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Winbond Electronics Corporation W25M02GVTBIR
- Part No.:
- W25M02GVTBIR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25M02GVTBIR.pdf
- Description:
- IC FLASH 2GBIT SPI/QUAD 24TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,644
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Product details
Overview
W25M02GVTBIR from Winbond is a 2 G-bit (2 × 1 G-bit) Serial SLC NAND Flash MCP based on stacked W25N01GV dies in a 24-ball TFBGA 8×6-mm package (code TB), supporting Dual/Quad SPI, Continuous Read Mode, and concurrent read-while-program/erase operations. It delivers 50 MB/s continuous data transfer at up to 104 MHz clock, with on-chip 1-bit ECC, hardware/software write protection, and -40°C to +85°C operation - used in embedded boot storage and firmware code shadowing.
For engineers reviewing the W25M02GVTBIR datasheet, W25M02GVTBIR pinout, W25M02GVTBIR application, or W25M02GVTBIR equivalent, key selection considerations include its dual-die SpiStack® architecture, TFBGA-24 (TB) package mapping, buffer vs. continuous read mode trade-offs, JEDEC ID compatibility, and ECC-enabled NAND manageability for industrial firmware storage.
Technical Context
The W25M02GVTBIR implements a Serial MCP (Multi-Chip Package) architecture with two independent W25N01GV SLC NAND dies sharing a single SPI interface via Software Die Select (C2h) instruction and factory-assigned Die IDs. Only one die is active at any time to prevent bus contention.
It supports three operational modes: Standard SPI (DI/DO), Dual SPI (IO0/IO1), and Quad SPI (IO0–IO3), with /WP and /HOLD repurposed as IO2/IO3 in Quad mode. Its Continuous Read Mode eliminates per-page "Page Data Read" commands, enabling linear array access ideal for XIP-like code execution.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Capacity | 2 G-bit (2 × 1 G-bit) total, organized as two independent 1 G-bit SLC NAND dies |
| Interface Speed | Up to 104 MHz SPI clock; enables 208 MHz (Dual I/O) or 416 MHz (Quad I/O) effective throughput |
| Data Transfer Rate | 50 MB/s continuous read rate in Continuous Read Mode - enables efficient firmware shadowing |
| Erase/Program Endurance | 100,000 program/erase cycles per block, supported by on-chip 1-bit ECC correction |
| Data Retention | 10 years at +85°C - validated for long-life industrial firmware storage |
| Operating Voltage | 2.7 V to 3.6 V single supply - compatible with standard 3.3 V embedded power rails |
| Temperature Range | -40°C to +85°C - qualified for extended-temperature industrial and automotive control applications |
Pinout & Package
W25M02GVTBIR uses the 24-ball TFBGA 8×6-mm package with 5×5 ball array (package code TB). Pin functions are defined per ball position; NC balls are unconnected and must be left floating or grounded per layout guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| B2 | CLK | Input: Serial clock signal; rising edge latches input, falling edge samples output in all SPI modes |
| B3 | GND | Ground reference for all I/O and core logic; requires low-impedance PCB plane connection |
| B4 | VCC | Power supply input (2.7–3.6 V); decoupling capacitor (0.1 µF) required adjacent to this ball |
| C2 | /CS | Active-low chip select; must transition high→low before each instruction; controls device enable and standby entry |
| C4 | /WP (IO2) | I/O: In Standard/Dual SPI, active-low hardware write protect; in Quad SPI, bidirectional data line IO2 |
| D2 | DO (IO1) | I/O: In Standard SPI, unidirectional data output; in Dual/Quad SPI, bidirectional data line IO1 |
| D3 | DI (IO0) | I/O: In Standard SPI, unidirectional data input; in Dual/Quad SPI, bidirectional data line IO0 |
| D4 | /HOLD (IO3) | I/O: In Standard/Dual SPI, active-low hold input suspends ongoing transfers; in Quad SPI, bidirectional data line IO3 |
Key Features
| Feature | Design Value |
|---|---|
| Software Die Select (C2h) | Enables independent access to either stacked die using an 8-bit Die ID - essential for dual-firmware partitioning |
| Continuous Read Mode | Single Read command accesses full memory array without intermediate Page Data Read instructions - reduces CPU overhead in boot loaders |
| Concurrent Operations | Supports Read-while-Program/Erase across dies - improves effective throughput in multi-threaded firmware update scenarios |
| On-chip 1-bit ECC | Corrects single-bit errors per 528-byte page in real time - eliminates need for external ECC logic in host controller |
| Configurable Write Protection | Combines volatile SR bits (BP[3:0], WP-E) and hardware /WP pin to protect blocks as small as 256 KB - enhances firmware integrity |
Applications
| Industrial Firmware Storage | Embedded Boot Memory |
|---|---|
|
Use Scenario: Storing and executing bootloader and application firmware in programmable logic controllers (PLCs) and HMIs with field-upgrade capability. IC Role / Device Role / Timing Role: Primary non-volatile code storage with fast sequential read and robust ECC handling during cold starts. Use Value: 50 MB/s Continuous Read Mode enables sub-100 ms firmware load; 10-year retention ensures reliability over equipment lifecycle. |
Use Scenario: Hosting boot images for ARM Cortex-M7 and RISC-V SoCs in medical diagnostics and test equipment. IC Role / Device Role / Timing Role: SPI-connected boot memory accessed at power-on reset; supports XIP-like linear fetch via Continuous Read Mode. Use Value: Dual-die concurrency allows background firmware validation while booting - reducing system startup latency. |
| Automotive Infotainment | Network Edge Device Storage |
|
