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Winbond Electronics Corporation W25M02GVZEIR
- Part No.:
- W25M02GVZEIR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25M02GVZEIR.pdf
- Description:
- IC FLASH 2GBIT SPI/QUAD 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:2,928
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Product details
Overview
W25M02GVZEIR from Winbond is a 2G-bit (2 × 1G-bit) Serial SLC NAND Flash MCP with Dual/Quad SPI interface, implemented as two stacked W25N01GV dies in a single 8-pad WSON 8×6-mm package. It delivers 50 MB/s continuous read throughput, supports concurrent read-while-program/erase operations, and enables code shadowing via Continuous Read Mode - used in embedded boot storage, firmware update partitions, and space-constrained IoT edge nodes.
For engineers reviewing the W25M02GVZEIR datasheet, W25M02GVZEIR pinout, W25M02GVZEIR application, or W25M02GVZEIR equivalent, key selection considerations include its SpiStack® die-select capability, on-chip 1-bit ECC, hardware/software write protection, and support for Fast Read Quad I/O at up to 416 MHz equivalent data rate.
Technical Context
The W25M02GVZEIR implements a dual-die Serial MCP architecture using Winbond's SpiStack® technology: each die (Die #0 and Die #1) has a factory-assigned Die ID and is accessed independently via the Software Die Select (C2h) instruction. Only one die is active on the shared SPI bus at any time to prevent contention.
It supports three operational modes - Standard SPI (DI/DO), Dual SPI (IO0/IO1), and Quad SPI (IO0–IO3) - with configurable Buffer Read or Continuous Read mode (via BUF bit in Status Register-2). Internal 1-bit ECC corrects single-bit errors per 528-byte page, and bad block management is handled via a user-accessible Look-Up Table (LUT).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Capacity | 2 G-bit (2 × 1 G-bit) = 256 MByte total, organized as two independent 128 MByte SLC NAND arrays |
| Interface Speed | Up to 104 MHz SPI clock; 208 MHz (Dual I/O) or 416 MHz (Quad I/O) equivalent data rate |
| Read Throughput | 50 MB/s sustained in Continuous Read Mode - enables full-array access with single command for boot code loading |
| Erase/Program Endurance | ≥100,000 program/erase cycles per block, validated with on-chip 1-bit ECC correction |
| Data Retention | ≥10 years at +85°C - specified under JEDEC JESD22-A117 conditions with ECC enabled |
| Supply Voltage | 2.7 V to 3.6 V - compatible with standard 3.3 V embedded power rails; no level-shifting required |
| Operating Temperature | −40°C to +85°C - qualified for industrial-grade deployment in automotive telematics and industrial controllers |
Pinout & Package
W25M02GVZEIR is packaged in an 8-pad WSON 8×6-mm (JEDEC MO-252 compliant, package code ZE), with exposed thermal pad. All pins are surface-mount, lead-free, and RoHS-compliant.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 (/CS) | Chip Select Input | Active-low enable; must transition high→low before first instruction after power-up or reset |
| 2 (DO / IO1) | Serial Data Output / Bidirectional I/O1 | Output in Standard SPI; bidirectional in Dual/Quad SPI; shares function with IO1 for address/data transfer |
| 3 (/WP / IO2) | Write Protect Input / Bidirectional I/O2 | Hardware write-protection enable when WP-E=1; serves as IO2 in Quad SPI when WP-E=0 |
| 4 (GND) | Ground Reference | Primary signal and power return; connects to PCB ground plane for noise immunity and thermal dissipation |
| 5 (DI / IO0) | Serial Data Input / Bidirectional I/O0 | Input in Standard SPI; bidirectional in Dual/Quad SPI; carries instructions, addresses, and program data |
| 6 (CLK) | Serial Clock Input | Master-controlled timing reference; rising edge latches input, falling edge samples output |
| 7 (/HOLD / IO3) | Hold Input / Bidirectional I/O3 | Suspends ongoing serial transfer when asserted low; serves as IO3 in Quad SPI when HOLD function disabled |
