My Inquiry
My Account
Texas Instruments VSP1000DSFT
- Part No.:
- VSP1000DSFT
- Manufacturer:
- Texas Instruments
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 6-XFDFN
- Datasheet:
-
VSP1000DSFT.pdf
- Description:
- IC BUFFER 1 CIRCUIT 6SON
- Quantity:
- Payment:
- Shipping:
Inventory:300
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
VSP1000DSFT from Texas Instruments is a high-speed, low-noise, unity-gain analog buffer optimized for CCD sensor output conditioning. It delivers 210 MHz bandwidth at 2 mA drive current, features adjustable active load current (via ISF pin) and adjustable output drive strength (via IDRV pin), and operates at 20 mW typical power on 13 V supply. It interfaces directly between CCD sensors and TI AFEs or ADC inputs in imaging systems.
For engineers reviewing the VSP1000DSFT datasheet, VSP1000DSFT pinout, VSP1000DSFT application, or VSP1000DSFT equivalent, key selection criteria include its 1-mm × 1-mm QFN-6 package, ±10 mA input current rating, 210 MHz –3-dB bandwidth, adjustable sink/load current (up to 4 mA), and operation across 0°C to +85°C ambient temperature.
Technical Context
The VSP1000DSFT implements a fast-settling, unity-gain voltage buffer with dual analog control paths: ISF adjusts input sink current (1–4 mA range via external resistor), while IDRV sets output drive strength and quiescent current (1.5–3 mA ICC). Its internal architecture supports stable operation into 22 pF loads without oscillation.
It requires decoupling of VCC to GND with 0.1-µF capacitor and uses no internal compensation-bandwidth and settling are fully resistor-configurable. Input voltage range spans 1.5 V to 10.5 V at 13 V supply, enabling compatibility with diverse CCD output swing profiles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| –3-dB Bandwidth | 210 MHz at 2 mA drive current; enables high-resolution, high-frame-rate CCD readout |
| Supply Current (ICC) | 2 mA typical at 13 V; scales with IDRV setting (1.5–3 mA range) |
| Input Load Current | Adjustable 1–4 mA via RISF (300 kΩ → 2 mA); matches CCD output impedance requirements |
| Rise/Fall Time | 5 ns / 6 ns; ensures minimal timing skew in pixel clock-aligned signal chains |
| Input Voltage Range | 1.5 V to 10.5 V at VCC = 13 V; accommodates wide CCD output swing |
| Operating Temperature | 0°C to +85°C ambient; validated for industrial and embedded imaging environments |
| Thermal Resistance θJA | 333.2°C/W; requires minimal PCB copper area for thermal management |
Pinout & Package
Package: DSF - 1-mm × 1-mm × 0.35-mm ultra-thin X2SON (QFN-6) with exposed thermal pad; RoHS-compliant, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IN (Pin 1) | Analog input | Connects directly to CCD sensor output; accepts 1.5–10.5 V swing and sinks configurable current |
| GND (Pin 2) | Ground reference | Common return for VEE; must be low-impedance connection to system ground plane |
| OUT (Pin 3) | Analog output | Drives AFE or ADC input; output impedance <1 Ω at 210 MHz bandwidth |
| IDRV (Pin 4) | Drive strength control | Resistor-connected analog input that sets output drive current and total ICC (90 kΩ → 2 mA) |
| VCC (Pin 5) | Positive supply | 10–16 V supply input; requires local 0.1-µF ceramic decoupling to GND |
| ISF (Pin 6) | Sink current control | Resistor-connected analog input that sets input load current (300 kΩ → 2 mA) |
Key Features
| Feature | Design Value |
|---|---|
| Adjustable input sink current | Configurable 1–4 mA via external RISF resistor; eliminates need for discrete load resistors on CCD output |
| Bandwidth tuning | 170–260 MHz range via RIDRV resistor; allows trade-off between speed and power (20–30 mW) |
| Ultra-compact footprint | 1 mm² area and 0.35 mm height; reduces PCB real estate and enables stacked-sensor module designs |
| Low-noise signal path | Optimized for CCD charge-domain signals; preserves SNR in sub-1 LSB ADC sampling applications |
