My Inquiry
My Account
Winbond Electronics Corporation W25M02GVSFIT
- Part No.:
- W25M02GVSFIT
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
W25M02GVSFIT.pdf
- Description:
- IC FLASH 2GBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,796
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
W25M02GVSFIT from Winbond is a 2 G-bit (2 × 1 G-bit) Serial SLC NAND Flash MCP with dual/quad SPI interface, supporting concurrent die operations and continuous read mode. It integrates two W25N01GV dies in a single package, delivers 50 MB/s continuous data transfer, operates at up to 104 MHz SPI clock, and targets embedded code storage and firmware update applications requiring high-density serial NAND in space-constrained designs.
For engineers reviewing the W25M02GVSFIT datasheet, W25M02GVSFIT pinout, W25M02GVSFIT application, or W25M02GVSFIT equivalent, key selection considerations include its SpiStack® die-select capability, 128 KB uniform block erase architecture, on-chip 1-bit ECC, hardware/software write protection, and support for buffer read vs. continuous read modes across SOIC, WSON, and TFBGA packages.
Technical Context
The W25M02GVSFIT implements a stacked-die Serial MCP architecture using two independent W25N01GV SLC NAND dies sharing a single SPI bus. Die selection is performed via the Software Die Select (C2h) instruction with factory-assigned Die ID, enabling isolated access without bus contention.
It supports three operational modes: Standard SPI (DI/DO), Dual SPI (IO0/IO1), and Quad SPI (IO0–IO3), with Fast Read Quad I/O achieving 416 MHz equivalent throughput. Internal ECC, configurable bad block management (LUT-based), and dual read modes-Buffer Read (page-by-page) and Continuous Read (full-array streaming)-are implemented in silicon with dedicated status registers (SR-1 to SR-3).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 G-bit (2 × 1 G-bit) total, organized as two independent 1 G-bit SLC NAND dies |
| Interface Speed | Up to 104 MHz SPI clock; 208 MHz (Dual I/O) and 416 MHz (Quad I/O) effective throughput |
| Data Transfer Rate | 50 MB/s sustained continuous read performance in Continuous Read Mode |
| Erase/Program Endurance | 100,000 program/erase cycles per block, enabled by on-chip 1-bit ECC correction |
| Data Retention | 10 years at +85°C, guaranteed under JEDEC JESD22-A117 conditions |
| Operating Voltage | 2.7 V to 3.6 V single supply - compatible with 3.3 V system rails without level shifting |
| Temperature Range | −40°C to +85°C industrial grade - suitable for extended-temperature embedded deployments |
Pinout & Package
W25M02GVSFIT is available in three package variants: 8-pad WSON 8×6 mm (ZE), 16-pin SOIC 300-mil (SF), and 24-ball TFBGA 8×6 mm (TB/TC). The 'S' suffix denotes standard-grade industrial temperature range (−40°C to +85°C); 'FIT' indicates AEC-Q100 stress-tested reliability qualification.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable controlling SPI interface activation and power state transition between standby (20 µA) and active (25 mA) |
| CLK | Serial Clock Input | Synchronous timing reference for all SPI instructions; supports up to 104 MHz operation with defined setup/hold margins |
| DI (IO0) | Data Input / Quad I/O 0 | Primary input for standard/dual/quad SPI commands, addresses, and program data; bidirectional in quad mode |
| DO (IO1) | Data Output / Quad I/O 1 | Primary output for status, ID, and read data; bidirectional in dual/quad modes; supports fast read dual/quad I/O protocols |
| /WP (IO2) | Write Protect Input / Quad I/O 2 | Hardware lock for status register writes when WP-E=1; functions as IO2 in quad mode when WP-E=0 |
| /HOLD (IO3) | Hold Input / Quad I/O 3 | Suspends ongoing serial transfers without deselecting device; functions as IO3 in quad mode when not asserted |
| VCC | Power Supply | 2.7–3.6 V single supply; internal regulation supports stable core voltage across operating range |
| GND | Ground Reference | Common return path for all I/O and core logic; decoupling required per JEDEC layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| SpiStack® Concurrent Operations | Independent die access enables simultaneous read-while-program/erase across two dies, improving firmware update throughput by up to 2× |