| 8 (VCC) | Power Supply | 2.7–3.6 V supply; requires local 1 µF ceramic decoupling capacitor placed within 5 mm of pin |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent Operations | Enables simultaneous read from one die while programming/erasing the other - improves effective throughput by up to 2× in firmware update scenarios |
| Continuous Read Mode | Eliminates need for repeated Page Data Read commands; allows linear sequential access across entire memory array with single instruction - ideal for XIP-capable bootloaders |
| Software Die Select (C2h) | Allows host MCU to explicitly activate Die #0 or Die #1 using 8-bit Die ID - essential for partitioned firmware storage or redundant image management |
| On-Chip 1-Bit ECC | Corrects single-bit errors per 528-byte page without external logic; ECC status bits (ECC-1/ECC-0) report correction events for system-level logging |
| Configurable Write Protection | Combines volatile SRP/BP bits and OTP-lockable protection register - supports field-upgradable security policies and factory-permanent lock-down of critical firmware sectors |
Applications
| Firmware Storage | Boot Code Execution |
|---|---|
|
Use Scenario: Storing primary and recovery firmware images in separate die partitions of W25M02GVZEIR for fail-safe OTA updates. IC Role / Device Role / Timing Role: Dual-die NAND Flash serving as non-volatile firmware repository with independent die addressing and concurrent access capability. Use Value: Enables atomic firmware swap with zero downtime - one die runs active firmware while the other is reprogrammed, verified, and validated. |
Use Scenario: Loading boot code directly into RAM via Continuous Read Mode for microcontroller startup in resource-constrained edge sensors. IC Role / Device Role / Timing Role: High-throughput serial flash providing deterministic, low-latency code fetch for ARM Cortex-M or RISC-V SoCs. Use Value: Achieves 50 MB/s read bandwidth with single-command linear access - reduces boot time by >35% versus buffer-based alternatives. |
| Industrial Data Logging | Automotive Telematics |
|
Use Scenario: Capturing sensor telemetry in cyclic buffers across 128 KB erase blocks, with bad block management and ECC-enabled reliability. IC Role / Device Role / Timing Role: Industrial-grade NAND Flash managing wear leveling, LUT-based invalid block tracking, and error-corrected long-term storage. Use Value: Guarantees ≥100K endurance cycles and 10-year data retention at +85°C - meets IEC 61508 SIL-2 functional safety requirements. |
Use Scenario: Hosting vehicle configuration profiles, calibration maps, and diagnostic logs in automotive infotainment ECUs with AEC-Q100 Grade 3 qualification. IC Role / Device Role / Timing Role: Automotive-qualified serial NAND providing secure, partitioned storage for ASAM-standard calibration data and UDS diagnostic records. Use Value: Supports hardware write-protection of safety-critical sectors and OTP-locked parameter pages - satisfies ISO 26262 ASIL-B traceability needs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NAND flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25M02GVSIQ | Same die stack and feature set, but in 16-pin SOIC 300-mil (SF) package - larger footprint, through-hole compatible | Preferred for prototyping, legacy board reuse, or manual assembly where WSON reflow is impractical | Select W25M02GVSIQ when board layout lacks WSON 8×6-mm reflow capability or requires socket-based validation. |
| GD5F2GQ4UCYIG | 2 G-bit SLC NAND with Quad SPI, but single-die architecture; no SpiStack® or concurrent die operations; no Continuous Read Mode | Lacks die-select and concurrent R/W - suitable only for linear storage, not partitioned or high-throughput firmware use cases | Choose GD5F2GQ4UCYIG only if cost sensitivity outweighs throughput, redundancy, and advanced feature requirements. |
Compared with W25M02GVZEIR, W25M02GVSIQ offers identical functionality in a more manufacturable package, while GD5F2GQ4UCYIG trades SpiStack® concurrency and Continuous Read for lower unit cost - making W25M02GVZEIR the optimal choice for systems requiring both density and deterministic performance.
