Winbond Electronics Corporation W25M02GVTCIT
- Part No.:
- W25M02GVTCIT
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
W25M02GVTCIT.pdf
- Description:
- IC FLASH 2GBIT SPI/QUAD 24TFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,517
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Product details
Overview
W25M02GVTCIT from Winbond is a 2 G-bit (2 × 1 G-bit) Serial SLC NAND Flash MCP with dual/quad SPI interface, supporting concurrent die operations and continuous read mode for code shadowing. It integrates two W25N01GV dies in a single package, operates at 2.7–3.6 V, delivers up to 50 MB/s continuous data transfer, and features on-chip 1-bit ECC and hardware/software write protection.
For engineers reviewing the W25M02GVTCIT datasheet, W25M02GVTCIT pinout, W25M02GVTCIT application, or W25M02GVTCIT equivalent, key selection considerations include dual-die concurrency support, 104 MHz SPI clock capability, 128 KB uniform block erase architecture, buffer vs. continuous read mode configuration, and TFBGA/SOIC/WSON package compatibility for space-constrained embedded storage designs.
Technical Context
The W25M02GVTCIT implements SpiStack® architecture with two stacked W25N01GV SLC NAND dies sharing a single SPI bus. Die selection is performed via Software Die Select (C2h) instruction using factory-assigned Die ID#, enabling independent access while preventing bus contention.
It supports three operational modes: Standard SPI (DI/DO), Dual SPI (IO0/IO1), and Quad SPI (IO0–IO3), with Fast Read Quad I/O achieving 416 MHz equivalent throughput. Continuous Read Mode eliminates per-page command overhead, allowing direct linear access across the full 256 MB array without intermediate Page Data Read instructions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Capacity | 2 G-bit (256 MB) total, composed of two 1 G-bit SLC NAND dies |
| Interface Speed | Up to 104 MHz SPI clock; 208 MHz (Dual I/O) or 416 MHz (Quad I/O) effective rate |
| Data Transfer Rate | 50 MB/s sustained in Continuous Read Mode |
| Erase/Program Endurance | 100,000 cycles with on-chip 1-bit ECC correction (1 bit / 528 bytes) |
| Data Retention | 10 years at +85°C operating temperature |
| Operating Voltage | 2.7 V to 3.6 V single supply - compatible with 3.3 V logic systems |
| Package Type | 24-ball TFBGA 8×6 mm (Package Code TC, 6×4 ball array) |
Pinout & Package
W25M02GVTCIT is packaged in a 24-ball TFBGA 8×6 mm (Package Code TC, 6×4 ball array), optimized for high-density PCB layouts and thermal performance in compact embedded systems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| B2 | CLK | Serial clock input - controls timing for all SPI instructions and data transfers |
| B3 | GND | Ground reference - required for stable voltage referencing and noise immunity |
| B4 | VCC | Power supply input - supplies core and I/O circuitry at 2.7–3.6 V |
| C2 | /CS | Chip select input - enables device communication; high = standby, low = active |
| C4 | /WP (IO2) | Write protect input or Quad SPI I/O2 - hardware lock for status register when WP-E=1 |
| D2 | DO (IO1) | Data output or Quad SPI I/O1 - bidirectional in Dual/Quad mode; unidirectional output in Standard SPI |
| D3 | DI (IO0) | Data input or Quad SPI I/O0 - bidirectional in Dual/Quad mode; unidirectional input in Standard SPI |
| D4 | /HOLD (IO3) | Hold input or Quad SPI I/O3 - suspends ongoing serial transfer without deselecting device |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent Operations | Independent read-while-program/erase across two stacked dies - improves system-level throughput without host intervention |
| Continuous Read Mode | Single Read command accesses entire memory array linearly - eliminates page boundary management for boot code loading |
| Software Die Select (C2h) | Enables deterministic die activation via 8-bit Die ID - essential for managing redundancy, wear leveling, or partitioned firmware storage |
| On-Chip 1-Bit ECC | Automatic error detection/correction per 528-byte sector - reduces host-side ECC overhead and extends usable lifetime |
