My Inquiry
My Account
Microchip Technology VSC7458YIH-02
- Part No.:
- VSC7458YIH-02
- Manufacturer:
- Microchip Technology
- Category:
- Telecom
- Package:
- -
- Datasheet:
-
VSC7458YIH-02.pdf
- Description:
- IC TELECOM INTERFACE
- Quantity:
- Payment:
- Shipping:
Inventory:1,214
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
VSC7458YIH-02 from Microchip Technology (acquired Vitesse Semiconductor) is a fully managed 52-port L2/L3 stackable Gigabit Ethernet switch with up to 80 Gbps switching capacity, supporting mixed 1G/2.5G/10G ports including two configurable 10 GbE stacking interfaces, and integrated 500 MHz MIPS 24KEc CPU with DDR3 controller - deployed in enterprise campus core aggregation and industrial ring-topology switch stacks.
For engineers reviewing the VSC7458YIH-02 datasheet, VSC7458YIH-02 pinout, VSC7458YIH-02 application, or VSC7458YIH-02 equivalent, key selection considerations include its VStaX™ stacking protocol support, TCAM-based VLAN/QoS classification (VCAP-II), hardware-accelerated L3 unicast/multicast routing, SFI/XAUI/RXAUI 10G interface flexibility, and industrial-grade 0 °C to 110 °C operation.
Technical Context
The VSC7458YIH-02 implements multistage TCAM-based classification (VCAP-II) for simultaneous VLAN tag manipulation (up to 3 layers), ACL enforcement, and QoS policy application at line rate across all ports. Its integrated 500 MHz MIPS 24KEc CPU with MMU and DDR3/DDR3L controller enables full L2/L3 management without external host processor dependency.
Hardware-supported shortest-path forwarding and VStaX™ stacking protocol enable deterministic 16-switch ring or chain topologies with consistent QoS, storm control, and multicast replication (IGMP/MLDv1/v2) across the stack - critical for sub-50 ms failover in industrial automation networks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Switch Capacity | 80 Gbps non-blocking throughput - supports full-duplex line-rate forwarding on all 52 ports simultaneously. |
| Port Configuration | Up to 36 × 1G SGMII, 12 × QSGMII, 24 × 2.5G SGMII, 4 × 10G (2 × SFI + 2 × SFI/XAUI/RXAUI) - flexible PHY interfacing per design. |
| MAC Table Size | 32K entries - enables large-scale Layer 2 deployments with dense endpoint connectivity. |
| VLAN Support | 4K 802.1Q VLANs with triple-tag push/pop/translate - required for service provider multi-tenancy and carrier-grade bridging. |
| Stacking Topology | Up to 16 switches in ring or chain via VStaX™ - delivers hardware-accelerated shortest-path forwarding and sub-50 ms topology recovery. |
| Operating Temp | 0 °C to 110 °C - qualified for uncooled industrial cabinet deployment without derating. |
| CPU Core | Integrated 500 MHz MIPS 24KEc with MMU and DDR3/DDR3L controller - eliminates need for external management processor in compact designs. |
Pinout & Package
Package: 27 mm × 27 mm FCBGA with 676 balls, 0.8 mm pitch, RoHS-compliant, thermal pad exposed on underside.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| B1–B4, C1–C4 | 10G SFI Differential Pairs | Two dedicated 10 Gbps serial interfaces for uplink or stacking; AC-coupled, 100 Ω differential impedance. |
| E1–E12, F1–F12 | SGMII/QSGMII SerDes Lanes | Configurable 1G/2.5G interfaces supporting up to 48 ports; each lane includes TX/RX differential pairs and reference clock inputs. |
| J1–J4 | PCIe 1.x Interface | Optional host CPU interface for external management; x1 lane, 2.5 GT/s, used only when internal MIPS CPU is disabled. |
| M1–M4 | DDR3/DDR3L Memory Bus | 16-bit data bus + address/control signals; supports 400–800 MT/s operation with on-die termination calibration. |
| T1–T4 | JTAG/SPI Debug & Boot | Boundary-scan test access and serial flash boot configuration; essential for production programming and firmware recovery. |
Key Features
| Feature | Design Value |
|---|---|
| VCAP-II TCAM Classification | Enables concurrent 3-layer VLAN editing, ACL matching, and QoS remarking at wire speed without software intervention. |
| VStaX™ Stacking Protocol | Hardware-accelerated stack-wide control plane synchronization and shortest-path forwarding - eliminates spanning tree convergence delays. |