| Single-supply operation | 10–16 V rail only; no negative supply required despite CCD's bipolar output swing handling |
Applications
| Scientific Imaging Systems | Industrial Machine Vision |
|---|---|
Use Scenario: High-precision CCD readout in spectroscopy and microscopy cameras requiring >16-bit dynamic range. IC Role / Device Role / Timing Role: Unity-gain buffer isolating CCD output from AFE input; maintains signal integrity during fast pixel transfer cycles. Use Value: 210 MHz bandwidth supports >50 MSPS pixel rates; adjustable load current ensures optimal CCD biasing across sensor vendors. | Use Scenario: Real-time inspection systems using line-scan CCDs in automated manufacturing lines. IC Role / Device Role / Timing Role: Signal conditioner between CCD and TI AFE (e.g., VSP1200 series); provides fast settling for sub-microsecond inter-pixel intervals. Use Value: 5 ns rise time minimizes timing jitter; 0.35-mm profile enables compact lens-mount-integrated PCB layouts. |
| Medical Endoscopy Cameras | Astronomy Sensor Interfaces |
Use Scenario: Miniaturized endoscopic imagers where board space and thermal dissipation are constrained. IC Role / Device Role / Timing Role: Low-power analog interface between miniature CCD and downstream digitization stage. Use Value: 20 mW operation extends battery life; 1-mm² QFN-6 simplifies flex-rigid PCB routing in narrow-diameter scopes. | Use Scenario: Deep-sky imaging arrays using cooled CCDs with variable output impedance and low-light signal levels. IC Role / Device Role / Timing Role: Precision buffer preserving weak analog signals before correlated double sampling (CDS). Use Value: Adjustable ISF current compensates for sensor-specific dark current drift; low-noise design maintains >70 dB SNR. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar CCD buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| THS4302DR | Fixed 1.5-GHz bandwidth, no adjustable load current; higher 35 mW power; SOIC-8 package | Requires external load network for CCD biasing; less flexible for multi-sensor platforms | Choose when maximum bandwidth is prioritized over power and configurability |
| VSP1200DSFT | Integrated 12-bit ADC + buffer; 100 MSPS sampling; same DSF package; higher system integration | Replaces discrete buffer+ADC chain; not suitable if analog output to external AFE is required | Choose when digitization occurs at sensor interface and system-level BOM reduction is critical |
Compared with THS4302DR and VSP1200DSFT, the VSP1000DSFT uniquely balances low power (20 mW), full configurability (load + drive), and ultra-small footprint-making it optimal for space-constrained, multi-CCD, or battery-powered imaging front-ends where analog signal fidelity and flexibility are primary.
Availability
VSP1000DSFT is available at Aetrix Electronics and suitable for scientific imaging systems, industrial machine vision equipment, and medical endoscopy camera modules requiring stable component supply and long-term manufacturability.
Supply support for VSP1000DSFT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and digital signal processing technologies since 1930.
The VSP1000DSFT belongs to TI's Video Signal Processing (VSP) family, engineered specifically for high-fidelity analog conditioning of CCD and CMOS image sensor outputs in professional and industrial imaging applications.
FAQ
What is the recommended decoupling capacitor for VSP1000DSFT?
The VSP1000DSFT requires a 0.1-µF ceramic capacitor placed between VCC (Pin 5) and GND (Pin 2), mounted as close as possible to the device. This capacitor stabilizes the supply rail against transient current demands during fast output transitions and ensures consistent 210 MHz bandwidth performance. Larger bulk capacitance (e.g., 1–10 µF) may be added nearby but does not replace the mandatory local 0.1-µF unit specified in the VSP1000DSFT datasheet.
Can VSP1000DSFT operate with a 10-V supply instead of 13 V?