| Configurable Write Protection | Combines volatile BP bits, OTP-lockable SRP bits, and /WP pin control - supports hierarchical security for bootloader and parameter regions |
Applications
| Industrial HMI Boot Storage | Medical Device Firmware Vault |
|---|---|
|
Use Scenario: Storing boot firmware and GUI assets for touch-based HMIs in factory automation panels where space and reliability are constrained. IC Role / Device Role / Timing Role: Primary non-volatile storage for XIP-capable microcontroller boot image and overlay resources. Use Value: Continuous Read Mode enables fast, deterministic code shadowing into RAM; 10-year retention ensures field-deployed units remain functional without firmware refresh. |
Use Scenario: Securing certified firmware and calibration data in portable diagnostic equipment requiring traceable, tamper-resistant updates. IC Role / Device Role / Timing Role: Trusted storage for signed firmware images and immutable device parameters with hardware-enforced write protection. Use Value: OTP pages store cryptographic keys and calibration constants; /WP pin + SRP bits prevent accidental or malicious overwrite during service operations. |
| Edge Gateway Configuration DB | Automotive Telematics Log Buffer |
|
Use Scenario: Maintaining persistent network configuration, TLS certificates, and OTA update metadata in cellular-connected edge gateways. IC Role / Device Role / Timing Role: High-endurance NAND storage for frequent small-write operations with built-in bad block management. Use Value: 100,000 program/erase cycles and LUT-based bad block tracking ensure >5 years of daily configuration updates without failure. |
Use Scenario: Capturing vehicle CAN bus diagnostics and GPS logs in telematics control units with limited power budget between ignition cycles. IC Role / Device Role / Timing Role: Low-power, high-throughput logging buffer supporting burst writes during drive sessions and background wear leveling. Use Value: 20 µA standby current minimizes battery drain; concurrent die operations allow logging to continue during background ECC scrubbing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NAND flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25M02GVSIQ | Same die and architecture, but in 16-pin SOIC 300-mil (SF) package - larger footprint, no thermal pad, higher inductance leads | Suitable for prototyping, legacy board reuse, or manual assembly where TFBGA reflow is unavailable | Select W25M02GVSIQ only when SOIC hand-soldering or socket-based validation is required; not recommended for high-volume, space-constrained designs. |
| MT29F2G01ABAGDWB-IT:F | 2 G-bit SLC NAND with ONFI 2.3 interface - parallel asynchronous bus, not SPI; requires dedicated NAND controller | Used in high-throughput embedded Linux systems with NAND-aware SoCs (e.g., i.MX6, AM335x), not SPI-only MCUs | Choose MT29F2G01ABAGDWB-IT:F only if host processor includes native NAND controller and bandwidth exceeds SPI limits; incompatible with standard SPI peripherals. |
Compared with W25M02GVTCIT, W25M02GVSIQ offers identical functionality in a through-hole-compatible package but sacrifices density and thermal performance, while MT29F2G01ABAGDWB-IT:F provides higher raw bandwidth at the cost of controller complexity and PCB routing overhead - making W25M02GVTCIT optimal for SPI-native, size-sensitive, and low-power embedded storage.
Availability
W25M02GVTCIT is available at Aetrix Electronics and suitable for industrial HMI boot storage, medical device firmware vaults, and edge gateway configuration databases requiring stable component supply, long-term lifecycle assurance, and guaranteed TFBGA package consistency.
Supply support for W25M02GVTCIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR/NAND flash, RAM, and trusted computing ICs since 1987.
The W25M series belongs to Winbond's SpiStack® family of serial MCP NAND flash devices, designed specifically to deliver high-density, low-pin-count, concurrent-operation storage for resource-constrained microcontroller-based systems.
FAQ
What is the function of the /HOLD pin on the W25M02GVTCIT?
