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Winbond Electronics Corporation W25M02GVZEIG
- Part No.:
- W25M02GVZEIG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25M02GVZEIG.pdf
- Description:
- IC FLASH 2GBIT SPI/QUAD 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:1,729
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Product details
Overview
W25M02GVZEIG from Winbond is a 2G-bit (2 × 1G-bit) Serial SLC NAND Flash MCP built with two stacked W25N01GV dies in an 8-pad WSON 8×6-mm package, supporting Dual/Quad SPI up to 104 MHz, Continuous Read Mode for full-array access, and concurrent die operations including Read-While-Program/Erase. It delivers 50 MB/s continuous data transfer and supports on-chip 1-bit ECC, bad block management, and 100,000 program/erase cycles - deployed in embedded boot code storage and firmware update buffers.
For engineers reviewing the W25M02GVZEIG datasheet, W25M02GVZEIG pinout, W25M02GVZEIG application, or W25M02GVZEIG equivalent, this page provides verified pin functions, real-world timing behavior under Dual/Quad I/O modes, confirmed concurrent operation constraints, and validated alternative part selection guidance based on package, density, and instruction-set compatibility.
Technical Context
The W25M02GVZEIG implements SpiStack® architecture with two independent W25N01GV dies sharing one SPI interface, controlled via Software Die Select (C2h) instruction and factory-assigned Die ID. Only one die is active at any time to prevent bus contention, enabling isolated die-level erase/program while the other remains accessible for read.
It supports three operational modes: Standard SPI (DI/DO), Dual SPI (IO0/IO1), and Quad SPI (IO0–IO3), with /WP and /HOLD repurposed as IO2/IO3 in Quad mode. Continuous Read Mode eliminates per-page "Page Data Read" commands, allowing direct linear access across the full 256M-byte address space using Fast Read Quad I/O (6Bh/6Ch) or Dual I/O (3Bh/3Ch) instructions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 G-bit (2 × 1G-bit) = 256 M-byte total capacity, split across two independent 128 M-byte SLC NAND dies |
| Interface Speed | 104 MHz SPI clock; enables 208 MHz effective rate in Dual I/O and 416 MHz in Quad I/O modes |
| Data Transfer Rate | 50 MB/s sustained continuous read throughput in Quad I/O mode with 4-byte addressing |
| Erase/Program Endurance | ≥100,000 program/erase cycles per block, validated with on-chip 1-bit ECC correction (1 bit/528 byte) |
| Data Retention | 10 years at +85°C, guaranteed under JEDEC JESD22-A117 stress conditions |
| Operating Voltage | 2.7 V to 3.6 V single supply; supports stable operation across industrial temperature range (−40°C to +85°C) |
| Package | 8-pad WSON 8×6-mm (JEDEC MO-252, package code ZE), lead-free and RoHS-compliant |
Pinout & Package
W25M02GVZEIG uses an 8-pad WSON 8×6-mm package (package code ZE), surface-mount, exposed pad not electrically connected. Pin 1 is marked by a beveled corner; pads are arranged in a single row on two sides.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CS | Chip Select Input | Active-low enable: high = device deselected (high-Z outputs, standby current); low = device selected and responsive to SPI commands |
| DO (IO1) | Serial Data Output / Bidirectional I/O1 | Standard SPI output (DO); Dual/Quad SPI bidirectional data line 1 - used for read data and command/address input |
| /WP (IO2) | Write Protect Input / Bidirectional I/O2 | In Standard/Dual SPI: hardware write-protect control (active-low); in Quad SPI: repurposed as IO2 for command/data I/O |
| GND | Ground Reference | Primary signal and power return path; must be low-impedance connection to system ground plane |
| DI (IO0) | Serial Data Input / Bidirectional I/O0 | Standard SPI input (DI); Dual/Quad SPI bidirectional data line 0 - used for all instruction, address, and program data input |
| CLK | Serial Clock Input | Master-controlled clock input; rising edge latches input data (DI/IO0–IO3), falling edge samples output data (DO/IO0–IO3) |
| /HOLD (IO3) | Hold Input / Bidirectional I/O3 | In Standard/Dual SPI: suspends ongoing serial transfer (active-low); in Quad SPI: repurposed as IO3 for command/data I/O |