Yes, the VSP1000DSFT supports VCC from 10 V to 16 V per its absolute maximum and recommended operating conditions. At 10 V, the input voltage range narrows to approximately 1.2 V to 8.5 V, and bandwidth decreases slightly (e.g., ~190 MHz at 2 mA drive). All key functions-including adjustable ISF load current and IDRV drive strength-remain fully operational, making VSP1000DSFT suitable for 10-V systems where lower power or legacy supply rails apply.
How do I configure VSP1000DSFT for 4-mA input load current?
To set the VSP1000DSFT input load current to 4 mA, connect a 150-kΩ resistor between ISF (Pin 6) and GND. This value is confirmed in Table 1 of the VSP1000DSFT datasheet under "Bandwidth = 210 MHz, IIN = 4 mA" configuration. The relationship is inverse-linear: lower RISF yields higher sink current. Ensure the resistor tolerance is ≤1% to maintain CCD bias accuracy within ±0.1 mA.
Does VSP1000DSFT support differential CCD outputs?
No, the VSP1000DSFT is a single-ended unity-gain buffer designed exclusively for single-ended CCD sensor outputs. It has one analog input (IN, Pin 1) referenced to GND and one analog output (OUT, Pin 3). For differential CCD interfaces, TI recommends the THS4521 or LMH5401, which provide fully differential input/output stages and common-mode control-neither of which is implemented in the VSP1000DSFT architecture.
What is the thermal pad connection requirement for VSP1000DSFT?
The VSP1000DSFT DSF package includes an exposed thermal pad centered on the bottom surface, which must be soldered to a solid copper thermal land on the PCB. TI specifies this pad as electrically connected to GND internally; therefore, the land must be tied to the system ground plane with ≥4 thermal vias (0.3-mm diameter) to maximize heat dissipation. Omitting this connection degrades θJA by >40%, risking thermal shutdown above 65°C ambient in continuous 210 MHz operation.
VSP1000DSFT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 6-XFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Amplifier Type:
- Buffer
- Number of Circuits:
- 1
- Output Type:
- -
- Slew Rate:
- -
- Gain Bandwidth Product:
- -
- -3db Bandwidth:
- 210 MHz
- Current - Input Bias:
- -
- Voltage - Input Offset:
- -
- Current - Supply:
- 2mA
- Current - Output / Channel:
- -
- Voltage - Supply Span (Min):
- 10 V
- Voltage - Supply Span (Max):
- 16 V
- Operating Temperature:
- 0°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-SON (1x1)
VSP1000DSFT FAQ
1.How can I place an order for VSP1000DSFT through Aetrix?
Please submit a Request for Quotation (RFQ) for VSP1000DSFT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for VSP1000DSFT reliable?
The price and inventory of VSP1000DSFT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for VSP1000DSFT is usually 5 days.
3.What payment methods are accepted for VSP1000DSFT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for VSP1000DSFT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for VSP1000DSFT?
VSP1000DSFT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your VSP1000DSFT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for VSP1000DSFT?
For technical support, including VSP1000DSFT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your VSP1000DSFT requirements.
6.How does Aetrix verify that VSP1000DSFT is sourced from the original manufacturer or authorized distributors?
All VSP1000DSFT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that VSP1000DSFT meets industry standards.
7.What is the process for return or replacement of VSP1000DSFT?
All VSP1000DSFT units undergo pre-shipment inspection (PSI). If there is an issue with VSP1000DSFT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The VSP1000DSFT part is unused and in its original packaging.
Return procedure for VSP1000DSFT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
VSP1000DSFT Tags
-
LM358DT
STMicroelectronics
-
LM358DR
Texas Instruments
-
LM2904DR
Texas Instruments
-
LM358ADR
Texas Instruments
-
LM2904DGKR
Texas Instruments
-
LM324DR
Texas Instruments
-
MCP6006T-E/OT
Microchip Technology
-
MCP6006UT-E/OT
Microchip Technology
-
LM324PWR
Texas Instruments
-
LM2902PWR
Texas Instruments
-
LM2902DR
Texas Instruments
-
LM358P
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