The /HOLD pin on the W25M02GVTCIT serves as both a hardware hold input and Quad SPI I/O3 signal. When asserted low, it pauses an ongoing serial transfer without deselecting the device or resetting internal state - preserving command context and reducing transaction overhead. In Quad SPI mode, it functions as bidirectional IO3. Its dual role is enabled by configuration bits in Status Register-2 and requires proper mode initialization before use. The W25M02GVTCIT datasheet specifies /HOLD timing relative to CLK edges and defines setup/hold requirements for reliable operation.
Does the W25M02GVTCIT support 4-byte addressing, and how is it enabled?
Yes, the W25M02GVTCIT supports 4-byte addressing for accessing its full 256 MB address space, using instructions like Fast Read Quad I/O with 4-Byte Address (ECh). It is enabled by setting the 4-byte address mode bit (bit 7 of Status Register-2) via Write Status Register instruction (1Fh). Once set, all subsequent read/program/erase commands use 32-bit addresses. The W25M02GVTCIT defaults to 3-byte mode at power-up, so explicit configuration is required before issuing 4-byte-addressed commands.
How does the W25M02GVTCIT handle bad blocks, and can users manage them?
The W25M02GVTCIT implements factory-initialized bad block management using a Look-Up Table (LUT) stored in dedicated memory. Users can read the LUT via instruction A5h and manage additional bad blocks using Bad Block Management (A1h) instruction. The W25M02GVTCIT reports cumulative ECC status and program/erase failures in Status Register-3, enabling host firmware to trigger remapping or alert maintenance routines. This LUT-based approach eliminates need for external bad block tables and simplifies integration in bare-metal or RTOS environments.
What is the difference between Buffer Read Mode and Continuous Read Mode in the W25M02GVTCIT?
Buffer Read Mode requires issuing a Page Data Read (13h) instruction before each 2 KB page access, limiting sequential throughput. Continuous Read Mode allows a single Read Data (03h or 6Bh) command to stream data linearly across the entire memory array without intermediate page commands - ideal for boot code shadowing. The mode is selected by the BUF bit (bit 0 of Status Register-2) in the W25M02GVTCIT, and affects only Read instruction behavior; all other commands remain identical regardless of mode.
Can the W25M02GVTCIT be used with standard SPI controllers that do not support dual or quad modes?
Yes, the W25M02GVTCIT is fully backward-compatible with standard SPI controllers using only DI, DO, /CS, and CLK pins. It executes all standard SPI instructions (e.g., Read Data 03h, Fast Read 0Bh) without requiring dual or quad mode enablement. The W25M02GVTCIT automatically detects instruction opcodes and configures internal I/O paths accordingly - no mode register setup is needed for basic operation. Dual/Quad modes are optional enhancements activated only when faster throughput is required and supported by the host controller.
W25M02GVTCIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 700µs
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TFBGA (8x6)
W25M02GVTCIT FAQ
1.How can I place an order for W25M02GVTCIT through Aetrix?
Please submit a Request for Quotation (RFQ) for W25M02GVTCIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25M02GVTCIT reliable?
The price and inventory of W25M02GVTCIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25M02GVTCIT is usually 5 days.
3.What payment methods are accepted for W25M02GVTCIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25M02GVTCIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25M02GVTCIT?
W25M02GVTCIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25M02GVTCIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25M02GVTCIT?
For technical support, including W25M02GVTCIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25M02GVTCIT requirements.
6.How does Aetrix verify that W25M02GVTCIT is sourced from the original manufacturer or authorized distributors?
All W25M02GVTCIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25M02GVTCIT meets industry standards.
7.What is the process for return or replacement of W25M02GVTCIT?
All W25M02GVTCIT units undergo pre-shipment inspection (PSI). If there is an issue with W25M02GVTCIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25M02GVTCIT part is unused and in its original packaging.
Return procedure for W25M02GVTCIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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