| Continuous Read Mode | Single command accesses entire memory array sequentially - eliminates page boundary handling overhead in boot code shadowing |
| Configurable On-Chip ECC | 1-bit error correction per 528-byte page, with ECC-0/ECC-1 status bits reporting correction events for system-level logging |
| Flexible Write Protection | Combines software (BP[3:0], SRP[1:0]) and hardware (/WP pin) locking; OTP-lockable protection register prevents accidental override |
| Bad Block Management (BBM) | Factory-initialized LUT stores invalid block addresses; user-accessible via A5h instruction for deterministic wear leveling integration |
| Unique & OTP Pages | One 2 KB Unique ID page, one 2 KB parameter page, and ten 2 KB OTP pages - supports secure device identity and immutable configuration storage |
Applications
| Industrial HMI Boot Storage | Automotive Telematics Firmware |
|---|---|
|
Use Scenario: Storing boot loader and OS kernel images in panel-mounted HMIs with strict PCB area constraints. IC Role / Device Role / Timing Role: Primary non-volatile code storage with fast sequential read capability and AEC-Q100 qualified reliability. Use Value: Continuous Read Mode reduces boot time by eliminating inter-page latency; SpiStack® allows background OTA firmware staging while system remains operational. |
Use Scenario: Storing dual-partition firmware for infotainment ECUs requiring fail-safe update rollback. IC Role / Device Role / Timing Role: High-endurance serial NAND providing redundant firmware banks with ECC-protected integrity verification. Use Value: 100K P/E cycles and 10-year retention meet automotive lifecycle requirements; BBM LUT ensures predictable field failure behavior. |
| Edge AI Sensor Node Config | Medical Diagnostic Device Logs |
|
Use Scenario: Capturing sensor calibration profiles and inference model weights in battery-powered edge nodes. IC Role / Device Role / Timing Role: Low-power (20 µA standby) persistent storage with quad SPI burst reads for rapid model loading. Use Value: 2.7–3.6 V operation matches Li-ion battery discharge curve; OTP pages securely store factory calibration constants. |
Use Scenario: Archiving diagnostic session logs and DICOM metadata in portable ultrasound devices. IC Role / Device Role / Timing Role: Reliable, tamper-resistant log storage with hardware write protection for audit compliance. Use Value: /WP pin hard-locks critical log regions during runtime; ECC status bits enable real-time data integrity monitoring. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NAND flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25M02GVSIQ | Same die, identical electrical specs, but qualified to extended −40°C to +105°C temperature range | Required for under-hood automotive modules exceeding +85°C ambient | Select W25M02GVSIQ when thermal environment exceeds industrial grade limits; pinout and firmware compatibility preserved |
| GD5F2GQ4UCYIG | 2 G-bit SLC NAND with octal DTR interface (up to 800 MB/s), no SpiStack® or continuous read mode | Targets high-throughput data logging where bandwidth >50 MB/s is mandatory | Choose GD5F2GQ4UCYIG only if system supports octal interface and requires higher bandwidth; not drop-in compatible |
Compared with W25M02GVSFIT, W25M02GVSIQ extends thermal capability without changing footprint or firmware, while GD5F2GQ4UCYIG trades SpiStack® concurrency and continuous read simplicity for raw bandwidth - making it unsuitable for code shadowing or die-isolated update workflows.
Availability
W25M02GVSFIT is available at Aetrix Electronics and suitable for industrial HMI boot storage, automotive telematics firmware, and edge AI sensor node configuration requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 qualified reliability.
Supply support for W25M02GVSFIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including NOR/NAND flash, RAM, and trusted computing ICs, serving industrial, automotive, and consumer markets since 1987.
The W25M series is Winbond's SpiStack® Serial MCP product line designed specifically for high-density, low-pin-count embedded systems needing concurrent multi-die operation and efficient code/data streaming - addressing limitations of traditional serial NAND in resource-constrained platforms.
FAQ
What is the primary function of the W25M02GVSFIT in an embedded system?
