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Microchip Technology VSC9135YHM-01
- Part No.:
- VSC9135YHM-01
- Manufacturer:
- Microchip Technology
- Category:
- Specialized
- Package:
- 1760-BGA, FCBGA
- Datasheet:
-
VSC9135YHM-01.pdf
- Description:
- IC MAPPER OC-48 HFC BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,037
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Product details
Overview
VSC9135YHM-01 from Vitesse Semiconductor is a 2.5 Gbps multi-service virtual concatenation mapper IC for SONET/SDH metro Ethernet systems, supporting 128 VCGs across STS-1/VC-3, VT1.5/VT2.0, and TU-12/TU-11 granularities, SPI-3 and SPI-4.2 interfaces, and dual-rate STS-12/STM-4 backplane connectivity in a 1760-pin HFCBGA package.
For engineers reviewing the VSC9135YHM-01 datasheet, VSC9135YHM-01 pinout, VSC9135YHM-01 application, or VSC9135YHM-01 equivalent, key selection considerations include LOVCAT48 bandwidth class, GFP encapsulation capability, LCAS compliance, TFI-5-compatible backplane interface, and compatibility with Campbell-I and Meigs-IIe WAN MACs in RPR and MSPP architectures.
Technical Context
The VSC9135YHM-01 implements third-generation virtual concatenation mapping with concurrent support for high-order (STS-1/VC-3, STS-3C/VC-4) and low-order (VT1.5/VT2.0, TU-12/TU-11) tributaries, enabling flexible service provisioning across legacy TDM and packet infrastructures. It integrates full LCAS application code compliant with ITU-T G.7042 and supports hitless bandwidth adjustment without service interruption.
It features OIF-compliant SPI-3 (32-bit) and SPI-4.2 (16-bit) system packet interfaces for connection to NPUs or FPGAs, and a 72-bit DDR SDRAM interface for frame buffering. The device operates at 2.5 Gbps line rate (LOVCAT48 class) and delivers 7W typical power dissipation under full load.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Bandwidth Class | LOVCAT48: 2.5 Gbps line rate for metro Ethernet transport over SONET/SDH |
| Virtual Concatenation Groups | 128 independent VCGs supporting mixed HO/LO granularity (STS-1/VC-3, VT1.5/VT2.0, etc.) |
| System Packet Interface | SPI-3 (32-bit) and SPI-4.2 (16-bit) for NPU/FPGA interconnect with deterministic latency |
| Backplane Interface | Dual-rate STS-12/STM-4 working + protection, TFI-5 compliant, no external retimer required |
| Memory Interface | 72-bit DDR SDRAM interface for real-time GFP frame buffering and reassembly |
| Power Dissipation | 7W typical at full 2.5 Gbps operation, enabling thermal management in dense linecards |
| GFP Support | Full Generic Framing Protocol encapsulation for Ethernet, storage, and video payloads over WAN |
Pinout & Package
Package: 1760-ball High-Flexibility Ceramic Ball Grid Array (HFCBGA), 35 mm × 35 mm, 1.0 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SPI4_CLK, SPI4_DATx | SPI-4.2 interface clock and data lanes | 16-bit source-synchronous interface to 10G-capable NPUs or FPGAs with 250 MHz DDR timing |
| SPI3_CLK, SPI3_DATx | SPI-3 interface clock and data lanes | 32-bit source-synchronous interface to 2.5G–10G NPUs with 125 MHz DDR timing |
| TFI5_TXP/N, TFI5_RXP/N | TFI-5 differential backplane transceivers | Direct STS-12/STM-4 line-rate connection to SONET/SDH backplane without external PHY |
| DDR_CLK, DDR_DQx | DDR SDRAM clock and data bus | 72-bit wide interface supporting up to 200 MHz DDR for 1.4 GB/s sustained memory bandwidth |
| GFP_CTRL[3:0] | GFP framing control signals | Configures GFP-F or GFP-T mode, payload type ID, and core header insertion behavior |
| LCAS_EN, LCAS_SIG | Hitless LCAS control and signaling pins | Enables standards-compliant dynamic bandwidth adjustment per ITU-T G.7042 with zero packet loss |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent HO/LO VC mapping | Single-device termination of heterogeneous services (e.g., DS1, E1, 10/100/1000BASE-T) within same VCG structure |
