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Winbond Electronics Corporation W25M02GVZEIT
- Part No.:
- W25M02GVZEIT
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
W25M02GVZEIT.pdf
- Description:
- IC FLASH 2GBIT SPI/QUAD 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:1,021
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Product details
Overview
W25M02GVZEIT from Winbond is a 2G-bit (2 × 1G-bit) Serial SLC NAND Flash MCP with dual/quad SPI interface, implemented as two stacked W25N01GV dies in a single 8-pad WSON 8×6-mm package. It delivers 104 MHz SPI clock support, 50 MB/s continuous read throughput, and concurrent read-while-program/erase capability for high-throughput embedded storage. Used in space-constrained boot code storage and firmware update buffers.
For engineers reviewing the W25M02GVZEIT datasheet, W25M02GVZEIT pinout, W25M02GVZEIT application, or W25M02GVZEIT equivalent, key selection criteria include dual-die concurrency support, hardware/software write protection flexibility, 128KB uniform block erase granularity, on-chip 1-bit ECC, and JEDEC-compliant ID/OTP page access.
Technical Context
The W25M02GVZEIT implements SpiStack® architecture: two independent W25N01GV SLC NAND dies share a single SPI bus via Software Die Select (C2h) instruction and factory-assigned Die ID#s. Only one die is active at any time to prevent bus contention, enabling die-isolated operations including simultaneous program/erase across dies when sequenced.
It supports three operational modes-Standard SPI (DI/DO), Dual SPI (IO0/IO1), and Quad SPI (IO0–IO3)-with mode-selectable Continuous Read (single command, full-array access) or Buffer Read (page-by-page). Internal 1-bit ECC corrects single-bit errors per 528-byte sector, and status registers (SR-1/SR-2/SR-3) provide volatile/OTP-configurable protection, ECC enable, and real-time BUSY/P-FAIL/E-FAIL monitoring.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Capacity | 2 G-bit (2 × 1 G-bit) = 256 M-byte total, organized as two independent 128 M-byte SLC NAND arrays |
| SPI Clock Frequency | Up to 104 MHz - enables 208 MHz (Dual I/O) or 416 MHz (Quad I/O) effective data rates |
| Continuous Read Throughput | 50 MB/s - achieved via single-command sequential access across entire memory array |
| Erase/Program Endurance | 100,000 cycles - specified with on-chip 1-bit ECC enabled (1 bit correction per 528-byte sector) |
| Data Retention | 10 years at +85°C - guaranteed minimum retention under worst-case operating temperature |
| Operating Voltage | 2.7 V to 3.6 V - single-supply operation compatible with standard 3.3 V embedded power rails |
| Temperature Range | −40°C to +85°C - industrial-grade qualification suitable for automotive infotainment and industrial control |
Pinout & Package
W25M02GVZEIT is packaged in an 8-pad WSON 8×6-mm (JEDEC MO-252 compliant, package code ZE), with exposed thermal pad. Pin 1 is /CS; pins 2–3–5–7 are bidirectional I/Os (IO1, IO2, IO0, IO3); pin 4 is GND; pin 6 is CLK; pin 8 is VCC. /WP and /HOLD serve dual roles: dedicated control inputs in Standard/Dual SPI, and IO2/IO3 in Quad SPI.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 (/CS) | Chip Select Input | Active-low enable: device enters active state only when /CS transitions low; high-impedance DO/IOs when high |
| 2 (DO / IO1) | Data Output / I/O1 | Unidirectional output in Standard SPI; bidirectional in Dual/Quad SPI; used for status/data reads |
| 3 (/WP / IO2) | Write Protect Input / I/O2 | Hardware write protect for SR-1 when WP-E=1; functions as IO2 in Quad SPI when WP-E=0 |
| 4 (GND) | Ground Reference | Primary return path for VCC and all I/O signals; must be low-inductance connection for timing integrity |
| 5 (DI / IO0) | Data Input / I/O0 | Unidirectional input in Standard SPI; bidirectional in Dual/Quad SPI; carries instructions, addresses, data |
| 6 (CLK) | Serial Clock Input | Master-controlled edge-triggered clock; rising edge for input, falling edge for output in all SPI modes |