| VCC | Power Supply | 2.7–3.6 V nominal supply; requires local 1 µF ceramic decoupling capacitor placed within 3 mm of VCC/GND pads |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent Operations | Enables simultaneous die-level operations: e.g., Program/Erase on Die #0 while reading from Die #1 - improves firmware update throughput by eliminating sequential wait states |
| Continuous Read Mode | Single Fast Read command accesses entire memory array without issuing repeated Page Data Read instructions - reduces CPU overhead in boot code shadowing |
| Software Die Select (C2h) | 8-bit Die ID following C2h instruction selects active die; allows deterministic partitioning of firmware image (e.g., active/inactive bank) without hardware reconfiguration |
| On-Chip 1-Bit ECC | Hardware-accelerated error correction over full memory array; ECC status bits (ECC-1/ECC-0 in SR-3) report correction events without host software intervention |
| Flexible Write Protection | Combines volatile Block Protect bits (BP3–BP0), OTP-lockable SRP bits, and hardware /WP pin control - supports hierarchical protection of bootloader, parameter, and user sectors |
Applications
| Embedded Boot Storage | Firmware Over-the-Air (OTA) Update Buffer |
|---|---|
|
Use Scenario: Storing compressed bootloader and kernel images for microcontroller-based edge devices with limited external memory. IC Role / Device Role / Timing Role: Primary non-volatile code storage accessed during cold boot; supports fast Continuous Read Mode for low-latency shadowing into RAM. Use Value: Eliminates need for external parallel NOR flash; 50 MB/s read rate ensures sub-100 ms boot time for 2 MB firmware images. |
Use Scenario: Holding staged firmware updates in dual-bank configuration prior to validation and atomic swap. IC Role / Device Role / Timing Role: Concurrent Operations allow background download (to Die #1) while running current firmware (from Die #0), minimizing system downtime. Use Value: Enables zero-downtime field updates - critical for medical and industrial controllers where reboot windows are prohibited. |
| Industrial HMI Display Memory | Smart Meter Firmware Vault |
|
Use Scenario: Storing GUI assets (fonts, icons, splash screens) and localized language packs for touch-based HMIs. IC Role / Device Role / Timing Role: High-density NAND storage with Quad SPI interface delivers burst bandwidth needed for rapid screen refreshes and asset streaming. Use Value: 256 M-byte capacity accommodates >50 localized UI sets; 10-year data retention meets IEC 62056 smart meter lifetime requirements. |
Use Scenario: Secure storage of metrology firmware, calibration constants, and cryptographic keys in utility-grade smart meters. IC Role / Device Role / Timing Role: OTP pages (10 × 2 KB) store immutable calibration data; hardware /WP pin prevents accidental overwrite during field servicing. Use Value: Meets ANSI C12.22 and DLMS/COSEM security mandates via write-protection hierarchy spanning SRP bits, BP bits, and physical pin control. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NAND flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25M02GVSIQ | Same die, SOIC 300-mil (16-pin) package; larger footprint, through-hole compatible; no /WP or /HOLD dedicated pins - both repurposed as NC | Used where board reworkability or legacy SOIC socket compatibility is required; unsuitable for space-constrained designs needing WSON thermal performance | Select W25M02GVSIQ only when PCB layout cannot accommodate WSON thermal pad or requires manual assembly support. |
| MT29F2G08ABAEAH4 | 2 G-bit SLC NAND from Micron; parallel interface (x8), not SPI; requires external controller for ECC, BBM, and wear leveling | Demands full NAND controller stack (e.g., Linux MTD/NAND layer); incompatible with SPI-native MCU boot ROMs | Choose MT29F2G08ABAEAH4 only when existing system already implements NAND controller logic and requires higher raw bandwidth than SPI can deliver. |
Compared with W25M02GVZEIG, W25M02GVSIQ trades compactness for assembly flexibility but loses /WP and /HOLD functionality, while MT29F2G08ABAEAH4 shifts system complexity to software and external logic - making W25M02GVZEIG the only option delivering integrated SPI, ECC, BBM, and concurrent die control in a WSON footprint.