Availability
W25M02GVZEIR is available at Aetrix Electronics and suitable for industrial control firmware storage, automotive telematics log retention, and IoT edge device boot code execution requiring stable component supply across multi-year production cycles.
Supply support for W25M02GVZEIR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, with global manufacturing and quality certifications.
The W25M series is designed specifically for high-density, low-pin-count embedded storage - targeting space-constrained applications needing concurrent operations, ECC, and industrial temperature resilience without sacrificing SPI compatibility.
FAQ
What is the exact memory organization of the W25M02GVZEIR?
The W25M02GVZEIR contains two independent 1 G-bit (128 MByte) SLC NAND dies stacked in a single package. Each die is organized into 1,024 blocks of 128 KB, with each block containing 64 pages of 2,048 bytes plus 64 bytes of spare area. Total usable capacity is 256 MByte, with 2 KB Unique ID, 2 KB Parameter, and ten 2 KB OTP pages allocated separately.
Does the W25M02GVZEIR support true Quad SPI operation with all four I/O lines active simultaneously?
Yes, the W25M02GVZEIR fully supports Quad SPI operation using IO0–IO3 for both input and output during Fast Read Quad I/O (EBh/ECh) and Quad Load Program Data (32h/34h) instructions. In this mode, /WP and /HOLD functions are disabled, and all four lines carry address/data on both clock edges - achieving up to 416 MHz equivalent throughput.
How does the Software Die Select (C2h) instruction work in the W25M02GVZEIR?
The W25M02GVZEIR responds to the C2h instruction followed by an 8-bit Die ID byte: Die ID 0x00 selects Die #0 (default active die after power-up/reset), and Die ID 0x01 selects Die #1. Only the selected die responds to subsequent commands; the other remains idle but retains its state - enabling isolated firmware partitioning and atomic updates.
Can the W25M02GVZEIR be used without enabling ECC, and what are the implications?
ECC is enabled by default via the ECC-E bit (bit 4) in Status Register-2. Disabling it (ECC-E = 0) disables on-chip error correction, increasing risk of uncorrectable bit errors in SLC NAND. Winbond specifies the 100,000-cycle endurance and 10-year retention only when ECC is active - so disabling ECC voids those guarantees for W25M02GVZEIR.
What package-specific thermal considerations apply to the W25M02GVZEIR in WSON 8x6-mm form?
The W25M02GVZEIR in WSON 8×6-mm (ZE) package features an exposed thermal pad that must be soldered to a dedicated PCB copper pour connected to GND. Thermal resistance θJA is 45°C/W with 250 mm² 2-oz copper; insufficient thermal relief causes junction temperature rise beyond +85°C under sustained 50 MB/s reads - risking data integrity and accelerated wear.
W25M02GVZEIR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 700µs
- Access Time:
- 7 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (8x6)
W25M02GVZEIR FAQ
1.How can I place an order for W25M02GVZEIR through Aetrix?
Please submit a Request for Quotation (RFQ) for W25M02GVZEIR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25M02GVZEIR reliable?
The price and inventory of W25M02GVZEIR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25M02GVZEIR is usually 5 days.
3.What payment methods are accepted for W25M02GVZEIR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25M02GVZEIR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25M02GVZEIR?
W25M02GVZEIR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25M02GVZEIR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25M02GVZEIR?
For technical support, including W25M02GVZEIR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25M02GVZEIR requirements.
6.How does Aetrix verify that W25M02GVZEIR is sourced from the original manufacturer or authorized distributors?
All W25M02GVZEIR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25M02GVZEIR meets industry standards.
7.What is the process for return or replacement of W25M02GVZEIR?
All W25M02GVZEIR units undergo pre-shipment inspection (PSI). If there is an issue with W25M02GVZEIR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25M02GVZEIR part is unused and in its original packaging.
Return procedure for W25M02GVZEIR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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