- -
- Operating Temperature:
- 0°C ~ 110°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
VSC7454YIH-02 FAQ
1.How can I place an order for VSC7454YIH-02 through Aetrix?
Please submit a Request for Quotation (RFQ) for VSC7454YIH-02 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for VSC7454YIH-02 reliable?
The price and inventory of VSC7454YIH-02 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for VSC7454YIH-02 is usually 5 days.
3.What payment methods are accepted for VSC7454YIH-02?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for VSC7454YIH-02 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for VSC7454YIH-02?
VSC7454YIH-02 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your VSC7454YIH-02 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for VSC7454YIH-02?
For technical support, including VSC7454YIH-02 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your VSC7454YIH-02 requirements.
6.How does Aetrix verify that VSC7454YIH-02 is sourced from the original manufacturer or authorized distributors?
All VSC7454YIH-02 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that VSC7454YIH-02 meets industry standards.
7.What is the process for return or replacement of VSC7454YIH-02?
All VSC7454YIH-02 units undergo pre-shipment inspection (PSI). If there is an issue with VSC7454YIH-02, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The VSC7454YIH-02 part is unused and in its original packaging.
Return procedure for VSC7454YIH-02:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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