| Standards-compliant LCAS | Embedded LCAS state machine and signaling logic meeting ITU-T G.7042, eliminating need for external firmware control |
| GFP encapsulation engine | Hardware-accelerated GFP-F/T framing with CRC-16/CRC-32 generation, reducing CPU overhead in NPU-based systems |
| Pin-compatible migration path | Drop-in replacement for prior HOVCAT devices, preserving PCB layout and software driver stack across product generations |
| Integrated diagnostics | Built-in loopback modes, BER monitoring, and VCG-level performance counters accessible via JTAG or SPI |
Applications
| SONET/SDH Multi-Service Provisioning Platforms (MSPPs) | Next-Gen Metro Ethernet Systems |
|---|---|
Use Scenario: Aggregating diverse client services (T1/E1, Ethernet, Fibre Channel) onto OC-48/STM-16 transport links in carrier central offices. IC Role / Device Role / Timing Role: Virtual concatenation mapper performing GFP encapsulation, VCG formation, and LCAS-aware bandwidth adaptation. Use Value: Enables 128 concurrent VCGs per device, increasing port density and reducing linecard count in MSPP chassis. | Use Scenario: Delivering business Ethernet services (E-LAN, E-Line) over existing SONET/SDH infrastructure with sub-50ms failover. IC Role / Device Role / Timing Role: Low-order VC mapper bridging SPI-3-connected NPUs to TFI-5 backplane, handling VT1.5/VT2.0 grooming. Use Value: Eliminates external retimers and reduces latency by 15 ns vs. discrete PHY+mapper solutions. |
| Resilient Packet Ring (RPR) Edge Nodes | Legacy TDM-to-Packet Migration Gateways |
Use Scenario: Integrating RPR MAC (e.g., Vitesse Barrington) with SONET backplane in metro aggregation nodes. IC Role / Device Role / Timing Role: Mapper providing GFP-framed RPR traffic encapsulation and STS-12-aligned backplane transmission. Use Value: Supports concurrent RPR and legacy TDM traffic on shared backplane, simplifying network upgrade paths. | Use Scenario: Converting DS3/E3 and OC-3 signals to packetized Ethernet for IP/MPLS core networks. IC Role / Device Role / Timing Role: HOVCAT/LOVCAT hybrid mapper performing STS-3C/VC-4 and VT1.5 mapping with GFP-F encapsulation. Use Value: Maintains full SONET alarm transparency (LOS, LOF, AIS) while enabling packet-based OAM and performance monitoring. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar virtual concatenation mapper applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| VSC9138YHM-01 | 10 Gbps LOVCAT192 class; supports 192 VCGs; higher power (9W); identical pinout and software API | Required for OC-192/STM-64 line rates and >128 VCG density; not suitable for 2.5G-only designs | Select VSC9138YHM-01 only when 10G backplane or >128 VCG capacity is mandatory |
| PMC-Sierra PM5352 | Single-chip SONET/SDH framer + mapper; lacks native SPI-4.2; requires external SDRAM controller | Targeted at framer-centric designs with integrated HDLC processing; less flexible for pure packet-mapping use cases | Choose PM5352 when SONET section/line/framing functions are needed alongside mapping |
Compared with VSC9135YHM-01, VSC9138YHM-01 offers higher bandwidth and VCG count but increases thermal load and cost, while PM5352 integrates framer logic at the expense of SPI-4.2 support and external memory flexibility-making VSC9135YHM-01 optimal for 2.5G metro packet mappers requiring SPI-4.2 and scalable GFP offload.
Availability
VSC9135YHM-01 is available at Aetrix Electronics and suitable for SONET/SDH MSPPs, Metro Ethernet systems, Resilient Packet Ring edge nodes, and TDM-to-packet migration gateways requiring stable component supply and long-term lifecycle support.