| 7 (/HOLD / IO3) | Hold Input / I/O3 | Suspends ongoing serial transfer without deselecting device; serves as IO3 in Quad SPI when HOLD disabled |
| 8 (VCC) | Power Supply | 2.7–3.6 V supply; requires local 1 µF + 0.1 µF decoupling near pin for stable high-speed operation |
Key Features
| Feature | Design Value |
|---|---|
| Software Die Select (C2h) | Enables independent addressing of each stacked die using factory-assigned 8-bit Die ID#, eliminating need for separate chip selects |
| Concurrent Operations | Allows interleaved or overlapping Program/Erase on one die while reading from the other - increases effective throughput by up to 2× |
| Continuous Read Mode | Single READ command accesses full memory array sequentially - eliminates repeated Page Data Read overhead for code shadowing |
| Configurable ECC & Bad Block Management | User-enabled 1-bit ECC per 528-byte sector; LUT-based bad block tracking accessible via A5h instruction for robust NAND management |
| Flexible Write Protection | Combines software (BP[3:0], SRP[1:0]) and hardware (/WP pin) protection; OTP-lockable registers prevent accidental reconfiguration |
Applications
| Boot Code Storage | Firmware Update Buffer |
|---|---|
|
Use Scenario: Storing primary bootloader and secure firmware images in resource-constrained microcontroller-based systems. IC Role / Device Role / Timing Role: Non-volatile storage for XIP-capable boot code; accessed via Continuous Read Mode for fast linear fetch. Use Value: 50 MB/s read speed reduces boot latency; 10-year data retention ensures field reliability without refresh. |
Use Scenario: Holding validated firmware updates prior to atomic flash programming in IoT gateways and edge devices. IC Role / Device Role / Timing Role: High-endurance buffer memory supporting concurrent download (to one die) and verification (from other die). Use Value: Concurrent Operations allow background download while system remains responsive; 100K-cycle endurance supports frequent OTA cycles. |
| Industrial HMI Display Cache | Automotive Infotainment UI Assets |
|
Use Scenario: Caching graphical assets (icons, fonts, UI bitmaps) for human-machine interface panels in factory automation. IC Role / Device Role / Timing Role: Low-pin-count external memory supplementing MCU internal flash; accessed via Quad SPI for bandwidth-critical rendering. Use Value: 416 MHz effective Quad I/O rate delivers >40 MB/s burst reads; −40°C to +85°C rating ensures operation in uncontrolled environments. |
Use Scenario: Storing localized UI language packs and theme assets in automotive head units requiring AEC-Q100 alignment. IC Role / Device Role / Timing Role: Automotive-qualified serial NAND providing scalable, cost-effective storage for multi-region UI content. Use Value: On-chip 1-bit ECC and OTP-protected configuration registers meet functional safety requirements for non-safety-critical UI layers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NAND flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W25M02GVSIQ | Same die stack and feature set; differs only in SOIC 300-mil (SF) package (16-pin) vs. WSON (ZE) | Requires PCB layout change: larger footprint, through-hole or gull-wing assembly; no thermal pad | Select W25M02GVSIQ only when legacy SOIC footprint compatibility or manual reworkability is required. |
| MT29F2G08ABAEAH4-IT:E | 2 G-bit SLC NAND with ONFI 2.3 interface (parallel x8), not SPI; requires controller with NAND interface logic and ECC engine | Not drop-in replaceable: needs NAND controller, external ECC, and different command protocol; higher pin count | Choose MT29F2G08ABAEAH4-IT:E only when migrating to parallel NAND architecture with dedicated controller support. |
Compared with W25M02GVZEIT, W25M02GVSIQ offers identical functionality in a larger SOIC package - suitable for prototyping or legacy board reuse - while MT29F2G08ABAEAH4-IT:E demands full NAND subsystem redesign but provides higher raw bandwidth and mature controller ecosystem support.
