Winbond Electronics Corporation W25M02GVTBIT TR
- Part No.:
- W25M02GVTBIT TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25M02GVTBIT TR.pdf
- Description:
- IC FLASH 2GBIT SPI 24TFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,339
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
W25M02GVTBIT TR from Winbond is a 2G-bit (2 × 1G-bit) Serial SLC NAND Flash MCP with Dual/Quad SPI interface, supporting concurrent die operations and Continuous Read Mode for code shadowing. It integrates two W25N01GV dies in a single 8-pad WSON 8×6-mm package, operates from 2.7–3.6V, delivers up to 50 MB/s continuous read throughput, and features on-chip 1-bit ECC, hardware/software write protection, and 100,000 program/erase cycles.
For engineers reviewing the W25M02GVTBIT TR datasheet, W25M02GVTBIT TR pinout, W25M02GVTBIT TR application, or W25M02GVTBIT TR equivalent, this page provides verified technical context, validated pin functions, real-world use cases in embedded storage and boot memory, and confirmed alternative parts with documented functional trade-offs.
Technical Context
The W25M02GVTBIT TR implements SpiStack® architecture with two stacked SLC NAND dies sharing a single SPI bus, each assigned a factory-programmed Die ID and accessible via Software Die Select (C2h) instruction. Only one die is active at a time to prevent bus contention, enabling independent die-level control.
It supports three operational modes: Standard SPI (DI/DO), Dual SPI (IO0/IO1), and Quad SPI (IO0–IO3), with clock rates up to 104 MHz - yielding 208 MHz effective bandwidth in Dual I/O and 416 MHz in Quad I/O. Continuous Read Mode eliminates per-page command overhead, allowing direct linear access across the full 256 MB array without intermediate Page Data Read instructions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Capacity | 2 G-bit (256 MB), composed of two 1 G-bit W25N01GV dies in stacked MCP configuration |
| Interface | Dual/Quad SPI with standard CLK, /CS, IO0–IO3; supports Fast Read Quad I/O (6Bh/6Ch) and 4-byte addressing |
| Max Clock Frequency | 104 MHz - enables 416 MHz equivalent data rate in Quad I/O mode for high-throughput firmware loading |
| Erase/Program Endurance | 100,000 cycles - specified with on-chip 1-bit ECC correction (1 bit per 528 bytes) |
| Data Retention | 10 years at +85°C - validated under JEDEC JESD22-A117 stress conditions |
| Supply Voltage | 2.7 V to 3.6 V - compatible with industrial 3.3 V rail; no level-shifting required for host MCU SPI peripherals |
| Operating Temperature | −40°C to +85°C - qualified for extended-temperature embedded applications including automotive infotainment and industrial HMI |
Pinout & Package
W25M02GVTBIT TR is packaged in an 8-pad WSON 8×6-mm (Package Code ZE), with exposed thermal pad. All pins are surface-mount, RoHS-compliant, and rated for reflow per J-STD-020D.3.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable; must transition high→low before first instruction after power-up or reset |
| DO (IO1) | Serial Data Output / Bidirectional I/O1 | Unidirectional output in Standard SPI; bidirectional in Dual/Quad SPI; used for status/data reads |
| /WP (IO2) | Write Protect Input / Bidirectional I/O2 | Hardware lock for Status Register when WP-E=1; serves as IO2 in Quad SPI when WP-E=0 |
| GND | Ground Reference | Primary return path for VCC and all I/O signals; requires low-impedance PCB plane connection |
| DI (IO0) | Serial Data Input / Bidirectional I/O0 | Unidirectional input in Standard SPI; bidirectional in Dual/Quad SPI; carries instructions, addresses, and program data |
| CLK | Serial Clock Input | Edge-triggered master clock; rising edge latches inputs, falling edge samples outputs; max 104 MHz |
| /HOLD (IO3) | Hold Input / Bidirectional I/O3 | Suspends ongoing serial transfer without deselecting device; serves as IO3 in Quad SPI when WP-E=0 |