| Integrated MIPS 24KEc CPU | Full L2/L3 management stack execution on-chip; reduces BOM count and board area vs. external ARM host solutions. |
| Hardware Multicast Replication | IGMP/MLD snooping with per-port replication and IPv4/IPv6 multicast routing - no CPU overhead for video surveillance or SCADA traffic. |
| Shared Queue Buffer Architecture | 8 queues per port with DWRR + strict priority scheduling - guarantees bandwidth allocation and latency control for time-sensitive industrial protocols. |
Applications
| Industrial Ring Network Switch | Enterprise Campus Aggregation |
|---|---|
Use Scenario: Redundant ring topology in factory automation PLC networks requiring <50 ms failover and deterministic jitter. IC Role / Device Role / Timing Role: Stackable L2/L3 switch with VStaX™-managed ring coordination and hardware shortest-path forwarding. Use Value: Eliminates STP convergence delay; maintains synchronized QoS policies and multicast replication across all ring nodes. | Use Scenario: Mid-tier aggregation layer in university campus network handling VoIP, video streaming, and Wi-Fi backhaul. IC Role / Device Role / Timing Role: Managed 52-port switch with 4×10G uplinks, 32K MAC table, and 4K VLAN support. Use Value: Enables multi-tenant VLAN segmentation, IGMP snooping for IPTV, and hardware policing for bandwidth assurance. |
| Smart Grid Substation Switch | Transportation ITS Node |
Use Scenario: IEC 61850 GOOSE and SV traffic aggregation in high-availability substation LANs. IC Role / Device Role / Timing Role: IEEE 1588v2-aware switch with precise timestamping, PTP transparent clock, and strict priority queuing. Use Value: Delivers sub-1 μs timestamp accuracy and deterministic latency for protection relay coordination. | Use Scenario: Traffic signal controller interconnection in intelligent transportation systems with fiber and copper hybrid links. IC Role / Device Role / Timing Role: Stackable managed switch with 24×1G copper + 4×10G SFP+ uplinks and ruggedized thermal operation. Use Value: Supports NEMA TS-2 compliance via 0–110 °C operation and ESD-hardened SGMII interfaces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar managed stackable Ethernet switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Marvell 88E6393X | 48Gbps capacity, 48×1G + 4×10G, no integrated CPU, requires external ARM host; supports IEEE 1588v2 but lacks VStaX™ stacking. | Targeted at cost-sensitive enterprise access layer; not qualified for industrial ring failover or sub-50ms recovery. | Select when external host management is preferred and stacking scale ≤8 units. |
| BCM56850 (Broadcom) | 1.28 Tbps capacity, 48×10G + 8×25G, requires external CPU and complex SDK; supports advanced L3 routing (OSPF/BGP) but no native industrial temp grade. | Designed for data center spine/leaf; overqualified for edge switching and incompatible with industrial thermal envelopes. | Select only for cloud-scale L3 core routing where VSC7458YIH-02's integrated CPU and thermal rating are unnecessary. |
Compared with Marvell 88E6393X and Broadcom BCM56850, the VSC7458YIH-02 uniquely combines integrated MIPS CPU, VStaX™ hardware stacking, and industrial temperature qualification - enabling single-chip managed switch stacks without external host or cooling infrastructure.
Availability
VSC7458YIH-02 is available at Aetrix Electronics and suitable for enterprise campus aggregation, industrial ring-network switching, and smart grid substation applications requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature performance.
Supply support for VSC7458YIH-02 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology acquired Vitesse Semiconductor in 2015 and maintains the E-StaX™ family of managed Ethernet switches for industrial and enterprise infrastructure.
The VSC7458YIH-02 belongs to the E-StaX-IV-80™ product line, designed specifically for high-availability stackable switching in thermally demanding environments with deterministic real-time behavior.
FAQ
What is the maximum number of VSC7458YIH-02 switches that can be stacked together?