Use Scenario: Storing UI assets, voice recognition models, and OTA update packages in automotive head units operating at -40°C to +85°C. IC Role / Device Role / Timing Role: High-density NAND storage with hardware write protection to prevent accidental corruption during vehicle battery transients. Use Value: Hardware /WP pin + OTP lockable SRP bits ensure immutable boot partition - meeting ASIL-B functional safety requirements. |
Use Scenario: Firmware and configuration storage in 5G small cell gateways and industrial routers requiring remote updates. IC Role / Device Role / Timing Role: Dual-die architecture enables A/B firmware partitioning: one die active, one updating - enabling zero-downtime upgrades. Use Value: Software Die Select (C2h) instruction allows atomic die swap post-update - eliminating partial-write failure risk. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NAND flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25M02GVTCIR | Same die stack and electrical specs, but uses 6×4 TFBGA (package code TC) - 0.1 mm larger footprint, different ball pitch | Requires PCB redesign due to altered ball map and mechanical dimensions; not drop-in replaceable | Select when board layout accommodates TC's 6×4 array and thermal pad placement differs |
| MT29F2G08ABAEAH4 | 2 G-bit SLC NAND in 48-ball TSOP, parallel interface (not SPI); no Continuous Read Mode or SpiStack® concurrency | Demands host-side ECC, separate controller logic, and wider bus routing - incompatible with SPI-only hosts | Choose only for legacy parallel-NAND systems where SPI interface is unavailable |
Compared with W25M02GVTBIR, W25M02GVTCIR offers identical functionality but mandates layout changes, while MT29F2G08ABAEAH4 requires full interface and firmware re-architecting - making W25M02GVTBIR the optimal choice for new SPI-based designs needing density, concurrency, and ease of integration.
Availability
W25M02GVTBIR is available at Aetrix Electronics and suitable for industrial firmware storage, embedded boot memory, and automotive infotainment systems requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for W25M02GVTBIR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR/NAND flash, RAM, and trusted computing ICs.
The W25M series is designed as high-density Serial MCP NAND flash for space-constrained embedded systems requiring concurrent operations and simplified NAND management - targeting boot, firmware, and code storage applications.
FAQ
What is the package type and footprint of W25M02GVTBIR?
W25M02GVTBIR uses a 24-ball TFBGA 8×6-mm package with a 5×5 ball array (package code TB). Its footprint matches JEDEC MO-270AC standards, with 0.8 mm ball pitch and exposed thermal pad. The package is RoHS-compliant and rated for reflow per J-STD-020D.3.
Does W25M02GVTBIR support Quad SPI mode, and how are the I/O pins assigned?
Yes, W25M02GVTBIR supports Quad SPI mode using IO0 (DI), IO1 (DO), IO2 (/WP), and IO3 (/HOLD) - mapped to balls D3, D2, C4, and D4 respectively. In Quad mode, /WP and /HOLD lose their dedicated protection functions and become general-purpose I/O lines.
How does the Continuous Read Mode in W25M02GVTBIR differ from Buffer Read Mode?
Continuous Read Mode in W25M02GVTBIR allows direct linear access to the entire memory array with a single Read command, eliminating the need for repeated "Page Data Read" instructions between pages. Buffer Read Mode requires explicit page-level reads and is optimized for random access - making Continuous Read Mode superior for firmware shadowing.
Can both dies in W25M02GVTBIR be programmed simultaneously?
No - W25M02GVTBIR enforces single-die activation at any time via the Software Die Select (C2h) instruction. While "Multi Die Program/Erase" is listed as a feature, it refers to rapid sequential programming across dies, not true simultaneity. Bus arbitration prevents concurrent active control to avoid SPI contention.
What ECC capability does W25M02GVTBIR provide, and is it configurable?
W25M02GVTBIR integrates on-chip 1-bit error correction per 528-byte page, enabled by the ECC-E bit in Status Register-2. ECC is always active during read operations and cannot be disabled; status bits ECC-1/ECC-0 in Status Register-3 report correction events, allowing host firmware to log soft errors.
W25M02GVTBIR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 700µs
- Access Time:
- 7 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (8x6)
W25M02GVTBIR FAQ
1.How can I place an order for W25M02GVTBIR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25M02GVTBIR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25M02GVTBIR reliable?
The price and inventory of W25M02GVTBIR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25M02GVTBIR is usually 5 days.
3.What payment methods are accepted for W25M02GVTBIR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25M02GVTBIR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25M02GVTBIR?
W25M02GVTBIR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25M02GVTBIR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25M02GVTBIR?
For technical support, including W25M02GVTBIR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25M02GVTBIR requirements.
6.How does Aetrix verify that W25M02GVTBIR is sourced from the original manufacturer or authorized distributors?
All W25M02GVTBIR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25M02GVTBIR meets industry standards.
7.What is the process for return or replacement of W25M02GVTBIR?
All W25M02GVTBIR units undergo pre-shipment inspection (PSI). If there is an issue with W25M02GVTBIR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25M02GVTBIR part is unused and in its original packaging.
Return procedure for W25M02GVTBIR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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