| VCC | Power Supply | Single 2.7–3.6 V supply; decoupling capacitor (≥1 µF X7R) required within 5 mm of pin |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent Operations | Enables Read-while-Program/Erase across stacked dies, improving effective throughput by up to 2× vs. single-die NAND |
| Continuous Read Mode | Eliminates need for repeated Page Data Read commands - reduces host CPU overhead by >70% during sequential firmware image loads |
| Software Die Select (C2h) | Allows runtime selection of active die using 8-bit Die ID; essential for dual-boot partitioning or redundant firmware storage |
| On-chip 1-bit ECC | Corrects single-bit errors per 528-byte page without external controller intervention; ECC status bits (ECC-1/ECC-0) report correction events |
| Bad Block Management (BBM) | Factory-initialized invalid block table stored in Look-Up Table (LUT); accessible via A5h instruction for host-level wear leveling integration |
Applications
| Embedded Boot Memory | Firmware Storage for IoT Gateways |
|---|---|
|
Use Scenario: Storing bootloader and primary application firmware for ARM Cortex-M7 microcontrollers in space-constrained edge nodes. IC Role / Device Role / Timing Role: Primary non-volatile boot source accessed via Quad SPI at startup; supports 4-byte addressing for >16 MB images. Use Value: Continuous Read Mode enables full 256 MB firmware load in <120 ms at 104 MHz Quad I/O, reducing boot latency by 40% vs. buffer-read alternatives. |
Use Scenario: Holding OTA update packages, configuration profiles, and secure key partitions in cellular-connected smart meters. IC Role / Device Role / Timing Role: Dual-die architecture allows simultaneous background OTA write to Die #1 while executing current firmware from Die #0. Use Value: Concurrent Operations eliminate firmware update downtime - system remains fully responsive during 50 MB field upgrades. |
| Industrial HMI Display Cache | Automotive Infotainment Media Buffer |
|
Use Scenario: Caching GUI assets (fonts, icons, animations) for 7-inch capacitive touch displays in PLC operator panels. IC Role / Device Role / Timing Role: High-bandwidth Quad SPI interface streams compressed assets directly to display controller DMA engine. Use Value: 50 MB/s sustained read throughput ensures zero-frame-drop rendering of 1080p UI sequences without DRAM buffering. |
Use Scenario: Storing audio codecs, voice assistant models, and map tile databases in head-unit systems requiring AEC-Q100 compliance. IC Role / Device Role / Timing Role: On-chip 1-bit ECC and 10-year data retention meet automotive long-life reliability requirements without external error-handling logic. Use Value: Hardware Write Protection (/WP pin + SRP bits) prevents accidental corruption of safety-critical navigation firmware during ECU resets. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NAND flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25M02GVTAIG TR | Same die stack and SPI functionality, but in 16-pin SOIC 300-mil (SF) package - larger footprint, no thermal pad, higher parasitic inductance. | Preferred for through-hole prototyping or legacy board rework where WSON reflow is unavailable. | Select W25M02GVTAIG TR only when manual soldering or socket-based validation is required; not recommended for new high-density designs. |
| GD5F2GQ4UCYIGR | 2 G-bit SLC NAND from GigaDevice; supports Octal SPI (up to 800 Mbps), lacks SpiStack® concurrent die operation and Continuous Read Mode. | Higher raw bandwidth but requires external ECC management and complex multi-plane interleaving for throughput gains. | Choose GD5F2GQ4UCYIGR only if Octal SPI host interface exists and die-level concurrency is unnecessary; W25M02GVTBIT TR offers simpler software stack integration. |
Compared with W25M02GVTBIT TR, W25M02GVTAIG TR trades miniaturization and thermal performance for assembly flexibility, while GD5F2GQ4UCYIGR sacrifices architectural simplicity and built-in ECC for peak interface speed - making W25M02GVTBIT TR optimal for cost-sensitive, space-constrained embedded systems needing robust, drop-in NAND storage.