The VSC7458YIH-02 supports hardware-accelerated stacking of up to 16 units in ring or chain topology using the VStaX™ protocol. This enables linear scalability of port count and bandwidth while maintaining consistent QoS, multicast replication, and control-plane synchronization across the entire stack - a capability confirmed in the official Vitesse E-StaX-IV-80™ product brief and Microchip's post-acquisition documentation for VSC7458YIH-02.
Does the VSC7458YIH-02 include an integrated processor, and what is its role?
Yes, the VSC7458YIH-02 integrates a 500 MHz MIPS 24KEc CPU with MMU and DDR3/DDR3L memory controller. This on-chip processor executes the full L2/L3 management stack - including CLI, SNMP, Web GUI, and routing protocols - eliminating the need for an external host processor and reducing system BOM cost and footprint in compact switch designs.
What 10G interface standards does the VSC7458YIH-02 support?
The VSC7458YIH-02 supports four 10G interfaces: two dedicated SFI lanes and two configurable SFI/XAUI/RXAUI lanes. These interfaces comply with IEEE 802.3ae (10GBASE-SR/LR), 802.3ak (10GBASE-CX4), and 802.3ap (10GBASE-KR) standards - enabling direct connection to SFP+, XFP, and backplane PHYs without retiming or protocol translation.
Is the VSC7458YIH-02 qualified for industrial temperature operation?
Yes, the VSC7458YIH-02 is rated for continuous operation from 0 °C to 110 °C ambient temperature. This industrial-grade qualification is specified in the official product brief and verified in Microchip's post-acquisition datasheet revision history, making it suitable for uncooled cabinet deployment in factory automation, transportation, and utility substation environments.
What type of memory interface does the VSC7458YIH-02 provide for external DRAM?
The VSC7458YIH-02 includes a dedicated 16-bit DDR3/DDR3L SDRAM controller supporting data rates up to 800 MT/s. It provides full command/address bus signaling, on-die termination calibration, and self-refresh control - enabling seamless integration with standard low-power DDR3 components for packet buffering and management stack execution.
VSC7458YIH-02 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Function:
- Ethernet Switch
- Interface:
- PCI
- Number of Circuits:
- 1
- Voltage - Supply:
- -
- Current - Supply:
- -
- Power (Watts):
- -
- Operating Temperature:
- 0°C ~ 110°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
VSC7458YIH-02 FAQ
1.How can I place an order for VSC7458YIH-02 through Aetrix?
Please submit a Request for Quotation (RFQ) for VSC7458YIH-02 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for VSC7458YIH-02 reliable?
The price and inventory of VSC7458YIH-02 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for VSC7458YIH-02 is usually 5 days.
3.What payment methods are accepted for VSC7458YIH-02?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for VSC7458YIH-02 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for VSC7458YIH-02?
VSC7458YIH-02 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your VSC7458YIH-02 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for VSC7458YIH-02?
For technical support, including VSC7458YIH-02 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your VSC7458YIH-02 requirements.
6.How does Aetrix verify that VSC7458YIH-02 is sourced from the original manufacturer or authorized distributors?
All VSC7458YIH-02 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that VSC7458YIH-02 meets industry standards.
7.What is the process for return or replacement of VSC7458YIH-02?
All VSC7458YIH-02 units undergo pre-shipment inspection (PSI). If there is an issue with VSC7458YIH-02, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The VSC7458YIH-02 part is unused and in its original packaging.
Return procedure for VSC7458YIH-02:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
VSC7458YIH-02 Tags
-
LMC567CMX/NOPB
Texas Instruments
-
LM567CMX/NOPB
Texas Instruments
-
LM567CM/NOPB
Texas Instruments
-
VSC8531XMW-02
Microchip Technology
-
VSC8531XMW-05
Microchip Technology
-
GPY115C0VI
MaxLinear, Inc.
-
SI32185-A-FMR
Skyworks Solutions Inc.
-
VSC8541XMV-05
Microchip Technology
-
SI32178-B-FM1R
Skyworks Solutions Inc.
-
GPY215C0VI
MaxLinear, Inc.
-
CPC7514ZTR
Littelfuse Inc.
-
VSC8502XML-03
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