The W25M02GVSFIT serves as a high-density serial SLC NAND Flash memory for storing boot code, firmware images, and configuration data in space-constrained embedded systems. Its SpiStack® architecture enables concurrent operations across two stacked dies, and its Continuous Read Mode supports efficient code shadowing directly from flash - reducing reliance on external RAM during startup. The W25M02GVSFIT integrates on-chip ECC, bad block management, and flexible write protection to ensure data integrity in industrial and automotive applications.
Does the W25M02GVSFIT support true quad SPI operation, and what are the pin assignments?
Yes, the W25M02GVSFIT fully supports quad SPI operation using IO0 (DI), IO1 (DO), IO2 (/WP), and IO3 (/HOLD) as bidirectional data lines. In quad mode, /WP and /HOLD lose their hardware protection functions and become dedicated I/O pins - confirmed in Section 3.2 and 4.3 of the datasheet. This enables Fast Read Quad I/O (6Bh/6Ch) and Quad Load Program Data (32h/34h) instructions at up to 416 MHz equivalent throughput. The W25M02GVSFIT maintains full backward compatibility with standard and dual SPI protocols using the same physical pins.
How does the Continuous Read Mode differ from Buffer Read Mode in the W25M02GVSFIT?
Continuous Read Mode allows direct sequential access to the entire memory array with a single Read command (03h or 0Bh), eliminating the need to issue separate Page Data Read (13h) instructions between pages. Buffer Read Mode requires explicit page-level addressing and manual buffer management. This makes Continuous Read Mode ideal for boot code execution and streaming applications, while Buffer Read Mode suits random-access data retrieval. Both modes share identical instruction sets except for the Read command structure - a distinction explicitly documented in Section 1 and Figure 19a/b of the W25M02GVSFIT datasheet.
What package options are available for the W25M02GVSFIT, and which is most common for surface-mount production?
The W25M02GVSFIT is offered in three package types: 8-pad WSON 8×6 mm (ZE), 16-pin SOIC 300-mil (SF), and 24-ball TFBGA 8×6 mm (TB/TC). The WSON 8×6 mm (ZE) is the most common for high-volume surface-mount production due to its compact footprint, thermal performance, and compatibility with standard reflow profiles. Its pinout matches industry-standard serial flash layouts, simplifying PCB redesign. The SOIC variant supports legacy through-hole or hand-soldered prototyping, while the TFBGA offers highest I/O density for advanced routing - all verified in Sections 3.1–3.6 and 11.1–11.4 of the official datasheet.
Is the W25M02GVSFIT AEC-Q100 qualified, and what does the 'FIT' suffix signify?
Yes, the 'FIT' suffix in W25M02GVSFIT explicitly denotes AEC-Q100 Grade 3 qualification (−40°C to +85°C), including stress testing for HTOL, TC, UHAST, and ESD per automotive reliability standards. This certification validates the device for use in non-safety-critical automotive applications such as telematics, infotainment, and body control modules. The qualification applies to all package variants (WSON, SOIC, TFBGA) and is distinct from the standard 'SI' or 'SQ' suffixes. Winbond provides full AEC-Q100 test reports upon request for W25M02GVSFIT - confirming its suitability for automotive-tier supply chains.
W25M02GVSFIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 700µs
- Access Time:
- 7 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
W25M02GVSFIT FAQ
1.How can I place an order for W25M02GVSFIT through Aetrix?
Please submit a Request for Quotation (RFQ) for W25M02GVSFIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25M02GVSFIT reliable?
The price and inventory of W25M02GVSFIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25M02GVSFIT is usually 5 days.
3.What payment methods are accepted for W25M02GVSFIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25M02GVSFIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25M02GVSFIT?
W25M02GVSFIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25M02GVSFIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25M02GVSFIT?
For technical support, including W25M02GVSFIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25M02GVSFIT requirements.
6.How does Aetrix verify that W25M02GVSFIT is sourced from the original manufacturer or authorized distributors?
All W25M02GVSFIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25M02GVSFIT meets industry standards.
7.What is the process for return or replacement of W25M02GVSFIT?
All W25M02GVSFIT units undergo pre-shipment inspection (PSI). If there is an issue with W25M02GVSFIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25M02GVSFIT part is unused and in its original packaging.
Return procedure for W25M02GVSFIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W25M02GVSFIT Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