Availability
W25M02GVTBIT TR is available at Aetrix Electronics and suitable for embedded boot memory, industrial HMI caching, and automotive infotainment media buffering requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for W25M02GVTBIT TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based global semiconductor manufacturer specializing in specialty memory solutions, including SPI NOR/NAND Flash, RAM, and TrustME® secure memory products.
The W25M SpiStack® product line was designed to deliver high-density serial NAND in ultra-compact packages for space-constrained embedded systems, enabling concurrent die access and simplified firmware management without external controllers.
FAQ
What is the exact memory organization of W25M02GVTBIT TR?
W25M02GVTBIT TR contains two independent 1 G-bit (128 MB) SLC NAND dies stacked in a single package, each organized as 1,024 blocks × 64 pages × 2,048 bytes per page. Total usable capacity is 256 MB, with 2 KB Unique ID, 2 KB Parameter, and ten 2 KB OTP pages allocated separately per die.
Does W25M02GVTBIT TR require external ECC circuitry?
No. W25M02GVTBIT TR includes on-chip 1-bit ECC capable of correcting single-bit errors per 528-byte sector. The ECC status bits (ECC-1/ECC-0) in Status Register-3 report correction activity, and the feature is enabled via the ECC-E bit in Configuration Register (SR-2), eliminating need for external ECC logic.
How does the Software Die Select (C2h) instruction work in W25M02GVTBIT TR?
The C2h instruction followed by an 8-bit Die ID selects which of the two stacked dies becomes active. After power-up or Device Reset (FFh), Die #0 is always active. C2h allows dynamic switching - e.g., running firmware from Die #0 while updating Die #1 - enabling seamless dual-image updates without host-side memory remapping.
Can W25M02GVTBIT TR operate in Quad SPI mode with hardware write protection enabled?
No. When WP-E = 1 (Hardware Protection mode), /WP and /HOLD pins function exclusively as dedicated active-low control inputs and cannot serve as IO2/IO3. Quad SPI requires all four I/O lines (IO0–IO3), so Quad mode is only available when WP-E = 0 (Software Protection mode), where /WP and /HOLD become bidirectional I/O pins.
What package type does W25M02GVTBIT TR use, and is thermal management required?
W25M02GVTBIT TR uses an 8-pad WSON 8×6-mm package (Package Code ZE) with exposed thermal pad. Although typical active current is 25 mA, the thermal pad must be soldered to a dedicated PCB copper pour (≥100 mm²) connected to GND for reliable operation above 70°C ambient - especially during sustained 104 MHz Quad I/O transfers.
W25M02GVTBIT TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 700µs
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (8x6)
W25M02GVTBIT TR FAQ
1.How can I place an order for W25M02GVTBIT TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25M02GVTBIT TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25M02GVTBIT TR reliable?
The price and inventory of W25M02GVTBIT TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25M02GVTBIT TR is usually 5 days.
3.What payment methods are accepted for W25M02GVTBIT TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25M02GVTBIT TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25M02GVTBIT TR?
W25M02GVTBIT TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25M02GVTBIT TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25M02GVTBIT TR?
For technical support, including W25M02GVTBIT TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25M02GVTBIT TR requirements.
6.How does Aetrix verify that W25M02GVTBIT TR is sourced from the original manufacturer or authorized distributors?
All W25M02GVTBIT TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25M02GVTBIT TR meets industry standards.
7.What is the process for return or replacement of W25M02GVTBIT TR?
All W25M02GVTBIT TR units undergo pre-shipment inspection (PSI). If there is an issue with W25M02GVTBIT TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25M02GVTBIT TR part is unused and in its original packaging.
Return procedure for W25M02GVTBIT TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W25M02GVTBIT TR Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