Availability
W25M02GVZEIT is available at Aetrix Electronics and suitable for boot code storage, firmware update buffering, industrial HMI display caching, and automotive infotainment UI asset storage requiring stable component supply across extended product lifecycles.
Supply support for W25M02GVZEIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including SPI NOR/NAND flash, RAM, and trusted computing ICs since 1987.
The W25M series belongs to Winbond's SpiStack® Serial MCP product line, designed specifically to deliver high-density NAND flash in ultra-compact SPI packages for space-constrained embedded systems needing concurrent operations and simplified NAND management.
FAQ
What is the exact memory organization of the W25M02GVZEIT?
The W25M02GVZEIT contains two independent 1 G-bit (128 M-byte) SLC NAND dies stacked in a single package. Each die is organized into 1,024 blocks of 128 KB each, with 64 pages per block and 2,048 bytes per page. Total usable capacity is 256 M-byte, with 2 KB reserved for Unique ID and Parameter pages and ten 2 KB OTP pages.
Does the W25M02GVZEIT support true concurrent read-while-program/erase?
Yes - the W25M02GVZEIT supports true concurrent operations: one die can execute Program or Erase while the other die handles Read commands. This is enabled by the SpiStack® architecture and Software Die Select (C2h) instruction, allowing independent die control without bus contention. The feature is confirmed in Section 1 and Figure 2c of the datasheet.
How does the Continuous Read Mode differ from Buffer Read Mode in the W25M02GVZEIT?
In Continuous Read Mode (BUF=0), a single READ command accesses the entire memory array sequentially without requiring intermediate Page Data Read instructions. In Buffer Read Mode (BUF=1), each read access must be preceded by a Page Data Read command to load target page data into the internal buffer. Both modes use identical instruction sets except for the READ command structure.
What write protection mechanisms are available on the W25M02GVZEIT?
The W25M02GVZEIT provides layered write protection: software-based via Block Protect (BP3–BP0) and Status Register Protect (SRP1/SRP0) bits in SR-1; hardware-based via the /WP pin (when WP-E=1); and OTP-lockable registers (SRP0/SRP1, OTP-L, SR1-L). All protection settings persist across power cycles when locked.
Is the W25M02GVZEIT pin-compatible with other Winbond W25M-series parts?
W25M02GVZEIT is pin-compatible with other W25M02GV variants in the same WSON 8×6-mm (ZE) package, including W25M02GVZEIG and W25M02GVZEIR. Differences are limited to temperature grade (industrial vs. extended) and tape-and-reel packaging - electrical pinout, timing, and instruction set remain identical across ZE-code variants.
W25M02GVZEIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 700µs
- Access Time:
- 7 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (8x6)
W25M02GVZEIT FAQ
1.How can I place an order for W25M02GVZEIT through Aetrix?
Please submit a Request for Quotation (RFQ) for W25M02GVZEIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25M02GVZEIT reliable?
The price and inventory of W25M02GVZEIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25M02GVZEIT is usually 5 days.
3.What payment methods are accepted for W25M02GVZEIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25M02GVZEIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25M02GVZEIT?
W25M02GVZEIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25M02GVZEIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25M02GVZEIT?
For technical support, including W25M02GVZEIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25M02GVZEIT requirements.
6.How does Aetrix verify that W25M02GVZEIT is sourced from the original manufacturer or authorized distributors?
All W25M02GVZEIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25M02GVZEIT meets industry standards.
7.What is the process for return or replacement of W25M02GVZEIT?
All W25M02GVZEIT units undergo pre-shipment inspection (PSI). If there is an issue with W25M02GVZEIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25M02GVZEIT part is unused and in its original packaging.
Return procedure for W25M02GVZEIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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