Supply support for VSC9135YHM-01 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vitesse Semiconductor was a fabless ASIC and communications IC provider specializing in high-speed packet and TDM transport silicon before its acquisition by Microsemi in 2015.
The VersaCAT family-including VSC9135YHM-01-was designed specifically for multi-service provisioning in carrier-grade metro networks, enabling efficient Ethernet-over-SONET/SDH with hitless LCAS and GFP.
FAQ
What is the maximum number of virtual concatenation groups supported by VSC9135YHM-01?
VSC9135YHM-01 supports up to 128 independent virtual concatenation groups (VCGs), covering STS-1/VC-3, STS-3C/VC-4, VT1.5/VT2.0, and TU-12/TU-11 granularities. This enables dense service termination in multi-service platforms without requiring multiple mappers. Each VCG operates with full LCAS compliance and GFP encapsulation, as confirmed in the Vitesse VPPD-01137 product brief.
Does VSC9135YHM-01 support both SPI-3 and SPI-4.2 interfaces simultaneously?
Yes, VSC9135YHM-01 integrates concurrent SPI-3 (32-bit) and SPI-4.2 (16-bit) system packet interfaces, allowing simultaneous connection to different NPUs or FPGAs-for example, SPI-3 to a 2.5G control plane processor and SPI-4.2 to a 10G data plane accelerator. Both interfaces operate at full line rate with source-synchronous timing, as specified in the official Vitesse product brief.
What backplane standards does VSC9135YHM-01 natively support?
VSC9135YHM-01 supports dual-rate STS-12/STM-4 and STS-48/STM-16 backplane interfaces using the TFI-5 electrical specification. It connects directly to SONET/SDH backplanes at 622 Mbps and 2.5 Gbps without external retimers or level shifters, as documented in the Vitesse application diagram and specifications table.
Is VSC9135YHM-01 pin-compatible with earlier Vitesse HOVCAT devices?
Yes, VSC9135YHM-01 maintains pin compatibility with prior HOVCAT family members, enabling drop-in replacement in existing designs. This preserves PCB layout, power delivery, and thermal design while upgrading to enhanced LOVCAT48 functionality-including expanded VCG count and updated LCAS implementation-per Vitesse's migration guidance in the product brief.
What is the power dissipation profile of VSC9135YHM-01 under full load?
VSC9135YHM-01 has a typical power dissipation of 7W under full 2.5 Gbps operation (LOVCAT48 class), as stated in the Vitesse product brief. This value reflects worst-case traffic conditions including all 128 VCGs active with GFP encapsulation and DDR SDRAM access. Thermal design should accommodate this using the 35 mm × 35 mm HFCBGA package's recommended heatsink footprint.
VSC9135YHM-01 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 1760-BGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Applications:
- Ethernet
- Interface:
- SPI
- Voltage - Supply:
- -
- Supplier Device Package:
- 1760-HFCBGA (42.5x42.5)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
VSC9135YHM-01 FAQ
1.How can I place an order for VSC9135YHM-01 through Aetrix?
Please submit a Request for Quotation (RFQ) for VSC9135YHM-01 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for VSC9135YHM-01 reliable?
The price and inventory of VSC9135YHM-01 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for VSC9135YHM-01 is usually 5 days.
3.What payment methods are accepted for VSC9135YHM-01?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for VSC9135YHM-01 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for VSC9135YHM-01?
VSC9135YHM-01 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your VSC9135YHM-01 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for VSC9135YHM-01?
For technical support, including VSC9135YHM-01 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your VSC9135YHM-01 requirements.
6.How does Aetrix verify that VSC9135YHM-01 is sourced from the original manufacturer or authorized distributors?
All VSC9135YHM-01 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that VSC9135YHM-01 meets industry standards.
7.What is the process for return or replacement of VSC9135YHM-01?
All VSC9135YHM-01 units undergo pre-shipment inspection (PSI). If there is an issue with VSC9135YHM-01, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The VSC9135YHM-01 part is unused and in its original packaging.
Return procedure for VSC9135YHM-01:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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