Availability
W25M02GVZEIG is available at Aetrix Electronics and suitable for embedded boot storage, OTA firmware buffering, and industrial HMI display memory requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production lots.
Supply support for W25M02GVZEIG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty DRAM, mobile DRAM, Code Storage Flash, and TrustME® secure flash solutions since 1987.
The W25M series belongs to Winbond's SpiFlash® MCP product line, designed specifically to bring high-density SLC NAND functionality to SPI-native microcontrollers without requiring external NAND controllers or complex driver stacks.
FAQ
What is the exact memory organization of W25M02GVZEIG?
W25M02GVZEIG contains two independent 1G-bit (128M-byte) SLC NAND dies stacked in one package, each organized as 1,024 blocks × 64 pages × 2,048 bytes per page. Total usable capacity is 256M bytes. Block size is uniform 128KB; no sector or sub-block erase is supported - only full-block erase (D8h instruction) is valid.
Does W25M02GVZEIG support true Quad SPI with all four I/O lines active simultaneously during both read and write?
Yes, W25M02GVZEIG supports full Quad SPI operation: IO0–IO3 are all active for both command/address input and data I/O during Fast Read Quad I/O (EBh/ECh) and Quad Load Program Data (32h/34h) instructions. /WP and /HOLD are reassigned as IO2 and IO3 in Quad mode, and their hardware protection functions are disabled - protection must be managed via Status Register bits.
How does the Software Die Select (C2h) instruction work in W25M02GVZEIG?
W25M02GVZEIG responds to the C2h instruction followed by an 8-bit Die ID byte: Die ID 0x00 selects the first die (Die #0), and 0x01 selects the second die (Die #1). After selection, only the targeted die executes subsequent commands; the other remains idle. Die #0 is always active after power-up or Device Reset (FFh).
Can W25M02GVZEIG operate without external ECC handling in the host MCU?
Yes, W25M02GVZEIG includes on-chip 1-bit ECC that automatically corrects single-bit errors during read operations. The ECC Enable bit (ECC-E) in Configuration Register (SR-2) must be set to '1'. Correction status is reported in Status Register-3 (ECC-1/ECC-0 bits), eliminating need for host-side ECC calculation in most applications.
What is the role of the Unique ID and OTP pages in W25M02GVZEIG?
W25M02GVZEIG includes one 2KB Unique ID page (factory-programmed, read-only), one 2KB parameter page (user-writable, stores device-specific configuration), and ten 2KB OTP pages (one-time programmable, used for calibration data or secure keys). All are accessed via dedicated instructions (A9h, A1h, etc.) when OTP-E=1 in SR-2.
W25M02GVZEIG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 700µs
- Access Time:
- 7 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (8x6)
W25M02GVZEIG FAQ
1.How can I place an order for W25M02GVZEIG through Aetrix?
Please submit a Request for Quotation (RFQ) for W25M02GVZEIG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25M02GVZEIG reliable?
The price and inventory of W25M02GVZEIG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25M02GVZEIG is usually 5 days.
3.What payment methods are accepted for W25M02GVZEIG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25M02GVZEIG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25M02GVZEIG?
W25M02GVZEIG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25M02GVZEIG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25M02GVZEIG?
For technical support, including W25M02GVZEIG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25M02GVZEIG requirements.
6.How does Aetrix verify that W25M02GVZEIG is sourced from the original manufacturer or authorized distributors?
All W25M02GVZEIG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25M02GVZEIG meets industry standards.
7.What is the process for return or replacement of W25M02GVZEIG?
All W25M02GVZEIG units undergo pre-shipment inspection (PSI). If there is an issue with W25M02GVZEIG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25M02GVZEIG part is unused and in its original packaging.
Return procedure for W25M02GVZEIG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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